Abstract: A transfer device for adhering a transferable material to a target substrate is disclosed. The transfer device includes a supply of transfer substrate. The transfer substrate has a carrying surface and an adhesive-type transferable material provided on the carrying surface. A pressure applicator member has an engaging surface with a release characteristic and is positioned in pressure applying relation adjacent the carrying surface of the transfer substrate. The target substrate may be passed between the transfer substrate and the pressure applicator member so that the adhesive is transferred to the target substrate. The transfer device also includes a take-up roll for winding up spent portions of the transfer substrate from which the transferable material has been transferred to the target substrate.

Abstract: The present application discloses a master processing apparatus. One aspect of the application relates to the use of a take-up roll in the apparatus. Another aspect of the application relates to the use of a take-up roll in a cartridge mountable to the apparatus. Yet another aspect of the application relates to a cover for the apparatus. Still another aspect of the invention relates to a cartridge including a pressure applying assembly mounted therein.

Abstract: The application discloses an adhesive transfer apparatus comprising a frame, a first feed roll carrying a supply, of an adhesive transfer substrate, and a second feed roll carrying a supply of an adhesive mask substrate. The adhesive transfer substrate has a layer of pressure-sensitive adhesive disposed on an adhesive carrying side thereof. The first and second feed rolls are rotatably mounted to the frame. The adhesive mask substrate has a bonding side to which the adhesive will bond. Tie first and second feed rolls are positioned such that The selected substrate can be inserted between the transfer substrate and the mask substrate.

Abstract: At least one conductive layer runs the length of an EL panel and individual lamps are connected to the conductive layer. In one embodiment of the invention, the electroluminescent layer of the panel does not cover a portion of the front electrode and the conductive layer is electrically coupled to the exposed portion of the front electrode. In another embodiment of the invention, the EL panel includes at least two rear electrodes and the conductive layer is coupled to one of the rear electrodes. An insulating layer between the conductive layer and other parts of the EL panel prevents unintended electrical connections to the conductive layer.

Abstract: An electroluminescent lamp includes a continuous electroluminescent dielectric layer and a patterned rear electrode overlying the electroluminescent dielectric layer, wherein the rear electrode includes at least two conductive segments separated by a gap. An insulating layer fills the gap and a conductive interconnect overlies the insulating layer, joining the segments. The insulating layer spaces the interconnect from the electroluminescent dielectric layer a sufficient distance to reduce the electric field in the electroluminescent dielectric layer below the point at which the lamp appears luminous.

Abstract: An electroluminescent lamp includes at least one bus bar attached to an electrode of the lamp. The bus bar has a gap and a conductive trace bridges the gap. The trace is preferably an isolated segment of the front electrode of the lamp and is made when the front electrode is patterned. The bus bar includes at least one pair of holes extending through the bus bar. The holes each have a diameter less than the width of the bus bar and are spaced along the length of the bus bar. The segment of the bus bar between the holes can be curved to define a path through the holes adjacent the bus bar. A conductive pin through the holes makes electrical contact with the bus bar and is held in place by the holes and the curved segment. The bus bar is an integral connector and the conductive trace is an integral fuse.