Abstract: An apparatus for embossing a substrate is provided. The apparatus includes a die with a metal backing layer that carries a polymer layer. The polymer layer has a female pattern formed through laser engraving. The metal backing layer of the die is capable of being magnetically attached to a magnetic cylinder. A counter die is also included and has a metal backing layer that carries a polymer layer. The polymer layer has a male pattern formed thereon through laser engraving. The metal backing layer of the counter die is capable of being magnetically attached to a magnetic cylinder. An alternative apparatus is provided that includes a male and female starting member to aid in aligning the patterns. Another apparatus is included that has male and female register tracts for keeping the die and counter die in register with one another. An associated method is also provided.