Abstract: Articles are prepared with a substrate and an ink jetted and UV-curable image some of which also include metal nanoparticles or reducible metal ions. The in jetted and UV-curable image can be obtained from an ink jettable and UV-curable composition comprising: a reactive polymer comprising: (a1) or (a2) recurring units comprising pendant metal complexing water-solubilizing groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, or lactam group, or a pendant precursor moiety for the pendant amide, hydroxyl, or lactam group. Such articles can be used to provide electrically-conductive articles and devices after electrolessly plating a complex of the metal nanoparticles and the UV-cured reactive polymer.

Abstract: Ink jettable and UV-curable compositions include a reactive polymer comprising: (a1) at least 20 mol % of recurring units comprising pendant metal complexing water-solubilizing groups, and (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition. The compositions can optionally have a humectant, a dye or pigment colorant, an anionic or nonionic surfactant, a water-soluble or water-dispersible acrylic polymer, or a water-soluble or water-dispersible polyurethane. Such ink jettable and UV-curable compositions can include a complex of reducible metal ions or metal nanoparticles with the reactive polymer.

Abstract: A method for forming an ink jet image on a substrate includes ink jetting an ink jettable and UV-curable composition onto the substrate in an imagewise fashion to form an ink jetted image on the substrate. The ink jettable and UV-curable composition comprises: a reactive polymer comprising: (a1) or (a2) recurring units comprising pendant metal complexing water-solubilizing groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, or lactam group, or a pendant precursor moiety for the pendant amide, hydroxyl, or lactam group. The ink jetted image is cured to form a UV-cured ink jet image on the substrate. The ink jettable and UV-curable composition can also include metal nanoparticles or reducible metal ions that can serve as catalytic sites for electroless plating.

Abstract: Articles are prepared to have a substrate and a silver-containing composition on either or both supporting sides of the substrate. The silver-containing composition can comprise either reducible silver ions or silver nanoparticles, complexed with a reactive polymer. The reactive polymer comprises: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphonic acid, or carboxylic acid group. Some other articles have a water-insoluble complex of reacted (crosslinked) polymer with reducible silver ions or silver nanoparticles on either or both supportive sides of the substrate. Such reacted polymer is derived from the noted reactive polymer.

Abstract: Silver-containing compositions contain a water-soluble complex of a reactive polymer with either reducible silver ions or silver nanoparticles, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphonic acid, or carboxylic acid group, all amounts based on the total recurring units in the reactive polymer. Other silver-containing compositions contain a water-insoluble complex of a reacted polymer with either reducible silver ions or silver nanoparticles. The reacted polymers are derived from the reactive polymers.

Abstract: A method can be used to provide electrically-conductive articles with electrolessly plated metal, or articles having antimicrobial properties for marine environments. The method includes disposing a silver-containing composition onto one or more supporting sides of a substrate such as continuous polymeric web. The silver-containing composition comprises a water-soluble complex of a reactive polymer with reducible silver ions, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphonic acid, or carboxylic acid group. The reducible silver ions can be suitably reduced and the reactive polymer can be photoexposed to provide crosslinking in patternwise or uniform fashion.

Abstract: A water-soluble composition includes reducible copper ions or copper nanoparticles complexed with a reactive polymer. The reactive polymer can be crosslinked using suitable irradiation to provide copper-containing water-insoluble complexes. The water-soluble composition can be used to provide various articles and electrically-conductive materials that can be assembled in electronic devices. The reactive polymer has greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally at least 1 mol % of recurring units comprising a pendant amide, amine, hydroxyl, lactam, phosphonic acid, or carboxylic acid group.

Abstract: A water-soluble composition includes reducible copper ions or copper nanoparticles complexed with a reactive polymer. The reactive polymer can be crosslinked using suitable irradiation to provide copper-containing water-insoluble complexes. The water-soluble composition can be used to provide various articles and electrically-conductive materials that can be assembled in electronic devices. The reactive polymer has greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally at least 1 mol % of recurring units comprising a pendant amide, amine, hydroxyl, lactam, phosphonic acid, or carboxylic acid group.

Abstract: Articles are prepared to have a substrate and a silver-containing composition on either or both supporting sides of the substrate. The silver-containing composition can comprise either reducible silver ions or silver nanoparticles, complexed with a reactive polymer. The reactive polymer comprises: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphonic acid, or carboxylic acid group. Some other articles have a water-insoluble complex of reacted (crosslinked) polymer with reducible silver ions or silver nanoparticles on either or both supportive sides of the substrate. Such reacted polymer is derived from the noted reactive polymer.

