Patents by Inventor Thomas Byunghak Cho

Thomas Byunghak Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230024260
    Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.
    Type: Application
    Filed: October 3, 2022
    Publication date: January 26, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dooseok CHOI, Youngki LEE, Sunwoo LEE, Thomas Byunghak CHO
  • Patent number: 11515843
    Abstract: A receiver includes an amplification block supporting carrier aggregation (CA). The amplification block includes a first amplifier circuit configured to receive a radio frequency (RF) input signal at a block node from an outside source, amplify the RF input signal, and output the amplified RF input signal as a first RF output signal. The first amplifier circuit includes a first amplifier configured to receive the RF input signal through a first input node to amplify the RF input signal, and a first feedback circuit coupled between the first input node and a first internal amplification node of the first amplifier to provide feedback to the first amplifier.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: November 29, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Min Kim, Jong-Soo Lee, Jong-Woo Lee, Joong-Ho Lee, Ji-Young Lee, Pil-Sung Jang, Thomas Byunghak Cho, Tae-Hwan Jin
  • Patent number: 11462831
    Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 4, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dooseok Choi, Youngki Lee, Sunwoo Lee, Thomas Byunghak Cho
  • Patent number: 11385526
    Abstract: In a method of processing an image, a first image including a plurality of objects and image information associated with the first image are obtained. Image processing information associated with an image operation to be performed on the first image is obtained based on an object among the plurality of objects included in the first image and a user command specified in at least one of voice information of a user and touch information from the user. A second image is generated by performing the image operation on the first image based on the image information and the image processing information.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: July 12, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hansol Kang, Thomas Byunghak Cho
  • Patent number: 11177550
    Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dooseok Choi, Thomas Byunghak Cho, Seung-chan Heo
  • Publication number: 20210226588
    Abstract: A receiver includes an amplification block supporting carrier aggregation (CA). The amplification block includes a first amplifier circuit configured to receive a radio frequency (RF) input signal at a block node from an outside source, amplify the RF input signal, and output the amplified RF input signal as a first RF output signal. The first amplifier circuit includes a first amplifier configured to receive the RF input signal through a first input node to amplify the RF input signal, and a first feedback circuit coupled between the first input node and a first internal amplification node of the first amplifier to provide feedback to the first amplifier.
    Type: Application
    Filed: April 6, 2021
    Publication date: July 22, 2021
    Inventors: YOUNG-MIN KIM, Jong-Soo Lee, Jong-Woo Lee, Joong-Ho Lee, Ji-Young Lee, Pil-Sung Jang, Thomas Byunghak Cho, Tae-Hwan Jin
  • Publication number: 20210149274
    Abstract: In a method of processing an image, a first image including a plurality of objects and image information associated with the first image are obtained. Image processing information associated with an image operation to be performed on the first image is obtained based on an object among the plurality of objects included in the first image and a user command specified in at least one of voice information of a user and touch information from the user. A second image is generated by performing the image operation on the first image based on the image information and the image processing information.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 20, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hansol Kang, Thomas Byunghak Cho
  • Patent number: 11005426
    Abstract: A receiver includes an amplification block supporting carrier aggregation (CA). The amplification block includes a first amplifier circuit configured to receive a radio frequency (RF) input signal at a block node from an outside source, amplify the RF input signal, and output the amplified RF input signal as a first RF output signal. The first amplifier circuit includes a first amplifier configured to receive the RF input signal through a first input node to amplify the RF input signal, and a first feedback circuit coupled between the first input node and a first internal amplification node of the first amplifier to provide feedback to the first amplifier.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: May 11, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Min Kim, Jong-Soo Lee, Jong-Woo Lee, Joong-Ho Lee, Ji-Young Lee, Pil-Sung Jang, Thomas Byunghak Cho, Tae-Hwan Jin
  • Patent number: 10979150
    Abstract: A method of testing a radio frequency (RF) integrated circuit includes: forming, performed by the RF integrated circuit, a test loop that passes through a first transceiver circuit, a first front-end circuit, and a second transceiver circuit, based on a test control signal transmitted from a test device; adjusting, performed by the RF integrated circuit, a shift degree of at least one phase shifter in the first front-end circuit, based on the test control circuit; and receiving, performed by the RF integrated circuit, a test input signal via the first transceiver circuit from the test device, and outputting, to the test device, the test input signal that has passed through the test loop, wherein the test input signal is output as a test output signal via the second transceiver circuit.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dooseok Choi, Dae-young Yoon, Sun-woo Lee, Thomas Byunghak Cho, Seung-chan Heo
  • Patent number: 10742302
    Abstract: A wireless communication device for transceiving signals by using carrier aggregation is provided. The wireless communication device includes a first antenna configured to transmit a first signal to an outside of the wireless communication device or receive a second signal from the outside; a first transmitter connected to the first antenna via a first node and configured to generate the first signal by combining plural transmitting carrier signals received over a plural transmitting carriers; and a first receiver connected to the first antenna via the first node and configured to divide the second signal into a plural receiving carrier signals received over a plural receiving carriers. The first receiver includes a first receiving amplifier commonly connected to a plural carrier receivers configured to amplify the second signal received from the first antenna and to divide the receiving carrier signals, respectively.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chia-Hsin Wu, Thomas Byunghak Cho, Tae-wan Kim, Joung-hyun Yim, In-young Choi
  • Publication number: 20200136269
    Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.
