Abstract: In an embodiment, a device includes: a first receiver configured to: detect a first synchronization sequence of a first packet in a first subcarrier of a plurality of subcarriers, and in response to detecting the first synchronization sequence, receive, using a single subcarrier of the plurality of subcarriers at a time, a rest of the first packet using a first hopping sequence hopping through subcarriers of the plurality of subcarriers; and a second receiver configured to: detect a second synchronization sequence of a second packet in a second subcarrier of the plurality of subcarriers, and in response to detecting the second synchronization sequence, receive, using a single subcarrier at a time, a rest of the second packet using a second hopping sequence hopping through subcarriers of the plurality of subcarriers.

Abstract: In an embodiment, a device includes: a first receiver configured to: detect a first synchronization sequence of a first packet in a first subcarrier of a plurality of subcarriers, and in response to detecting the first synchronization sequence, receive, using a single subcarrier of the plurality of subcarriers at a time, a rest of the first packet using a first hopping sequence hopping through subcarriers of the plurality of subcarriers; and a second receiver configured to: detect a second synchronization sequence of a second packet in multiple subcarriers of the plurality of subcarriers, and in response to detecting the second synchronization sequence, receive a rest of the second packet using multiple subcarriers at a time.

Abstract: A device includes: a receiver path; and a demodulator having an input coupled to an output of the receiver path; a first STF synchronization circuit coupled to the output of the receiver path and configure to: detect a first synchronization sequence of a first packet in a first subcarrier, and in response to detecting the first synchronization sequence, cause the demodulator to process a rest of the first packet, where the first packet is received by the receiver path using a single subcarrier at a time; and a second STF synchronization circuit coupled to the output of the receiver path and configure to: detect a second synchronization sequence of a second packet in a second subcarrier, and in response to detecting the second synchronization sequence, cause the demodulator to process a rest of the second packet, where the second packet is received using a single subcarrier at a time.

Abstract: In an embodiment, a method includes: transmitting, by a first device, a first synchronization sequence in a single synchronization channel of a plurality of channels; and after transmitting the first synchronization sequence, transmitting, by the first device, first data associated with the first synchronization sequence according to a hopping sequence using a single channel of the plurality of channels at a time.

Abstract: A method is provided. In some examples, the method includes generating, by processing circuitry, a spread of chips representing an input bit. In addition, the method includes converting, by the processing circuitry, the spread of chips to a plurality of symbols comprising a pair of symbols. The method also includes mapping, by the processing circuitry, the pair of symbols to a single carrier signal and generating, by the processing circuitry, a radio-frequency (RF) signal based on the single carrier signal. The method further includes transmitting, by the processing circuitry via an antenna, the RF signal.

Abstract: A method is provided. In some examples, the method includes generating, by processing circuitry, a spread of chips representing an input bit. In addition, the method includes converting, by the processing circuitry, the spread of chips to a plurality of symbols comprising a pair of symbols. The method also includes mapping, by the processing circuitry, the pair of symbols to a single carrier signal and generating, by the processing circuitry, a radio-frequency (RF) signal based on the single carrier signal. The method further includes transmitting, by the processing circuitry via an antenna, the RF signal.

Abstract: A method is provided. In some examples, the method includes generating, by processing circuitry, a spread of chips representing an input bit. In addition, the method includes converting, by the processing circuitry, the spread of chips to a plurality of symbols comprising a pair of symbols. The method also includes mapping, by the processing circuitry, the pair of symbols to a single carrier signal and generating, by the processing circuitry, a radio-frequency (RF) signal based on the single carrier signal. The method further includes transmitting, by the processing circuitry via an antenna, the RF signal.

Abstract: A material-discerning sensing device includes an antenna, a capacitive proximity sensor, and a control circuit. The antenna includes multiple conductive loops and is configured to radiate a wireless signal. The antenna defines an interior region devoid of the conductive loops and an exterior region outside the conductive loops. The capacitive proximity sensor includes a conductive pattern provided within the interior region or within a projection of the interior region, as well as a conductive bar. The control circuit is configured to detect a change in a characteristic of an electrical signal from the capacitive sensor. The conductive pattern includes a longitudinal portion, a first plurality of parallel conductors extending away from the longitudinal portion in a first direction and orthogonal to the longitudinal portion, and a second plurality of parallel conductors extending away from the longitudinal portion in a second direction opposite the first direction.

