Abstract: The invention provides, in various embodiments, systems, devices and methods relating to ex-vivo organ care. In certain embodiments, the invention relates to maintaining an organ ex-vivo at near-physiologic conditions.

Abstract: A system and method is provided for controlling a distributed computing environment. The distributed computing environment is controlled by controlling flows, streams, and pipes used by applications within the distributed computing environment. The controls on each of the flows, streams, and pipes include latency, priority, a connection throttle, and a network packet throttle. Parameters for determining the values for each of the controls are based on any one or more of Virtual Local Area Network Identifier (VLAN ID), source address, destination address, source port, destination port, protocol, connection request, and transaction type load tag.

Abstract: Methods of determining which components and their capacities within a distributed computing environment are used for a transaction type can be performed faster and more accurately compared to conventional methods. In one embodiment by separating the transaction types into groups, regression can be performed faster on data collected because the data is less “polluted” by some or all other transactions types. Also, selection of transaction types within each group can reduce or eliminate colinearities in data between different transaction types. In still another embodiment, the distributed computing environment can be allowed to catch up between running each group of transaction types. Alternatively, if multiple instances of a component are present, transactions may be routed based on transaction type to reduce the impact. Data processing system readable media can include code that includes instructions for carrying out the methods.

Abstract: An application or a portion thereof can be thought of as a container having a set of instruments with mathematical descriptions of relationships between the instruments and other portions of the application infrastructure. The set of instruments may include only those instruments determined to significantly affect or be significantly affected by an application or a portion thereof running within a distributed computing environment. Models can be generated to include those instruments that significantly affect or are significantly affected by the application or a portion thereof and their mathematical descriptions of relationships between those instruments. By using the models, portions of an application environment across tiers can be controlled in a more coherent manner to better achieve the business objectives of an organization. The methods and systems can also help to identify and correct potential problems that may not be seen when examining tiers or sub-tiers individually.

Abstract: Systems and methods are described which allow communications in an application infrastructure to be prioritized based on a variety of factors, including the component or application flow with which the communications are associated. A communication may be received and classified into one of a series of application flows. A management communication may be received from a management interface component over a management network and forwarded in a prioritized manner to an application infrastructure component in the application infrastructure. Similarly, a management communication may be received from an application infrastructure component in the application infrastructure in a prioritized manner and forwarded over a management infrastructure to a management interface component.

Abstract: Systems and methods are described which allow communications in an application infrastructure to be prioritized based on a wide variety of factors, including the component or application flow with which the communications are associated. A communication may be received and classified into one of a series of application-specific data flows. In one embodiment, a priority value may be calculated and assigned to the communication based on the application-specific data flow assigned to the communication. The communication may then be forwarded to its intended destination based on the assigned priority.

Abstract: Systems and methods are described which allow information to be assembled on an application infrastructure topology. This application infrastructure topology may be assembled from information collected on various application infrastructure components in the application infrastructure. Information may be collected on an application infrastructure component in an application infrastructure by examining communications intended for, or originating with, the application infrastructure component. Information may also be collected on an application infrastructure component by querying an agent on the application infrastructure component. By exploiting the protocol of the network, these queries may be issued with a minimum of intrusiveness. The data on the various application infrastructure components may then be aggregated, and information on the application infrastructure topology assembled.

Abstract: Methods and systems of estimating usage of components within an application environment can use statistical, rather than deterministic methods that may be too intrusive or disturb a network used by the application environment. Different transaction types may have estimated usage of components within the application environment and its corresponding confidence level (that the transaction type uses that specific component) calculated and presented to a user. Asynchronous data and data routinely generated by a component may be used. The workload and utilization data may be conditioned before determining the estimated usage to smooth and filter data and determine accuracy of the correlations.

Abstract: Methods and systems of managing a network can be used in which physical components may be provisioned or de-provisioned without having to manually reconfigure a logical instrument. Logical instruments may be used to monitor or control an application environment. The logical instruments may be coupled to logical objects, which in turn are coupled to physical model objects, which in turn correspond to physical components. Host agents may reside on the physical components to actuate or have actuated a physical component. From a perspective of an operator or a program optimizing or otherwise managing an application environment on a network, the logical instruments appear as static variables (values can change, but the variable itself does not) where dynamic changes to physical components may occur but are transparent to the operator or program.