Abstract: Silver-containing compositions contain a water-soluble complex of a reactive polymer with either reducible silver ions or silver nanoparticles, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphoric acid, or carboxylic acid group, all amounts based on the total recurring units in the reactive polymer. Other silver-containing compositions contain a water-insoluble complex of a reacted polymer with either reducible silver ions or silver nanoparticles. The reacted polymers are derived from the reactive polymers.

Abstract: A method can be used to provide electrically-conductive articles with electrolessly plated metal, or articles having antimicrobial properties for marine environments. The method includes disposing a silver-containing composition onto one or more supporting sides of a substrate such as continuous polymeric web. The silver-containing composition comprises a water-soluble complex of a reactive polymer with reducible silver ions, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphonic acid, or carboxylic acid group. The reducible silver ions can be suitably reduced and the reactive polymer can be photoexposed to provide crosslinking in patternwise or uniform fashion.

Abstract: A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises pendant photosensitive 1,2-diarylethylene groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.

Abstract: An electrically-conductive pattern is prepared using a reactive composition having: (1) a reactive polymer; (2) a compound that provides a cleaving acid upon exposure to radiation; and (3) a crosslinking agent that reacts in the presence of the cleaving acid, to provide crosslinking in the reactive polymer. A polymeric layer of the reactive composition is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising sulfonic acid or sulfonate groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions, which pattern is reduced to provide a pattern of corresponding electroless seed metal particles. Electrolessly plating is then carried out in the exposed regions. The unique reactive comprises (a) recurring units represented Structure (A) as described in the disclosure, and can also include other recurring units that are crosslinkable or provide other properties.

Abstract: A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises (i) a backbone, and (ii) pendant photosensitive non-aromatic unsaturated heterocyclic groups comprising an amide group that is conjugated with a carbon-carbon double bond. The non-aromatic unsaturated heterocyclic groups are linked to the backbone at an amide nitrogen atom. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.

Abstract: A precursor article has a substrate and a polymeric layer having a reactive composition that contains a non-crosslinked thiosulfate copolymer comprising: (a) recurring units comprising pendant thiosulfate groups, and (b) recurring units comprising pendant carboxy, carboxylate, phospho, phosphonate, phosphate, sulfo, sulfonate, or sulfite groups. The (a) recurring units are present in an amount of 1 to 30 mol %, and the (b) recurring units are present in an amount of 70 to 99 mol %. This precursor article can be used to provide a product article comprising a substrate in which the polymeric layer has both exposed regions and non-exposed regions. The exposed regions contain a pattern of electrolessly plated metal within or deposited on the surface of an at least partially crosslinked polymer that has been derived from the non-crosslinked thiosulfate copolymer. The non-exposed regions have none of the electrolessly plated metal or the non-crosslinked thiosulfate polymer.

Abstract: A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises pendant thiosulfate groups as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.

Abstract: A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises pendant photosensitive 1,2-diarylethylene groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.

Abstract: A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises (i) a backbone, and (ii) pendant photosensitive non-aromatic unsaturated heterocyclic groups comprising an amide group that is conjugated with a carbon-carbon double bond. The non-aromatic unsaturated heterocyclic groups are linked to the backbone at an amide nitrogen atom. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.

Abstract: An electrically-conductive pattern is prepared using a reactive composition having: (1) a reactive polymer; (2) a compound that provides a cleaving acid upon exposure to radiation; and (3) a crosslinking agent that reacts in the presence of the cleaving acid, to provide crosslinking in the reactive polymer. A polymeric layer of the reactive composition is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising sulfonic acid or sulfonate groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions, which pattern is reduced to provide a pattern of corresponding electroless seed metal particles. Electrolessly plating is then carried out in the exposed regions. The unique reactive comprises (a) recurring units represented Structure (A) as described in the disclosure, and can also include other recurring units that are crosslinkable or provide other properties.

Abstract: Crosslinkable polymers comprise recurring units represented by: wherein R, R?, and R? are independently hydrogen or an alkyl, cyano, or halo group; R1 is hydrogen or a halo, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl, cyano, hydroxy, alkoxy, carboxy, or ester group; L is an organic linking group; EWG represents an electron withdrawing group having a Hammett-sigma value greater than or equal to 0.35 such that the oxygen-carbon bond in O—C(EWG)(R1) is cleavable in the presence of a cleaving acid having a pKa of 2 or less as measured in water; Ar is a substituted or unsubstituted arylene group; X is NR2 or oxygen; R2 is hydrogen or an alkyl group; t-alkyl represents a tertiary alkyl group having 4 to 6 carbon atoms, and m represents at least 1 mol % and up to and including 100 mol %, based on the total recurring units in the polymer.