Patents by Inventor Thomas C. Carrington

Thomas C. Carrington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for inspecting bumped wafers
    Patent number: 6765666
    Abstract: A system for inspecting a component, such as a die formed on a silicon wafer, is provided. The system includes a two dimensional inspection system that can locate one or more features, such as bump contacts on the die, and which can also generate feature coordinate data. The system also includes a three dimensional inspection system that is connected to the two dimensional inspection system, such as through an operating system of a processor. The three dimensional inspection system receives the feature coordinate data and generates inspection control data.
    Type: Grant
    Filed: August 3, 2000
    Date of Patent: July 20, 2004
    Assignee: Semiconductor Technologies & Instruments, Inc.
    Inventors: Clyde Maxwell Guest, Younes Chtioui, Rajiv Roy, Charles K. Harris, Weerakiat Wahawisan, Thomas C. Carrington