Abstract: In some examples, disclosed methods and systems may configure using a proxy payment object a payment object reader to accept one or more payment objects. The method includes receiving, as an input from a merchant and in a specific manner, at least one object into a payment object reader communicatively coupled to a point-of-sale (POS) terminal. A portion of read-data is compared to a proxy payment object syntax. In response to obtaining a match between the read-data and the proxy payment object syntax with the read-data, the received object is determined to be a proxy payment object. A configuration component then generates a set of configuration instructions which when executed on the payment object reader and/or the POS terminal configures the payment object reader to accept one or more payment objects towards a payment transaction.

Abstract: A printed circuit carrier has an opening therein against which a back plate is attached to thereby form a cavity. An image sensor device is attached to the back plate inside the cavity. The height of the image sensor device is about equal to or less than the height of the cavity. Electrical signal connections are formed between the image sensor device and the printed circuit carrier. A cap is attached directly to the carrier by a flowable adhesive layer, to seal off the cavity. Other embodiments are also described and claimed.

Abstract: A printed circuit carrier has an opening therein against which a back plate is attached to thereby form a cavity. An image sensor device is attached to the back plate inside the cavity. The height of the image sensor device is about equal to or less than the height of the cavity. Electrical signal connections are formed between the image sensor device and the printed circuit carrier. A cap is attached directly to the carrier by a flowable adhesive layer, to seal off the cavity. Other embodiments are also described and claimed.

Abstract: An electronic assembly includes a substrate having bond pads on a surface of the substrate. A solder mask covers the surface of the substrate, and a solder connection is disposed on each of the bond pads. At least one trench is formed in the solder mask, and is located between adjacent ones of the bond pads. At least one component has contact pads, and each contact pad is connected to one of the bond pads via one of the solder connections. The trench is located beneath the device and extends at least from one edge of the device to a location underneath the device. Underfill material fills the trench and space between the solder mask and the device.

Abstract: A reinforcement structure to protect an integrated circuit module located within a card-type data carrier or smart card. The reinforcement structure is rigid, having a modulus of elasticity higher than modulus of elasticity of the smart card, and has a thickness dimension that is co-extensive with the thickness dimension of the smart card. The reinforcement structure is provided with a cavity for housing the integrated circuit module. In a preferred embodiment, the reinforcement structure is constructed of thermally and electrically conductive material that is castable or formable to facilitate integration of additional electronic circuit elements therein. In another embodiment, the reinforcement structure is configured in the shape of a SIMM card and is used in place of the normally flexible plastic SIMM card body.

Abstract: A reinforcement structure to protect an integrated circuit module located within a card-type data carrier or smart card. The reinforcement structure is rigid, having a modulus of elasticity higher than modulus of elasticity of the smart card, and has a thickness dimension that is co-extensive with the thickness dimension of the smart card. The reinforcement structure is provided with a cavity for housing the integrated circuit module. In a preferred embodiment, the reinforcement structure is constructed of thermally and electrically conductive material that is castable or formable to facilitate integration of additional electronic circuit elements therein. In another embodiment, the reinforcement structure is configured in the shape of a SIMM card and is used in place of the normally flexible plastic SIMM card body.