Abstract: Evaporated receptacles for inkjet deposited polymeric light-emitting diode (PLED)/organic light-emitting diode (OLED) and a method of making the same. The evaporated receptacles are formed via a shadow mask vacuum deposition process. The method of forming a light-emitting display includes forming an electrode on a substrate, forming a receptacle structure over the electrode via a shadow mask vacuum deposition process, and delivering a quantity of polymeric solution, which contains a light-emitting material, into the receptacle via a standard inkjet deposition process.

Abstract: An electronic circuit with repetitive patterns formed by shadow mask vapor deposition includes a repetitive pattern of electronic circuit elements formed on a substrate. Each electronic circuit element includes the following elements in the desired order of deposition: a first semiconductor segment, a second semiconductor segment, a first metal segment, a second metal segment, a third metal segment, a fourth metal segment, a fifth metal segment, a sixth metal segment, a first insulator segment, a second insulator segment, a third insulator segment, a seventh metal segment, an eighth metal segment, a ninth metal segment and a tenth metal segment. All of the above segments may be deposited via a shadow mask deposition process. The electronic circuit element may be an element of an array of like electronic circuit elements.

Abstract: A shadow mask deposition system includes a plurality of identical shadow masks arranged in a number of stacks to form a like number of compound shadow masks, each of which is disposed in a deposition vacuum vessel along with a material deposition source. Materials from the material deposition sources are deposited on the substrate via openings in corresponding compound shadow masks, each opening being formed by the whole or partial alignment of apertures in the shadow masks forming the compound shadow mask, to form an array of electronic elements on the substrate.

Abstract: A system and method for providing an active array of temperature sensing and cooling elements, including an active heatsink which further includes an active temperature sensing layer, a thermoelectric cooling layer, and a heatsink, which further includes a plurality of cooling channels. The temperature sensing element within the active temperature sensing layer includes a plurality of switching transistors, a linear transistor, a current sense resistor, a thermistor, a voltage sensing bus, a voltage setting bus, a current measurement bus, a measurement switching bus, a sense control bus, a storage capacitor, and a supply voltage, all under the control of a process control computer. The method of using an active array of temperature sensing and cooling elements includes the steps of aligning the shadow mask, depositing the material, detecting a thermal gradient, and controlling the thermoelectric cooling.

Abstract: Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least two shadow masks associated therewith. Each of the two masks is alternately positioned within the corresponding deposition vessel for patterning the deposition material onto the substrate through apertures in the mask positioned therein, and positioned in an adjacent cleaning vessel for mask cleaning. The patterning onto the substrate and the cleaning of at least one of the masks are performed concurrently.

Abstract: Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.

Abstract: A shadow mask deposition system includes a plurality of identical shadow masks arranged in a number of stacks to form a like number of compound shadow masks, each of which is disposed in a deposition vacuum vessel along with a material deposition source. Materials from the material deposition sources are deposited on the substrate via openings in corresponding compound shadow masks, each opening being formed by the whole or partial alignment of apertures in the shadow masks forming the compound shadow mask, to form an array of electronic elements on the substrate.

Abstract: An LCD pixel includes a first conductive segment connected to a first bus, a first insulator segment on the first conductive segment, a second conductive segment on the first insulator segment, a liquid crystal material on the second conductive segment, a third conductive segment on the liquid crystal material, and a thin film transistor having a control terminal, a first power terminal and second power terminal connected to a second bus, a third bus and the second conductive segment, respectively. In response to application of a suitable signal on the second bus when reference voltages are present on the first bus and on the third conductive segment, and a voltage is applied to the third bus, the thin film transistor is operative for charging a capacitor formed by the first conductive segment, the first insulator segment and the second conductive segment and for activating the liquid crystal material.

Abstract: In a shadow mask vapor deposition system, a first conductor is vapor deposited on a substrate and an insulator is vapor deposited on the first conductor. A second conductor is then vapor deposited on at least the insulator. The insulator layer is plasma etched either before or after the vapor deposition of the second conductor to define in the insulator layer a via hole through which at least a portion of the first conductor is exposed. An electrical connection is established between the first and second conductors by way of the via hole.

Abstract: Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.

