Patents by Inventor Thomas C. Rudick

Thomas C. Rudick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Information encoding using wirebonds
    Patent number: 8937010
    Abstract: A method and structure for encoding information on an integrated circuit chip. The method includes selecting a set of chip pads of the integrated circuit chip for encoding the information; encoding the information during a wirebonding process, the wirebonding process comprising forming ball bonds on chip pads of the integrated circuit chip and wedge bonds on leadframe fingers adjacent to one or more edges of the integrated circuit chip, the ball bonds and the wedge bonds connected by respective and integral wires; and wherein the information is encoded by varying one or more wirebonding parameters on each chip pad of the set of chip pads, the wirebonding parameters selected from the group consisting of the location of a ball bond, the diameter of a ball bond, both the location and diameter of a ball bond, the location of a wedge bond and combinations thereof.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: January 20, 2015
    Assignee: International Business Machines Corporation
    Inventors: William E. Bentley, Jr., Nathanial W. Bowe, Alfred J. Brignull, Mark A. DiRocco, Thomas C. Rudick
  • INFORMATION ENCODING USING WIREBONDS
    Publication number: 20140239469
    Abstract: A method and structure for encoding information on an integrated circuit chip. The method includes selecting a set of chip pads of the integrated circuit chip for encoding the information; encoding the information during a wirebonding process, the wirebonding process comprising forming ball bonds on chip pads of the integrated circuit chip and wedge bonds on leadframe fingers adjacent to one or more edges of the integrated circuit chip, the ball bonds and the wedge bonds connected by respective and integral wires; and wherein the information is encoded by varying one or more wirebonding parameters on each chip pad of the set of chip pads, the wirebonding parameters selected from the group consisting of the location of a ball bond, the diameter of a ball bond, both the location and diameter of a ball bond, the location of a wedge bond and combinations thereof.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 28, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William E. Bentley, Jr., Nathanial W. Bowe, Alfred J. Brignull, Mark A. DiRocco, Thomas C. Rudick