Abstract: A method for manufacturing a quantum electronic circuit includes etching a semiconducting layer so as to obtain: a plurality of pillars; and a qubit layer; oxidising the flank of each pillar; forming coupling rows and coupling columns; and depositing separation layers leaving a contact surface protrude from each pillar.

Abstract: A spin qubit quantum device includes a semiconductor portion having a first region disposed between two second regions; a first control gate disposed in direct contact with the first region and configured to control a minimum potential energy level in the first region, and disposed in direct contact with a first face of the semiconductor portion; and second electrostatic control gates, each disposed in direct contact with one of the second regions and configured to control a maximum potential energy level in one of the second regions, and disposed in direct contact with a second face, opposite to the first face, of the semiconductor portion, The first gate is not aligned with the second gates.

Abstract: A quantum device configured to be able to form an array of quantum dots, the device including for this: an active layer made of a semiconductor material; a plurality of first gates disposed along a plurality of rows; a plurality of second gates disposed along a plurality of columns perpendicular to the rows of the plurality of rows; a plurality of third gates, each third gate of the plurality of third gates being disposed at the intersection of one row of the plurality of rows and one column of the plurality of columns, each third gate being separated from the nearest third gates, on a row by a first gate and on a column by a second gate; a plurality of fourth gates, each fourth gate being disposed between two second gates along the rows and between two first gates along the columns.

Abstract: A quantum device configured to be able to form an array of quantum dots, the device including for this: an active layer made of a semiconductor material; a plurality of first gates disposed along a plurality of rows; a plurality of second gates disposed along a plurality of columns perpendicular to the rows of the plurality of rows; a plurality of third gates, each third gate of the plurality of third gates being disposed at the intersection of one row of the plurality of rows and one column of the plurality of columns, each third gate being separated from the nearest third gates, on a row by a first gate and on a column by a second gate; the active layer including apertures over the entire thickness of the active layer disposed between the rows of the plurality of rows and the columns of the plurality of columns.

Abstract: One aspect of the invention relates to an electronic circuit (1) comprising: a semiconductor layer (2), referred to as “qubit layer”; a separation layer (42) extending in contact with the qubit layer (2); first conductive electrodes (61), referred to as “coupling rows”, extending in parallel to the qubit layer (2); second conductive electrodes (62), referred to as “coupling columns”, extending in parallel to the qubit layer (2); third conductive electrodes (71), referred to as “control rows”, extending over the spacer (42); and conductive vias (72), referred to as “control vias”, extending perpendicularly to the face of the qubit layer (2) from the spacer (42) and having one end disposed in proximity to the qubit layer (2).

Abstract: A method is provided for producing a back gate under a semiconductive device surrounded by isolation trenches. The method includes a partial etching of the isolation trenches forming an opening to the sacrificial layer, a selective removal of the sacrificial layer forming a cavity under the device, and a filling of the cavity with a conductive material so as to form the back gate. Advantageously, the formation of the isolation trenches comprises a formation of a sacrificial coating layer at the flanks of the trenches, in contact with the sacrificial layer, before filling with an isolating material, and the partial etching of the trenches comprises a removal of this sacrificial coating layer selectively at the isolating material.

Abstract: An artificial-neuron device includes an integration-generation circuit coupled between an input at which an input signal is received and an output at which an output signal is delivered, and a refractory circuit inhibiting the integrator circuit after the delivery of the output signal. The refractory circuit is formed by a first MOS transistor having a first conduction-terminal coupled to a supply node, a second conduction-terminal coupled to a common node, and a control-terminal coupled to the output, and a second MOS transistor having a first conduction-terminal coupled to the input, a second conduction-terminal coupled to a reference node at which a reference voltage is received, and a control-terminal coupled to the common node. A resistive-capacitive circuit is coupled between the supply node and the reference node and having a tap coupled to the common node, with the inhibition duration being dependent upon a time constant of the resistive-capacitive circuit.

Abstract: A spin Qbits quantum device includes a substrate of the semiconductor on insulator type provided with a surface semiconductor layer disposed on an insulating layer, the insulating layer being arranged on an upper face of a semiconductor support layer, and a component formed of one or more quantum islands extending in the surface layer and one or more gate electrodes for electrostatic control of the islands. Front gate electrodes are disposed on the surface layer, and the component includes a back electrostatic control gate formed of a conductive layer lining lateral walls and a bottom of an opening passing through the support layer from a lower face opposite the upper face up to the insulating layer. The conductive layer is disposed at the bottom of the opening in contact with the insulating layer, the conductive layer being disposed in contact with the support layer at the lateral walls.

Abstract: A method for manufacturing a quantum electronic circuit includes etching a semiconducting layer so as to obtain: a plurality of pillars; and a qubit layer; oxidising the flank of each pillar; forming coupling rows and coupling columns; and depositing separation layers leaving a contact surface protrude from each pillar.

