Patents by Inventor Thomas Byunghak Cho
Thomas Byunghak Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230024260Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.Type: ApplicationFiled: October 3, 2022Publication date: January 26, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok CHOI, Youngki LEE, Sunwoo LEE, Thomas Byunghak CHO
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Patent number: 11515843Abstract: A receiver includes an amplification block supporting carrier aggregation (CA). The amplification block includes a first amplifier circuit configured to receive a radio frequency (RF) input signal at a block node from an outside source, amplify the RF input signal, and output the amplified RF input signal as a first RF output signal. The first amplifier circuit includes a first amplifier configured to receive the RF input signal through a first input node to amplify the RF input signal, and a first feedback circuit coupled between the first input node and a first internal amplification node of the first amplifier to provide feedback to the first amplifier.Type: GrantFiled: April 6, 2021Date of Patent: November 29, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Min Kim, Jong-Soo Lee, Jong-Woo Lee, Joong-Ho Lee, Ji-Young Lee, Pil-Sung Jang, Thomas Byunghak Cho, Tae-Hwan Jin
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Patent number: 11462831Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.Type: GrantFiled: July 3, 2019Date of Patent: October 4, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok Choi, Youngki Lee, Sunwoo Lee, Thomas Byunghak Cho
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Patent number: 11385526Abstract: In a method of processing an image, a first image including a plurality of objects and image information associated with the first image are obtained. Image processing information associated with an image operation to be performed on the first image is obtained based on an object among the plurality of objects included in the first image and a user command specified in at least one of voice information of a user and touch information from the user. A second image is generated by performing the image operation on the first image based on the image information and the image processing information.Type: GrantFiled: November 15, 2019Date of Patent: July 12, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Hansol Kang, Thomas Byunghak Cho
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Patent number: 11177550Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.Type: GrantFiled: November 6, 2018Date of Patent: November 16, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok Choi, Thomas Byunghak Cho, Seung-chan Heo
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Publication number: 20210226588Abstract: A receiver includes an amplification block supporting carrier aggregation (CA). The amplification block includes a first amplifier circuit configured to receive a radio frequency (RF) input signal at a block node from an outside source, amplify the RF input signal, and output the amplified RF input signal as a first RF output signal. The first amplifier circuit includes a first amplifier configured to receive the RF input signal through a first input node to amplify the RF input signal, and a first feedback circuit coupled between the first input node and a first internal amplification node of the first amplifier to provide feedback to the first amplifier.Type: ApplicationFiled: April 6, 2021Publication date: July 22, 2021Inventors: YOUNG-MIN KIM, Jong-Soo Lee, Jong-Woo Lee, Joong-Ho Lee, Ji-Young Lee, Pil-Sung Jang, Thomas Byunghak Cho, Tae-Hwan Jin
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Publication number: 20210149274Abstract: In a method of processing an image, a first image including a plurality of objects and image information associated with the first image are obtained. Image processing information associated with an image operation to be performed on the first image is obtained based on an object among the plurality of objects included in the first image and a user command specified in at least one of voice information of a user and touch information from the user. A second image is generated by performing the image operation on the first image based on the image information and the image processing information.Type: ApplicationFiled: November 15, 2019Publication date: May 20, 2021Applicant: Samsung Electronics Co., Ltd.Inventors: Hansol Kang, Thomas Byunghak Cho
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Patent number: 11005426Abstract: A receiver includes an amplification block supporting carrier aggregation (CA). The amplification block includes a first amplifier circuit configured to receive a radio frequency (RF) input signal at a block node from an outside source, amplify the RF input signal, and output the amplified RF input signal as a first RF output signal. The first amplifier circuit includes a first amplifier configured to receive the RF input signal through a first input node to amplify the RF input signal, and a first feedback circuit coupled between the first input node and a first internal amplification node of the first amplifier to provide feedback to the first amplifier.Type: GrantFiled: March 1, 2019Date of Patent: May 11, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Min Kim, Jong-Soo Lee, Jong-Woo Lee, Joong-Ho Lee, Ji-Young Lee, Pil-Sung Jang, Thomas Byunghak Cho, Tae-Hwan Jin
