Patents by Inventor Thomas Anthony
Thomas Anthony has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12620486Abstract: Urgent screening in high-throughput, secure environments such as emergency rooms, or security, typically involves multiple devices. Devices that are used for screening are diverse, and typically sourced from multiple vendors. Currently, devices are typically stand-alone. Further, large devices, are costly, having high capital expenses with long commercial lifetimes, sometimes approaching a decade or more. The result of these features leads to duplication of computational resources, obsolescent computational infrastructure, and lack of interconnection between elements. Aspects of this invention include a device, system, and methods to provide vendor-agnostic interconnection between the multiple elements of a defined environment. The disclosed approach untethers AI algorithms from data generation system and increases flexibility in deployment of newer technologies and algorithms.Type: GrantFiled: December 22, 2022Date of Patent: May 5, 2026Assignee: Analytical AI Inc.Inventors: Thomas Anthony, Frank M. Skidmore
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Patent number: 12257624Abstract: A powder bed material can include from 80 wt % to 100 wt % metal particles having a D50 particle size distribution value from 4 ?m to 150 ?m. From 10 wt % to 100 wt % of the metal particles can be surface-activated metal particles having in intact inner volume and an outer volume with structural defects. The structural defects can exhibit an average surface grain density of 50,000 to 5,000,000 per mm2.Type: GrantFiled: December 9, 2023Date of Patent: March 25, 2025Assignee: Hewlett-Packard Development Company, L.P.Inventors: John Samuel Dilip Jangam, Thomas Anthony, Krzysztof Nauka, Kristopher J. Erickson
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Publication number: 20240424558Abstract: A method of three-dimensional printing can include iteratively applying metal particles having a heat fusion temperature as individual build material layers, and based on a 3D object model, iteratively and selectively applying a metallic binding agent onto the individual build material layers so that the individual build material layers are built up and bound together to form a green-body object. The metallic binding agent includes an aqueous liquid vehicle and metal salt or metal oxide nanoparticles that are thermally reducible to a metal or metal alloy at an elevated metal reducing temperature that is lower than the heat fusion temperature. The method also includes iteratively and selectively applying a polymeric binding agent onto the individual build material layers at an interface between the green-body object and a support structure for the green-body object, leaving a residue at the interface.Type: ApplicationFiled: July 9, 2021Publication date: December 26, 2024Inventors: John Samuel Dilip Jangam, Thomas Anthony, Ben Pon, Lihua Zhao
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Patent number: 12138685Abstract: A shaping composition for controlling deformation of a green body object during heat fusing can include a liquid vehicle present at from 10 wt % to about 80 wt %, based on a total weight of the shape retaining composition, and a metal particulate mixture present at from about 20 wt % to about 90 wt % based on a total weight of the shaping composition. The metal particulate mixture can include aluminum-containing particulates and secondary metal-containing particulates. The metal particulate mixture can have an aluminum elemental content to secondary metal elemental content atomic ratio of about 10:1 to about 1:2.Type: GrantFiled: March 18, 2019Date of Patent: November 12, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: John Samuel Dilip Jangam, Thomas Anthony, Lihua Zhao
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Publication number: 20240100597Abstract: A powder bed material can include from 80 wt % to 100 wt % metal particles having a D50 particle size distribution value from 4 ?m to 150 ?m. From 10 wt % to 100 wt % of the metal particles can be surface-activated metal particles having in intact inner volume and an outer volume with structural defects. The structural defects can exhibit an average surface grain density of 50,000 to 5,000,000 per mm2.Type: ApplicationFiled: December 9, 2023Publication date: March 28, 2024Inventors: John Samuel Dilip Jangam, Thomas Anthony, Krzysztof Nauka, Kristopher J. Erickson
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Patent number: 11897193Abstract: An example of a build material slurry includes metallic particles having an individual particle size up to 20 ?m, from about 0.01 wt % up to 1 wt % of a water-soluble binder, based on a weight of the metallic particles, and water. The build material slurry is a ready-to-use three-dimensional (3D) printing build material.Type: GrantFiled: October 24, 2017Date of Patent: February 13, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Thomas Anthony, Lihua Zhao