    Type: Application
    Filed: July 3, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dooseok CHOI, Youngki LEE, Sunwoo LEE, Thomas Byunghak CHO
  • Patent number: 10491161
    Abstract: An apparatus for and method of a supply modulator (SM) for a power amplifier (PA) is provided. The apparatus includes a buck-boost converter, including a supply input connected to a battery voltage (Vbat), and an output; and a buck converter, including a supply input connected to Vbat, an input connected to the output of the buck-boost converter, and an output.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: November 26, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Yong Sik Youn, Seung Chul Lee, Ji Seon Paek, Thomas Byunghak Cho
  • Publication number: 20190326977
    Abstract: A wireless communication device for transceiving signals by using carrier aggregation is provided. The wireless communication device includes a first antenna configured to transmit a first signal to an outside of the wireless communication device or receive a second signal from the outside; a first transmitter connected to the first antenna via a first node and configured to generate the first signal by combining plural transmitting carrier signals received over a plural transmitting carriers; and a first receiver connected to the first antenna via the first node and configured to divide the second signal into a plural receiving carrier signals received over a plural receiving carriers. The first receiver includes a first receiving amplifier commonly connected to a plural carrier receivers configured to amplify the second signal received from the first antenna and to divide the receiving carrier signals, respectively.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 24, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chia-Hsin WU, Thomas Byunghak Cho, Tae-wan Kim, Joung-hyun Yim, In-young Choi
  • Publication number: 20190319717
    Abstract: A method of testing a radio frequency (RF) integrated circuit includes: forming, performed by the RF integrated circuit, a test loop that passes through a first transceiver circuit, a first front-end circuit, and a second transceiver circuit, based on a test control signal transmitted from a test device; adjusting, performed by the RF integrated circuit, a shift degree of at least one phase shifter in the first front-end circuit, based on the test control circuit; and receiving, performed by the RF integrated circuit, a test input signal via the first transceiver circuit from the test device, and outputting, to the test device, the test input signal that has passed through the test loop, wherein the test input signal is output as a test output signal via the second transceiver circuit.
    Type: Application
    Filed: March 18, 2019
    Publication date: October 17, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dooseok CHOI, Dae-young YOON, Sun-woo LEE, Thomas Byunghak CHO, Seung-chan HEO
  • Publication number: 20190312553
    Abstract: A receiver includes an amplification block supporting carrier aggregation (CA). The amplification block includes a first amplifier circuit configured to receive a radio frequency (RF) input signal at a block node from an outside source, amplify the RF input signal, and output the amplified RF input signal as a first RF output signal. The first amplifier circuit includes a first amplifier configured to receive the RF input signal through a first input node to amplify the RF input signal, and a first feedback circuit coupled between the first input node and a first internal amplification node of the first amplifier to provide feedback to the first amplifier.
    Type: Application
    Filed: March 1, 2019
    Publication date: October 10, 2019
    Inventors: YOUNG-MIN KIM, Jong-Soo Lee, Jong-Woo Lee, Joong-Ho Lee, Ji-Young Lee, Pil-Sung Jang, Thomas Byunghak Cho, Tae-Hwan Jin
  • Patent number: 10374850
    Abstract: A wireless terminal is provided that includes a first receiver that includes a first input unit configured to perform impedance matching on a first reception signal to output a first RF input signal. A first amplification unit is configured to amplify the first RF input signal to output one or more first RF output signals in an inter-band CA mode and an intra-band CA mode. A first output unit is configured to down-convert at least one of the one or more first RF output signals to a baseband. A second receiver includes a second output unit. In the intra-band CA mode, the one or more first RF output signals includes a first RF signal and a second RF signal, and the first amplification unit is further configured to provide the first output unit with the first RF signal and provide the second output unit with the second RF signal.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: August 6, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Young-min Kim, Pil-sung Jang, Thomas Byunghak Cho, Seung-chan Heo
  • Publication number: 20190214703
    Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.
    Type: Application
    Filed: November 6, 2018
    Publication date: July 11, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dooseok CHOI, Thomas Byunghak CHO, Seung-chan HEO
  • Patent number: 10165566
    Abstract: Disclosed are a transmitter and method of combining multiple contiguous and non-contiguous frequency bands in a wireless communication system using carrier aggregation. The transmitter includes a first communication unit for converting a first baseband signal into a first RF signal of a first band, a second communication unit for converting a second baseband signal into a second RF signal of a second band, a combiner for outputting a third RF signal by combining the first RF signal and the second RF signal, and an amplifier for amplifying the third RF signal.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: December 25, 2018
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Seongsik Myoung, Thomas Byunghak Cho, Seungchan Heo
  • Publication number: 20180278449
    Abstract: A wireless terminal is provided that includes a first receiver that includes a first input unit configured to perform impedance matching on a first reception signal to output a first RF input signal. A first amplification unit is configured to amplify the first RF input signal to output one or more first RF output signals in an inter-band CA mode and an intra-band CA mode. A first output unit is configured to down-convert at least one of the one or more first RF output signals to a baseband. A second receiver includes a second output unit. In the intra-band CA mode, the one or more first RF output signals includes a first RF signal and a second RF signal, and the first amplification unit is further configured to provide the first output unit with the first RF signal and provide the second output unit with the second RF signal.
    Type: Application
    Filed: June 1, 2018
    Publication date: September 27, 2018
    Inventors: Young-min KIM, Pil-sung Jang, Thomas Byunghak Cho, Seung-chan Heo
  • Patent number: 10031169
    Abstract: The present disclosure provides a method and a phase lock detection apparatus for detecting whether a phase of an output signal is locked to the phase of a reference signal. The apparatus includes a first divider that individually frequency-divides first and second pulse signals, a phase frequency detector that outputs third and fourth pulse signals that correspond to a phase difference between the frequency-divided first and second pulse signals, a second divider that individually frequency-divides the third and fourth pulse signals, and a determiner that determines whether a phase of the second pulse signal is locked, based on the frequency-divided third and fourth pulse signals.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: July 24, 2018
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Manthena Vamshi, Jong-Woo Lee, Thomas Byunghak Cho, Byung-Ki Han