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Patent number: 10979150Abstract: A method of testing a radio frequency (RF) integrated circuit includes: forming, performed by the RF integrated circuit, a test loop that passes through a first transceiver circuit, a first front-end circuit, and a second transceiver circuit, based on a test control signal transmitted from a test device; adjusting, performed by the RF integrated circuit, a shift degree of at least one phase shifter in the first front-end circuit, based on the test control circuit; and receiving, performed by the RF integrated circuit, a test input signal via the first transceiver circuit from the test device, and outputting, to the test device, the test input signal that has passed through the test loop, wherein the test input signal is output as a test output signal via the second transceiver circuit.Type: GrantFiled: March 18, 2019Date of Patent: April 13, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok Choi, Dae-young Yoon, Sun-woo Lee, Thomas Byunghak Cho, Seung-chan Heo
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Patent number: 10742302Abstract: A wireless communication device for transceiving signals by using carrier aggregation is provided. The wireless communication device includes a first antenna configured to transmit a first signal to an outside of the wireless communication device or receive a second signal from the outside; a first transmitter connected to the first antenna via a first node and configured to generate the first signal by combining plural transmitting carrier signals received over a plural transmitting carriers; and a first receiver connected to the first antenna via the first node and configured to divide the second signal into a plural receiving carrier signals received over a plural receiving carriers. The first receiver includes a first receiving amplifier commonly connected to a plural carrier receivers configured to amplify the second signal received from the first antenna and to divide the receiving carrier signals, respectively.Type: GrantFiled: April 4, 2019Date of Patent: August 11, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chia-Hsin Wu, Thomas Byunghak Cho, Tae-wan Kim, Joung-hyun Yim, In-young Choi
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Publication number: 20200136269Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.Type: ApplicationFiled: July 3, 2019Publication date: April 30, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok CHOI, Youngki LEE, Sunwoo LEE, Thomas Byunghak CHO
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Patent number: 10491161Abstract: An apparatus for and method of a supply modulator (SM) for a power amplifier (PA) is provided. The apparatus includes a buck-boost converter, including a supply input connected to a battery voltage (Vbat), and an output; and a buck converter, including a supply input connected to Vbat, an input connected to the output of the buck-boost converter, and an output.Type: GrantFiled: March 15, 2017Date of Patent: November 26, 2019Assignee: Samsung Electronics Co., LtdInventors: Yong Sik Youn, Seung Chul Lee, Ji Seon Paek, Thomas Byunghak Cho
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Publication number: 20190326977Abstract: A wireless communication device for transceiving signals by using carrier aggregation is provided. The wireless communication device includes a first antenna configured to transmit a first signal to an outside of the wireless communication device or receive a second signal from the outside; a first transmitter connected to the first antenna via a first node and configured to generate the first signal by combining plural transmitting carrier signals received over a plural transmitting carriers; and a first receiver connected to the first antenna via the first node and configured to divide the second signal into a plural receiving carrier signals received over a plural receiving carriers. The first receiver includes a first receiving amplifier commonly connected to a plural carrier receivers configured to amplify the second signal received from the first antenna and to divide the receiving carrier signals, respectively.Type: ApplicationFiled: April 4, 2019Publication date: October 24, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chia-Hsin WU, Thomas Byunghak Cho, Tae-wan Kim, Joung-hyun Yim, In-young Choi
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Publication number: 20190319717Abstract: A method of testing a radio frequency (RF) integrated circuit includes: forming, performed by the RF integrated circuit, a test loop that passes through a first transceiver circuit, a first front-end circuit, and a second transceiver circuit, based on a test control signal transmitted from a test device; adjusting, performed by the RF integrated circuit, a shift degree of at least one phase shifter in the first front-end circuit, based on the test control circuit; and receiving, performed by the RF integrated circuit, a test input signal via the first transceiver circuit from the test device, and outputting, to the test device, the test input signal that has passed through the test loop, wherein the test input signal is output as a test output signal via the second transceiver circuit.Type: ApplicationFiled: March 18, 2019Publication date: October 17, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dooseok CHOI, Dae-young YOON, Sun-woo LEE, Thomas Byunghak CHO, Seung-chan HEO