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Publication number: 20240001446Abstract: A shaping composition for controlling deformation of a green body object can include from about 10 wt % to about 80 wt % liquid vehicle, and from about 10 wt % to about 90 wt % metal particulates. The metal particulates can include from about 35 wt % to about 90 wt % high melting point metal particles, from about 10 wt % to about 65 wt % aluminum alloy particles, and from about 0.1 wt % to about 10 wt % metal complex selected from an inorganic metal salt, an organic metal salt, or a metal oxide. The metal of the metal complex can include copper, iron, aluminum, chromium, titanium, cobalt, silver, gold, nickel, tin, or zinc.Type: ApplicationFiled: December 1, 2020Publication date: January 4, 2024Inventors: John Samuel Dilip JANGAM, Thomas ANTHONY, Lihua ZHAO, James MCKINNELL
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Patent number: 11845127Abstract: A system to apply uniform layers of metal powder, the system includes: a conductive roller with a dielectric coating, the conductive roller biased at a first voltage; a powder supply to contain a metal powder biased at a second voltage, the powder supply to provide the metal powder to the conductive roller to form a uniform layer of metal powder on the dielectric coating of the conductive roller; a deposition area to receive the uniform layer of metal powder from the conductive roller, the deposition area biased at a third voltage, wherein the metal powder is transferred across an air gap from the conductive roller to the deposition area by electrostatic attraction of the metal powder.Type: GrantFiled: June 8, 2018Date of Patent: December 19, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Thomas Anthony, Seongsik Chang, Keith Edward Moore
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Patent number: 11845128Abstract: A powder bed material can include from 80 wt % to 100 wt % metal particles having a D50 particle size distribution value from 4 ?m to 150 ?m. From 10 wt % to 100 wt % of the metal particles can be surface-activated metal particles having in intact inner volume and an outer volume with structural defects. The structural defects can exhibit an average surface grain density of 50,000 to 5,000,000 per mm2.Type: GrantFiled: June 8, 2018Date of Patent: December 19, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: John Samuel Dilip Jangam, Thomas Anthony, Krzysztof Nauka, Kristopher J. Erickson
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Publication number: 20230294358Abstract: A three-dimensional (3D) printing system may include a build volume, a slurry reservoir to contain a slurry of build material and liquid, and a slurry dispenser to receive the slurry from the slurry reservoir and movable in a direction across the build volume to dispense slurry across the build volume.Type: ApplicationFiled: February 12, 2020Publication date: September 21, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Thomas Anthony, Ben Pon, Lihua Zhao, David A. Champion
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Patent number: 11759863Abstract: In an example of a three-dimensional (3D) printing method, a metallic build material is applied. A patterning fluid, including a metal salt, is selectively applied on at least a portion of the metallic build material. Prior to an application of additional build material, the metallic build material is exposed to light irradiation to cause the metal salt to reach a thermal decomposition temperature and thermally decompose to a metal. During the exposing, the metallic build material is maintained below a sintering temperature of the metallic build material.Type: GrantFiled: October 30, 2017Date of Patent: September 19, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Krzysztof Nauka, Thomas Anthony
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Publication number: 20230264414Abstract: In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.Type: ApplicationFiled: April 10, 2023Publication date: August 24, 2023Inventors: Kristopher J. ERICKSON, Thomas ANTHONY, Howard S. TOM, Sivapackia GANAPATHIAPPAN, Lihua ZHAO, Krzysztof NAUKA
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Publication number: 20230238138Abstract: Urgent screening in high-throughput, secure environments such as emergency rooms, or security, typically involves multiple devices. Devices that are used for screening are diverse, and typically sourced from multiple vendors. Currently, devices are typically stand-alone. Further, large devices, are costly, having high capital expenses with long commercial lifetimes, sometimes approaching a decade or more. The result of these features leads to duplication of computational resources, obsolescent computational infrastructure, and lack of interconnection between elements. Aspects of this invention include a device, system, and methods to provide vendor-agnostic interconnection between the multiple elements of a defined environment. The disclosed approach untethers AI algorithms from data generation system and increases flexibility in deployment of newer technologies and algorithms.Type: ApplicationFiled: December 22, 2022Publication date: July 27, 2023Inventors: Thomas ANTHONY, Frank M. SKIDMORE