Abstract: A multi-layer electronic device can be formed to include an insulative substrate (212), a first vapor deposited conductor layer (312) on the insulative substrate (212), a first vapor deposited insulator layer (314) on the first conductor layer (312), the first insulator layer (314) having at least one via hole (316) therein, and a vapor deposited conductive filler (320) in the via hole (316) of the first insulator layer (314). Desirably, the conductive filler (320) is deposited in the via hole (316) of the first insulator layer (314) such that the surface of the conductive filler (320) opposite the first conductor layer (312) is substantially planar with the surface of the first insulator layer (314) opposite the first conductor layer (312).

Abstract: The present invention is a substrate holder system for and method of providing a substrate-to-mask alignment mechanism, securing mechanism and temperature control mechanism. The substrate holder system is suitable for use in an automated shadow mask vacuum deposition process. The substrate holder system includes a system controller, and a substrate arranged between a magnetic chuck assembly and a mask holder assembly. The magnetic chuck assembly includes a magnetic chuck, a thermoelectric device, a plurality of thermal sensors and a plurality of light sources. The mask holder assembly includes a shadow mask, a mask holder, a motion control system and a plurality of cameras. The substrate holder system of the present invention provides close contact between the substrate and the shadow mask thereby avoiding the possibility of evaporant material entering into a gap therebetween.

Abstract: A system and method for active array temperature sensing and cooling. The system includes an active temperature sensing layer, a thermoelectric cooling layer and a heatsink layer. The temperature sensing layer is formed of temperature sensing elements that sense the temperature gradient across an unevenly heated region of the active array substrate. The thermoelectric cooling layer controls the temperature gradient sensed by the temperature sensing layer. The heatsink layer includes a plurality of cooling channels for absorbing thermal energy from the unevenly heated region. The system is under the control of a process control computer.

Abstract: Evaporated receptacles for inkjet deposited polymeric light-emitting diode (PLED)/organic light-emitting diode (OLED) and a method of making the same. The evaporated receptacles are formed via a shadow mask vacuum deposition process. The method of forming a light-emitting display includes forming an electrode on a substrate, forming a receptacle structure over the electrode via a shadow mask vacuum deposition process, and delivering a quantity of polymeric solution, which contains a light-emitting material, into the receptacle via a standard inkjet deposition process.

Abstract: A scalable tiled display assembly that includes an array of independently addressed active-matrix organic light-emitting diode (OLED) display tiles cabled to a central control module. Each display tile includes a frame, a driver sub-module, and a flat ribbon cable for connecting the driver sub-module to the display tile. Furthermore, column and row drivers are integrated within each display tile for improved performance and minimal external connections. The invention further includes a method of forming a scalable tiled display system that includes the steps of assembling a plurality of display tile assemblies, determining the viewable area of the display, assembling an array of display tile assemblies according to the desired viewable area, and activating the scalable tiled display system.

Abstract: A deposition system uses the same low coefficient of thermal expansion (CTE) material, for example, a CTE of below 10 ppm/° C. in the temperature range of 0-200° C., for forming both a shadow mask and a substrate upon which depositions occur in order to overcome the heating effects of a high-temperature deposition process, thereby ensuring a uniform expansion and contraction rate of the shadow mask and the substrate.

Abstract: The present invention is a two-layer shadow mask with small dimension apertures and method of making and using same. The two-layer shadow mask of the present invention is suitable for use for manufacturing an electronic device via deposition in a production system. The two-layer shadow mask of the present invention is formed by a first thick mask, which includes a plurality of apertures that has been formed, for example, by etching, bonded to a second, comparatively thin mask, that has been formed by an electrolytic process, and which includes a plurality of apertures that has been patterned by a photoresist. The second mask is aligned and bonded atop the first mask, with their respective apertures desirably offset one to another. The offset amount of the respective apertures of the two-layer shadow mask determines the resulting final aperture dimension, which may approach 0 microns, through which material is deposited upon a substrate in a deposition production system.

Abstract: A vapor deposition shadow mask system includes a number of series connected vacuum vessels each having a material deposition source and shadow mask positioned therein. A substrate is translated along a path that has a longitudinal axis that extends through the vacuum vessels. Centers of shadow masks in first and second vacuum vessels are offset laterally on opposite sides of the longitudinal axis. The system is operative for deposition material on a second area of the substrate via the material deposition source and shadow mask in the second vacuum vessel in a manner that overlaps a portion of the material deposited on a first, adjacent area of the substrate via the material deposition source and shadow mask in the first vacuum vessel.