Patents by Inventor Thomas Blount

Thomas Blount has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density chip level package for the packaging of integrated circuits and method to manufacture same
    Publication number: 20050146033
    Abstract: A package for mounting an integrated circuit die. In one embodiment the package comprises a metal substrate having first and second opposing primary surfaces and an aperture formed therebetween. A flexible thin film interconnect structure is formed over the first surface of the metal substrate and over the aperture. The flexible thin film interconnect structure has bottom and top opposing surfaces, a first region that is in direct contact with the first surface of the metal substrate and a second region that is opposite the aperture. The bottom surface of the thin film interconnect structure is in direct contact with the metal substrate in the first region.
    Type: Application
    Filed: February 16, 2005
    Publication date: July 7, 2005
    Applicant: Kulicke & Soffa Investments, Inc.
    Inventors: Jan Strandberg, Richard Trevino, Thomas Blount