Patents by Inventor Thomas BODNER

Thomas BODNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190237500
    Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate, an integrated circuit, a wiring, a filter layer, a transparent spacer layer, and an on-chip diffuser. The semiconductor substrate has a main surface. The integrated circuit comprises at least one light sensitive area and is arranged in the substrate at or near the main surface. The wiring provides an electrical connection to the integrated circuit and is connected to the integrated circuit. The wiring is arranged on or in the semiconductor substrate. The filter layer has a direction dependent transmission characteristic and is arranged on the integrated circuit. In fact, the filter layer at least covers the light sensitive area. The transparent spacer layer is arranged on the main surface and, at least partly, encloses the filter layer. A spacer thickness is arranged to limit a spectral shift of the filter layer. The on-chip diffuser is arranged on the transparent spacer layer.
    Type: Application
    Filed: June 2, 2017
    Publication date: August 1, 2019
    Inventors: Hubert Enichlmair, Martin SCHREMS, Gregor Toschkoff, Thomas Bodner, Mario Manninger
  • Patent number: 10346387
    Abstract: A method includes a primary storage unit receiving a first write request including a first key and a first value; persisting the first value in a first non-volatile memory in association with the first key; broadcasting the first write request and a first set of globally-durable keys to secondary storage units; receiving, from the secondary storage units, an acknowledgement of the first write request and a first set of locally-durable keys, each of the first sets of locally-durable keys including the first key; the primary storage unit receiving a second write request including a second key and a second value; persisting the second value in the first non-volatile memory in association with the second key; and broadcasting the second write request and a second set of globally-durable keys to the secondary storage units, the second set of locally-durable keys including the first key. A system is also disclosed.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: July 9, 2019
    Assignee: SAP SE
    Inventors: Peter Bumbulis, Jeffrey Pound, Nathan Auch, Anil Kumar Goel, Matthias Ringwald, Thomas Bodner, Scott MacLean
  • Publication number: 20190165020
    Abstract: A method is proposed to produce an optical sensor at wafer-level, the methods comprises the following steps. A wafer is provided and has a main top surface and a main back surface. At or near the top surface of the wafer at least one integrated circuit is arranged having a light sensitive component. A first mold tool is placed over the at least one integrated circuit such that at least one channel remains between the first mold tool and the top surface to enter a first mold material. A first mold structure is formed by wafer-level molding the first mold material via the at least one channel. The first mold material creates at least one runner structure. A second mold tool is placed over the first mold structure and a second mold structure is formed by wafer-level molding a second mold material by means of the second mold tool. A light path blocking structure is arranged on the top surface to block light from entering via the at least one runner structure.
    Type: Application
    Filed: August 8, 2017
    Publication date: May 30, 2019
    Inventors: Gregor Toschkoff, Thomas Bodner, Franz Schrank
  • Publication number: 20180323320
    Abstract: An optical package is proposed comprising a carrier, an optoelectronic component, an aspheric lens, and a reflective layer. The carrier comprises electrical interconnections and the optoelectric component is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component is mounted on the carrier or integrated into the carrier and electrically connected to the electric interconnections. The aspheric lens has an upper surface, a lateral surface, and a bottom surface and the bottom surface is arranged on or near the optoelectric component. The aspheric lens comprises a material which is at least transparent in the specified wavelength range. The reflective layer comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface of the aspheric lens, and wherein the reflective material is at least partly reflective in the specified wavelength range.
    Type: Application
    Filed: November 4, 2016
    Publication date: November 8, 2018
    Applicant: ams AG
    Inventors: David MEHRL, Thomas BODNER, Gregor TOSCHKOFF, Harald ETSCHMAIER, Franz SCHRANK
  • Publication number: 20180226514
    Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.
    Type: Application
    Filed: July 22, 2016
    Publication date: August 9, 2018
    Inventors: Harald ETSCHMAIER, Gregor TOSCHKOFF, Thomas BODNER, Franz SCHRANK
  • Patent number: 9991177
    Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: June 5, 2018
    Assignee: ams AG
    Inventors: Helene Gehles, Thomas Bodner, Joerg Siegert
  • Publication number: 20180090393
    Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.
    Type: Application
    Filed: November 29, 2017
    Publication date: March 29, 2018
    Inventors: Helene GEHLES, Thomas BODNER, Joerg SIEGERT
  • Patent number: 9929035
    Abstract: A relief structure is formed on a surface of a carrier provided for accommodating a wafer, which is fastened to the carrier by a removable adhesive contacting the carrier. The relief structure, which may be spatially confined to the center of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300° C. or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: March 27, 2018
    Assignee: ams AG
    Inventors: Thomas Bodner, Joerg Siegert, Martin Schrems
  • Patent number: 9852955
    Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: December 26, 2017
    Assignee: AMS AG
    Inventors: Helene Gehles, Thomas Bodner, Joerg Siegert
  • Publication number: 20170357683
    Abstract: A system and method include reception, at a primary storage unit, of a first write request from a client including a first key and a first value, persisting of the first value in a first non-volatile memory of the primary storage unit in association with the first key, broadcast of the first write request and a first set of globally-durable keys to the one or more secondary storage units, reception, from each of the one or more secondary storage units, of an acknowledgement of the first write request and a first set of locally-durable keys, each of the first sets of locally-durable keys including the first key, reception, at the primary storage unit, of a second write request from the client including a second key and a second value, persisting of the second value in the first non-volatile memory in association with the second key, and broadcast of the second write request and a second set of globally-durable keys to the one or more secondary storage units, the second set of locally-durable keys including the
    Type: Application
    Filed: June 13, 2016
    Publication date: December 14, 2017
    Inventors: Peter Bumbulis, Jeffrey Pound, Nathan Auch, Anil Kumar Goel, Matthias Ringwald, Thomas Bodner, Scott MacLean
  • Publication number: 20170133281
    Abstract: According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.
    Type: Application
    Filed: November 3, 2016
    Publication date: May 11, 2017
    Inventors: Helene RICHTER, Thomas BODNER, Joerg SIEGERT
  • Publication number: 20150348817
    Abstract: A relief structure is formed on a surface of a carrier provided for accommodating a wafer, which is fastened to the carrier by a removable adhesive contacting the carrier. The relief structure, which may be spatially confined to the centre of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300° C. or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier.
    Type: Application
    Filed: December 19, 2013
    Publication date: December 3, 2015
    Inventors: Thomas BODNER, Joerg SIEGERT, Martin SCHREMS