Abstract: A material-discerning sensing device includes an antenna, a capacitive proximity sensor, and a control circuit. The antenna includes multiple conductive loops and is configured to radiate a wireless signal. The antenna defines an interior region devoid of the conductive loops and an exterior region outside the conductive loops. The capacitive proximity sensor includes a conductive pattern provided within the interior region or within a projection of the interior region, as well as a conductive bar. The control circuit is configured to detect a change in a characteristic of an electrical signal from the capacitive sensor. The conductive pattern includes a longitudinal portion, a first plurality of parallel conductors extending away from the longitudinal portion in a first direction and orthogonal to the longitudinal portion, and a second plurality of parallel conductors extending away from the longitudinal portion in a second direction opposite the first direction.

Abstract: A material-discerning sensing device includes an antenna, a capacitive proximity sensor, and a control circuit. The antenna includes multiple conductive loops and is configured to radiate a wireless signal. The antenna defines an interior region devoid of the conductive loops and an exterior region outside the conductive loops. The capacitive proximity sensor includes a conductive pattern provided within the interior region or within a projection of the interior region, as well as a conductive bar. The control circuit is configured to detect a change in a characteristic of an electrical signal from the capacitive sensor. The conductive pattern includes a longitudinal portion, a first plurality of parallel conductors extending away from the longitudinal portion in a first direction and orthogonal to the longitudinal portion, and a second plurality of parallel conductors extending away from the longitudinal portion in a second direction opposite the first direction.

Abstract: A material-discerning sensing device includes an antenna, a capacitive proximity sensor, and a control circuit. The antenna includes multiple conductive loops and is configured to radiate a wireless signal. The antenna defines an interior region devoid of the conductive loops and an exterior region outside the conductive loops. The capacitive proximity sensor includes a conductive pattern provided within the interior region or within a projection of the interior region, as well as a conductive bar. The control circuit is configured to detect a change in a characteristic of an electrical signal from the capacitive sensor. The conductive pattern includes a longitudinal portion, a first plurality of parallel conductors extending away from the longitudinal portion in a first direction and orthogonal to the longitudinal portion, and a second plurality of parallel conductors extending away from the longitudinal portion in a second direction opposite the first direction.

Abstract: A novel and useful apparatus for and method of minimizing the phase distortions experienced at the output of a phase locked loop (PLL) by dithering of its input frequency reference to overcome additive interference that is parasitically suffered on it. The frequency reference signal is dithered in a controlled manner using either indirect or direct coupling. The dither signal may be a single clock or is generated by switching between two or more of the existing clock signals generated, or may be produced by a dedicated pseudo-random noise generator having specific spectral properties. In indirect coupling, the dither signal is coupled through a bond wire sufficiently close in proximity to the frequency reference circuit input. This dominates the jitter inflicted onto the frequency reference signal and upconverts its spectral content to higher frequency, thus eliminating the more damaging low-frequency jitter caused by the interfering RF signal.

Abstract: A method of manufacturing a circulator comprising the steps of providing a central substrate layer with at least one cut-out section and circuit lines. Next, providing a magnet placed within said cut-out section and a ferrite placed on each side of said substrate layer. A steel plate is placed on each side of the substrate layer. Spacer layers are provided on each side of the substrate layer. An outer shim layer is placed on each side of the central substrate layer. Laminate sheets are placed between the substrate layer, the spacer layers, and the outer shim layers. Holes are drilled through each of the substrate, the spacer layers, the outer shims, and the laminate sheets. Heat and pressure are provided to cause the laminate sheets to flow in order to join the substrate, magnets, ferrites, steel plates, spacer layers and outer shim layers into a unitary structure. Finally the structure is plated.