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Publication number: 20190312553Abstract: A receiver includes an amplification block supporting carrier aggregation (CA). The amplification block includes a first amplifier circuit configured to receive a radio frequency (RF) input signal at a block node from an outside source, amplify the RF input signal, and output the amplified RF input signal as a first RF output signal. The first amplifier circuit includes a first amplifier configured to receive the RF input signal through a first input node to amplify the RF input signal, and a first feedback circuit coupled between the first input node and a first internal amplification node of the first amplifier to provide feedback to the first amplifier.Type: ApplicationFiled: March 1, 2019Publication date: October 10, 2019Inventors: YOUNG-MIN KIM, Jong-Soo Lee, Jong-Woo Lee, Joong-Ho Lee, Ji-Young Lee, Pil-Sung Jang, Thomas Byunghak Cho, Tae-Hwan Jin
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Patent number: 10374850Abstract: A wireless terminal is provided that includes a first receiver that includes a first input unit configured to perform impedance matching on a first reception signal to output a first RF input signal. A first amplification unit is configured to amplify the first RF input signal to output one or more first RF output signals in an inter-band CA mode and an intra-band CA mode. A first output unit is configured to down-convert at least one of the one or more first RF output signals to a baseband. A second receiver includes a second output unit. In the intra-band CA mode, the one or more first RF output signals includes a first RF signal and a second RF signal, and the first amplification unit is further configured to provide the first output unit with the first RF signal and provide the second output unit with the second RF signal.Type: GrantFiled: June 1, 2018Date of Patent: August 6, 2019Assignee: Samsung Electronics Co., LtdInventors: Young-min Kim, Pil-sung Jang, Thomas Byunghak Cho, Seung-chan Heo
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Publication number: 20190214703Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.Type: ApplicationFiled: November 6, 2018Publication date: July 11, 2019Applicant: Samsung Electronics Co., Ltd.Inventors: Dooseok CHOI, Thomas Byunghak CHO, Seung-chan HEO
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Patent number: 10165566Abstract: Disclosed are a transmitter and method of combining multiple contiguous and non-contiguous frequency bands in a wireless communication system using carrier aggregation. The transmitter includes a first communication unit for converting a first baseband signal into a first RF signal of a first band, a second communication unit for converting a second baseband signal into a second RF signal of a second band, a combiner for outputting a third RF signal by combining the first RF signal and the second RF signal, and an amplifier for amplifying the third RF signal.Type: GrantFiled: April 18, 2016Date of Patent: December 25, 2018Assignee: Samsung Electronics Co., LtdInventors: Seongsik Myoung, Thomas Byunghak Cho, Seungchan Heo
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Publication number: 20180278449Abstract: A wireless terminal is provided that includes a first receiver that includes a first input unit configured to perform impedance matching on a first reception signal to output a first RF input signal. A first amplification unit is configured to amplify the first RF input signal to output one or more first RF output signals in an inter-band CA mode and an intra-band CA mode. A first output unit is configured to down-convert at least one of the one or more first RF output signals to a baseband. A second receiver includes a second output unit. In the intra-band CA mode, the one or more first RF output signals includes a first RF signal and a second RF signal, and the first amplification unit is further configured to provide the first output unit with the first RF signal and provide the second output unit with the second RF signal.Type: ApplicationFiled: June 1, 2018Publication date: September 27, 2018Inventors: Young-min KIM, Pil-sung Jang, Thomas Byunghak Cho, Seung-chan Heo
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Patent number: 10031169Abstract: The present disclosure provides a method and a phase lock detection apparatus for detecting whether a phase of an output signal is locked to the phase of a reference signal. The apparatus includes a first divider that individually frequency-divides first and second pulse signals, a phase frequency detector that outputs third and fourth pulse signals that correspond to a phase difference between the frequency-divided first and second pulse signals, a second divider that individually frequency-divides the third and fourth pulse signals, and a determiner that determines whether a phase of the second pulse signal is locked, based on the frequency-divided third and fourth pulse signals.Type: GrantFiled: January 22, 2016Date of Patent: July 24, 2018Assignee: Samsung Electronics Co., LtdInventors: Manthena Vamshi, Jong-Woo Lee, Thomas Byunghak Cho, Byung-Ki Han