Abstract: A method includes obtaining a container image associated with a target framework, a built distribution including a feature conversion class and a set of transform classes, and a configuration package. The method also includes executing the executables in a sequence indicated by the configuration package in a container based on the container image and generating an intermediate data structure by providing values of a source data framework to a feature conversion object constructed from the feature conversion class. The method also includes obtaining an identifier of a feature synthesis operation indicating the set of transform classes and, in response to obtaining the identifier of the feature synthesis operation, generating a transform output by providing a set of values of the intermediate data structure to a set of transform objects constructed from the set of transform classes.

Abstract: This invention relates to the detection of Legionella, more specifically Legionella pneumophila, more specifically Legionella pneumophila serogroup 1, in a sample. Methods of detection, and assays and kits useful for detection, are also disclosed. The invention provides a method for identifying the presence, absence, or quantity of Legionella pneumophila serogroup 1 in a sample, the method comprising the steps of detecting the presence, absence, or quantity of at least part of the nucleic acid sequence of the lpg0768 gene or an expression product thereof, and correlating the presence, absence, or quantity of the at least part of the nucleic acid sequence of the lpg0768 gene or an expression product thereof, to the presence, absence, or quantity of Legionella pneumophila serogroup 1 in the sample.

Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

Abstract: A glove for protecting a hand of a user includes a main glove body configured to receive metacarpals of the hand and a glove thumb coupled to the main glove body and extending longitudinally away from the main glove body. The glove thumb is configured to receive a thumb of the hand. The glove thumb includes a thumb panel extending longitudinally along a length of the glove thumb. The thumb panel forms a first pleat raised above an outer surface of the thumb panel. The first pleat extends longitudinally along the length of the glove thumb.

Abstract: A cigarette paper dispenser comprising a structure foldable between a first and second configuration, the first configuration forming a tray; and the second configuration forming a pouch for carriage of a rolled cigarette.

Abstract: A glove for protecting a hand of a user includes a main glove body configured to receive a metacarpal of the hand and a glove finger coupled to the main glove body and extending longitudinally away from the glove main body. The glove finger is configured to receive a finger of the hand, and the glove finger includes a panel defining a rolled tip arrangement at an end of the glove finger. The glove further includes a fingertip reinforcement bonded to an interior surface of the panel and positioned to extend between the panel and a fingertip of the finger of the hand.

Abstract: A wafer handling fixture is used to transport a finished semiconductor wafer from one post-fabrication procedure to another (e.g., testing, inspection, cleaning, dicing, or shipping) in a manner that maintains the wafer in its “flattened” form and eliminates the possibility for a wafer to later spring back into a bowed form. The wafer handling fixture includes a surface stiction film to which the wafer will naturally adhere, and uses a wafer release mechanism included in a bottom support plate to permit for the “controlled” transfer of the wafer from the handling fixture to testing/inspection equipment.

Abstract: A cigarette paper dispenser comprising a structure foldable between a first and second configuration, the first configuration forming a tray; and the second configuration forming a pouch for carriage of a rolled cigarette.

Abstract: Advanced micro-location of RFID tags in 3D and 2D spatial environments includes a mobile platform having a known location within a three-dimensional (3D) space. A plurality of RFID tags is located within the 3D space. A plurality of RFID antennas is mounted on the mobile platform, wherein backscatter signals of at least one of the RFID tags are collected by at least one of the plurality of RFID antennas and time-synchronized with the known location of the mobile platform in the 3D space at a time of collection. A computerized processing device is in communication with the plurality of RFID antennas. The computerized processing device performs algorithmic RFID tag localization using at least the collected backscatter signals of the at least one RFID tag and the time-synchronized known location of the mobile platform to determine a micro-location of the at least one RFID tag within the 3D space.

Abstract: A medical lead is configured to be implanted into a patient's body and comprises a lead body, and an electrode coupled to the lead body. The electrode comprises a first section configured to contact the patient's body, and a second section capacitively coupled to the first section and configured to be electrically coupled to the patient's body.

Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

Abstract: A medical lead is configured to be implanted into a patient's body and comprises a lead body, and an electrode coupled to the lead body. The electrode comprises a first section configured to contact the patient's body, and a second section capacitively coupled to the first section and configured to be electrically coupled to the patient's body.

Abstract: A medical lead is configured to be implanted into a patient's body and comprises a lead body, and an electrode coupled to the lead body. The electrode comprises a first section configured to contact the patient's body, and a second section capacitively coupled to the first section and configured to be electrically coupled to the patient's body.

Abstract: A medical lead is configured to be implanted into a patient's body and comprises a lead body, and an electrode coupled to the lead body. The electrode comprises a first section configured to contact the patient's body, and a second section capacitively coupled to the first section and configured to be electrically coupled to the patient's body.

Abstract: A medical lead is configured to be implanted into a patient's body and comprises a lead body, and an electrode coupled to the lead body. The electrode comprises a first section configured to contact the patient's body, and a second section capacitively coupled to the first section and configured to be electrically coupled to the patient's body.

Abstract: A stimulation lead is configured to be implanted into a patient's body and includes at least one distal stimulation electrode and at least one conductive filer electrically coupled to the distal stimulation electrode. A jacket is provided for housing the conductive filer and providing a path distributed along at least a portion of the length of the lead for conducting induced RF energy from the filer to the patient's body.

Abstract: A medical lead is configured to be implanted into a patient's body and comprises a lead body, and an electrode coupled to the lead body. The electrode comprises a first section configured to contact the patient's body, and a second section electrically coupled to the first section and configured to be capacitively coupled to the patient's body.

Abstract: A lead configured to be implanted into a patient's body comprises a lead body and a conductive filer positioned within the lead body and having a distal portion. An electrode is electrically coupled to the lead body and comprises a stimulation portion, a bobbin, and at least one coil of wire wound on the bobbin and electrically coupled between the stimulation portion and the distal end region to form an inductor between the distal end region and the stimulation portion.

Abstract: A collapsible frame container assembly comprises a frame component comprising a plurality of panels connected to each other, the panels being movable relative to each other between a first substantially folded condition wherein the panels are collapsed and a second unfolded condition wherein the panels are opened to define a frame structure. Also provided is a container component comprising first and second sides defining a space therebetween of a size which can be varied according to the relative positions of the first and second sides. The frame component when in the unfolded condition and the container component are releasably coupled to each other to define a predetermined frame container assembly.