Patents by Inventor Thomas C. Speight

Thomas C. Speight has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Differential pressure sensor assembly
    Patent number: 9638597
    Abstract: A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: May 2, 2017
    Assignee: NXP USA, Inc.
    Inventors: Stephen R. Hooper, Darrel R. Frear, Thomas C. Speight
  • Differential Pressure Sensor Assembly
    Publication number: 20160084722
    Abstract: A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.
    Type: Application
    Filed: September 24, 2014
    Publication date: March 24, 2016
    Applicant: FREESCALE SEMICONDUCTOR INC.
    Inventors: Stephen R. Hooper, Darrel R. Frear, Thomas C. Speight