Patents by Inventor Thomas Cobb Speight

Thomas Cobb Speight has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10892229
    Abstract: Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is located; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a media shield including at least one metal layer on a top surface of the polymeric gel, wherein the media shield and the polymeric gel are sufficiently flexible to transmit pressure to the pressure sensor.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: January 12, 2021
    Assignee: NXP USA, INC.
    Inventors: Stephen Ryan Hooper, Dwight Lee Daniels, Thomas Cobb Speight, Gary Carl Johnson
  • Publication number: 20200321286
    Abstract: Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is located; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a media shield including at least one metal layer on a top surface of the polymeric gel, wherein the media shield and the polymeric gel are sufficiently flexible to transmit pressure to the pressure sensor.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 8, 2020
    Inventors: Stephen Ryan Hooper, Dwight Lee Daniels, Thomas Cobb Speight, Gary Carl Johnson