Patents by Inventor Thomas C. Hyde

Thomas C. Hyde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for interlayer planarization of semiconductor material
    Patent number: 5257478
    Abstract: A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad.
    Type: Grant
    Filed: January 31, 1992
    Date of Patent: November 2, 1993
    Assignees: Rodel, Inc., Westech Systems, Inc.
    Inventors: Thomas C. Hyde, John V. H. Roberts
  • Apparatus for transporting wafer to and from polishing head
    Patent number: 5095661
    Abstract: Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: March 17, 1992
    Assignee: Westech Systems, Inc.
    Inventors: Gerald L. Gill, Jr., Thomas C. Hyde
  • Apparatus for transporting wafer to and from polishing head
    Patent number: 4944119
    Abstract: Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.
    Type: Grant
    Filed: June 20, 1988
    Date of Patent: July 31, 1990
    Assignee: Westech Systems, Inc.
    Inventors: Gerald L. Gill, Jr., Thomas C. Hyde