Abstract: A silicon-on-insulator semiconductor substrate supports rows extending in a direction. Each row includes complementary MOS transistors and associated contact regions allowing back gate of the complementary MOS transistors to be biased. All transistors and associated contact regions of a given row are mutually isolated by a first trench isolation. Each row is bordered on opposed edges extending parallel to said direction by corresponding second trench isolations that are shallower than the first trench isolation.

Abstract: A spin qubit quantum device, comprising: a semiconductor portion comprising a first region disposed between two second regions; a first control gate disposed in direct contact with the first region and configured to control a minimum potential energy level in the first region, and disposed in direct contact with a first face of the semiconductor portion; and second electrostatic control gates, each disposed in direct contact with one of the second regions and configured to control a maximum potential energy level in one of the second regions, and disposed in direct contact with a second face, opposite to the first face, of the semiconductor portion, and wherein the first gate is not aligned with the second gates.

Abstract: An artificial-neuron device includes an integration-generation circuit coupled between an input at which an input signal is received and an output at which an output signal is delivered, and a refractory circuit inhibiting the integrator circuit after the delivery of the output signal. The refractory circuit is formed by a first MOS transistor having a first conduction-terminal coupled to a supply node, a second conduction-terminal coupled to a common node, and a control-terminal coupled to the output, and a second MOS transistor having a first conduction-terminal coupled to the input, a second conduction-terminal coupled to a reference node at which a reference voltage is received, and a control-terminal coupled to the common node. A resistive-capacitive circuit is coupled between the supply node and the reference node and having a tap coupled to the common node, with the inhibition duration being dependent upon a time constant of the resistive-capacitive circuit.

Abstract: A semiconductor substrate includes a doped region having an upper surface. The doped region may comprise a conduction terminal of a diode (such as cathode) or a transistor (such as a drain). A silicide layer is provided at the doped region. The silicide layer has an area that only partially covers an area of the upper surface of the doped region. The partial area coverage facilitates modulating the threshold voltage and/or leakage current of an integrated circuit device.

Abstract: An integrated artificial neuron device includes an input signal node, an output signal node and a reference supply node. An integrator circuit receives and integrates an input signal to produce an integrated signal. A generator circuit receives the integrated signal and, when the integrated signal exceeds a threshold, delivers the output signal. The integrator circuit includes a main capacitor coupled between the input signal node and the reference supply node. The generator circuit includes a main MOS transistor coupled between the input signal node and the output signal node. The main MOS transistor has a gate that is coupled to the output signal node, and a substrate that is mutually coupled to the gate.

Abstract: An integrated circuit includes a MOS transistor that is located in and on a semiconductor film of a silicon-on-insulator (SOI) substrate. The SOI substrate has, below a buried insulator layer, a first back gate region and two first auxiliary regions that are located, respectively, below source and drain contact regions of the MOS transistor. The conductivity type of the two first auxiliary regions is the opposite the conductivity type of the first back gate region. The conductivity type of the two first auxiliary regions is identical to the conductivity type of the source and drain contact regions of the MOS transistor.

Abstract: A silicon-on-insulator semiconductor substrate supports rows extending in a direction. Each row includes complementary MOS transistors and associated contact regions allowing back gate of the complementary MOS transistors to be biased. All transistors and associated contact regions of a given row are mutually isolated by a first trench isolation. Each row is bordered on opposed edges extending parallel to said direction by corresponding second trench isolations that are shallower than the first trench isolation.

Abstract: An integrated device, for generating a random signal, includes: a first terminal; a pulse signal generator configured to generate a current pulse train on the first terminal; and a first control circuit coupled to the first terminal and configured to convert the current pulse train into a voltage signal randomly including voltage pulses greater than a threshold, the random signal containing the voltage pulses greater than the threshold.

Abstract: A memory array includes memory cells of Z2-FET type arranged in rows and columns, wherein each memory cell includes a MOS-type selection transistor and a first region of a first conductivity type that is shared in common with a drain region of the first conductivity type of the selection transistors. The selection transistors of a same column of the memory array have a common drain region, a common source region, and a common channel region.

Abstract: A semiconductor substrate includes a doped region having an upper surface. The doped region may comprise a conduction terminal of a diode (such as cathode) or a transistor (such as a drain). A silicide layer is provided at the doped region. The silicide layer has an area that only partially covers an area of the upper surface of the doped region. The partial area coverage facilitates modulating the threshold voltage and/or leakage current of an integrated circuit device.

Abstract: A memory array includes memory cells of Z2-FET type arranged in rows and columns, wherein each memory cell includes a MOS-type selection transistor and a first region of a first conductivity type that is shared in common with a drain region of the first conductivity type of the selection transistors. The selection transistors of a same column of the memory array have a common drain region, a common source region, and a common channel region.