Abstract: A process for heat integration in engineering processes is provided in which, in a heat carrier circuit, a heat carrier medium takes up heat from a first process stream in a first heat exchanger and releases it to a refrigeration system. In a refrigerant circuit, a refrigerant is cooled in the refrigeration system and the refrigerant takes up heat from a second process stream in a second heat exchanger or a second process stream is cooled in the refrigeration system. The first process stream is a vapor stream from a thermal separation apparatus, and the temperature of the heat carrier medium is increased by heat supply between egress from the first heat exchanger and ingress into the refrigeration system.

Abstract: A process for heat integration in engineering processes in which, in a heat carrier circuit (10), a heat carrier medium takes up heat from a first process stream (14) in a first heat exchanger (12) and releases it to a refrigeration system (30), in addition in a refrigerant circuit (20) a refrigerant is cooled in the refrigeration system (30) and the refrigerant takes up heat from a second process stream (24) in a second heat exchanger (22) or a second process stream (24) is cooled in the refrigeration system (30), wherein the first process stream (14) is a vapor stream from a thermal separation apparatus, and the temperature of the heat carrier medium is increased by heat supply between egress from the first heat exchanger (12) and ingress into the refrigeration system (30).