Abstract: An efficient way to fabricate the channels and cavities in a LIMMS device is to form them as matching upper and lower portions each created as a patterned layer of thick film dielectric material deposited on a respective upper or lower substrate. The two portions are adhered together by a patterned layer of adhesive, and hermetically sealed around an outer perimeter. The heater resistors are mounted atop the lower layer, thus suspending them away from that substrate and exposing more of their surface area. Vias can be used to route the conductors for the heaters and the switched signal contacts through the lower substrate to cooperate with surface mount techniques using solder balls on an array of contact pads. These vias can be made hermetic by their placement within the patterned layers of dielectric material and by covering their exposed ends with pads of hermetic metal.

Abstract: A method for depositing material on a channel plate such that the material is registered to one or more channels formed in the channel plate includes filling at least one of the channels with a resist that is not wetted by the material; depositing the material on at least a region of the channel plate that includes at least part of the resist; and then removing the resist. The method may be used, in one embodiment, to apply an adhesive or gasket material that is used in assembling a switch.

Abstract: Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) forming a plurality of channel plate layers in ceramic green sheet, 2) forming at least one channel plate feature in at least one of the channel plate layers, and 3) laminating the channel plate layers to form the channel plate. Switches using ceramic channel plates, and a method for making a switch with a ceramic channel plate, are also disclosed.

Abstract: An X-ray target material comprising an oxide-dispersion strengthened Mo (ODS-Mo) alloy. ODS-Mo refers to molybdenum strengthened by a fine dispersion of insoluble oxide particles of one or more of the following compounds: La2O3, Y2O3 and CeO2. ODS—Mo alloy improves upon the prior art by providing higher and more uniform strength and creep resistance over the applicable temperature range of large brazed graphite targets. This, in conjunction with higher-strength graphite, allows the target to spin faster without causing graphite burst, thus providing improvement in peak power. The recrystallization temperature of the fabricated material is high enough to maintain original properties through all target processing, including a very high-temperature braze cycle.

Abstract: A hedge trimmer is provided with a substantially circular housing and a substantially circular blade having a plurality of cutting elements thereon. The substantially circular blade is mounted within the substantially circular housing and adapted to rotate. A handle projects from the housing. A motor for rotating the circular blade is mounted in the handle. The substantially circular housing is provided with a plurality of digits between which hedge may be received wherein the cutting elements on the rotating circular blade may cut the hedge. The cutting elements on the circular blade may be substantially U-shaped elements equally spaced about the periphery of the substantially circular blade. A plurality of digits may be formed in a circular housing on each side of the handle.

Abstract: An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at least one of the solder terminations of the one or more electronic components (18) and the printed circuit traces (14, 16) of the printed circuit substrate (12) has a secondary finish produced by application of an electrolessly deposited nickel film (26) containing phosphorus which is further plated with gold (28). An indium-tin-lead solder paste (22) is utilized in a soldering process to attached the one or more electronics components (18) to the printed circuit traces (14,16) on the printed circuit board (12), such that the indium-tin-lead solder (22) provides improved solder joint integrity with the secondary finish. The electronic components (18) include semiconductor devices such as ball grid arrays (1000) and flip-chip integrated circuits (1010).

Abstract: A protective coating is utilized to protect the silicon during a wet chemical etch step in the process of making a micromachine, thereby preventing the formation of etched holes or pits in the micromachine. In another embodiment, silicon sacrificial pedestals are used to eliminate or greatly reduces the electrical potential difference between metal on the glass substrate and the silicon, thereby eliminating arcing and the resulting damage to silicon and metal. These pedestals may be removed after the anodic bond.

Abstract: An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).