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Patent number: 11648731Abstract: In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.Type: GrantFiled: October 29, 2015Date of Patent: May 16, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Thomas Anthony, Howard S. Tom, Sivapackia Ganapathiappan, Lihua Zhao, Krzysztof Nauka
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Publication number: 20220274172Abstract: A system for forming a part with a support including: a liquid reservoir to hold a support material to form the support; an ejector to receive support material from the liquid reservoir and deposit the support material into a build area; an actuator to provide relative motion between the ejector and the build area; and a spreader to form a layer of metal particles in the build area, wherein the support provides support for the part during sintering.Type: ApplicationFiled: May 19, 2022Publication date: September 1, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Krzysztof Nauka, Thomas Anthony
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Patent number: 11383301Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.Type: GrantFiled: February 1, 2019Date of Patent: July 12, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J. Erickson, Krzysztof Nauka, Thomas Anthony, Lihua Zhao, Howard S. Tom
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Patent number: 11338367Abstract: A system for compacting layers of metal powder, including: a layer of metal powder at a first voltage; and a conductive object above the layer of metal powder, the conductive object at a second voltage, wherein a voltage differential between the layer of metal powder and the conductive object is sufficient to attract particles from the layer of metal powder to the conductive object, change the voltage on the particles, and redeposit the particles in the layer of metal powder.Type: GrantFiled: June 8, 2018Date of Patent: May 24, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Thomas Anthony, Seongsik Chang
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Patent number: 11338510Abstract: A three-dimensional (3D) printing device includes a first cylinder. The first cylinder may include a first plurality of holes defined therein. The 3D printing device may include a second cylinder interior and coaxial to the first cylinder that includes a second plurality of holes open to an interior of the first cylinder. The 3D printing device may also include a third cylinder interior to the first cylinder and exterior to the second cylinder, the third cylinder including a longitudinal cutout open to the first cylinder. The 3D printing device may include a supply tube open to the second cylinder, the supply tube to provide an amount of build material to an interior portion of the second cylinder.Type: GrantFiled: June 8, 2018Date of Patent: May 24, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Krzysztof Nauka, Thomas Anthony, Kristopher J. Erickson
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Patent number: 11318532Abstract: Methods of forming 3D printed metal objects and compositions for 3D printing are described herein. In an example, a method of forming a 3D printed metal object can comprise: (A): a build material comprising at least one metal being deposited; (B): a fusing agent being selectively jetted on the build material, the fusing agent comprising: (i) at least one hydrated metal salt having a dehydration temperature of from about 100° C. to about 250° C., and (ii) a carrier liquid comprising at least one surfactant and water; (C): the build material and the selectively jetted fusing agent being heated to a temperature of from about 100° C. to about 250° C. to: (a) remove the carrier liquid, (b) dehydrate the hydrated metal salt, and (c) bind the build material and the selectively jetted fusing agent; and (D): (A), (B), and (C) being repeated at least one time to form the 3D printed metal object.Type: GrantFiled: July 19, 2017Date of Patent: May 3, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Thomas Anthony, Kristopher Erickson, Howard S. Tom
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Patent number: 11311942Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.Type: GrantFiled: January 29, 2016Date of Patent: April 26, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kristopher J Erickson, Krzysztof Nauka, Thomas Anthony, Lihua Zhao, Howard S Tom