Abstract: A dielectric, fire-resistant shelter apparatus is disclosed which affords temporary protection to individuals exposed to the open environment. The shelter apparatus includes a protective canopy which is movable between an open position for providing temporary cover and protection to individuals exposed to the environment and a closed, collapsed position for storage. The canopy is substantially dielectric and resistant to fire. A plurality of ribs interconnect with each other to support the canopy in its open position. Moreover, a plurality of struts are secured for supporting the ribs and canopy in the open position and for enabling the ribs and canopy to move to the closed collapsed position. Finally, at least one support element is provided for maintaining the relative positions of the struts, ribs and canopy when in the open position above a ground surface, the support element also being dielectric.

Abstract: A snow grooming apparatus and system for grooming snow barriers and elements. The apparatus has an inlet to accept the snow, and at least one smoothing member attached to the rear of the inlet. The smoothing members are dimensioned to pass over the snow formed by the inlet and to smooth at least one side of the snow such that the resulting barrier has at least one substantially smooth side. The system includes the snow grooming apparatus attached to a blade of a snow grooming vehicle.

Abstract: Patient monitoring apparatus for use in an environment which includes a plurality of sensors. The apparatus provides collection and display of patient data signals collected from a medical patient using the sensors, including periods when the patient is being transported. The apparatus comprises a portable monitor coupled to a plurality of distinct data acquisition modules, which are coupled to the sensors. The modules includes cartridges, which detachably mount to the portable monitor, and pods which are positioned independent of the monitor. The pods reduce the number of cables extending between the patient's bed and the portable monitor by combining signals from many sensors into a single output signal. The modules collect patient data in analog form from the sensors and provide digital data signals to the monitor. The portable monitor includes: a display device for displaying the patient data, and storage for the patient data. The portable monitor may be coupled to a docking station.

Abstract: A monitor system for acquiring medical data from a plurality of sensors adapted for attachment to a patient. The system is distributed over at least two geographically separate patient monitoring areas via a communication network and includes a portable monitor and at least two monitor docking stations. The portable monitor is adapted for coupling to the plurality of sensors, for receiving, processing and displaying patient data signals acquired from the plurality of sensors when said sensors are attached to the patient. At least one docking station is located in each of the two patient monitoring areas and are connected to one another for transmission of patient data therebetween via the communication network.

Abstract: Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

Abstract: Patient monitoring apparatus for use in an environment which includes a communications network and a plurality of sensors. The apparatus provides collection and display of patient data signals collected from a medical patient using the sensors. The apparatus comprises a portable monitor coupled to a plurality of data acquisition modules, which are in turn coupled to the sensors. The data acquisition modules include cartridges, which mount on the portable monitor, and independently positionable pods. The pods reduce the number of cables extending between the patient's bed and the portable monitor by combining signals from many sensors into a single output signal for transmission to the monitor. The modules collect patient data in analog form from the sensors and provide digital data signals to the monitor. The portable monitor includes: a display device for displaying the patient data, and storage for the patient data. The portable monitor is coupled to the docking station.

Abstract: Removing welded outer lead bonds of TAB tape leads to contacts on a substrate. The method includes separating the electrical leads adjacent the weld bonds leaving a remnant, engaging the remnant with a shear tool, and moving the tool and bond relative to each other shearing the remnant. In some cases the tool is ultrasonically vibrated in a direction transversely to the relative movement of the tool and bond.

Abstract: A desoldering material with an opening or window shaped so that the base of an electronic component can fit inside the opening while the desoldering material simultaneously contacts all solder joints which bond the component's outer leads to pads on a surface. A first adhesive secures the base to the surface, a second adhesive secures a retraction device to the base, the first adhesive is heated and softened without softening the second adhesive, and the retraction device removes the desoldered component from the surface. The invention is well suited to removing tape-automated-bonded integrated circuits adhesively attached to high density multichip module substrates.