Patents by Inventor Thomas D. Boyer

Thomas D. Boyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150033935
    Abstract: Ballistic composite articles comprising a fabric section, an overlay section disposed on the strikeface of the composite article and comprising a thermoplastic resin, and optionally an adhesive layer disposed between the fabric section and the overlay section are described. The ballistic composite articles can provide comparable or improved protection against projectile threats relative to conventional ballistic composites consisting only of a same-type fabric section having comparable area density, as evidenced by comparable V50 values and/lower backface deformation values when tested under the same conditions.
    Type: Application
    Filed: February 28, 2013
    Publication date: February 5, 2015
    Inventors: Thomas D. Boyer, Carmen A. Covelli, Bryce Vanarsdalen
  • Publication number: 20110023202
    Abstract: This invention covers a method of manufacturing a composite laminate comprising the steps of (a) cutting a plurality of ply shapes from prepreg sheet stock, (b) stacking, in the desired order, the prepreg ply shapes to form a subassembly of from 2 to 8 cut plies, the subassembly further comprising at least 2 different ply shapes, (c) pre-consolidating the subassembly under heat and pressure to form a semi-rigid preform, (d) assembling a plurality of semi-rigid preforms into a mold, and (e) consolidating the plurality of preforms under heat and pressure to form a cured composite laminate. The prepreg plies further comprise from 70 to 92% by weight of a fabric made from continuous yarn having a tenacity of at least 20 grams per dtex and a modulus of at least 550 grams per dtex, and from 8 to 30% by weight of a thermoplastic matrix copolymer blend. The composite laminate is particularly useful as an anti-ballistic hard armor laminate in articles such as helmets and other hard armor products.
    Type: Application
    Filed: July 27, 2010
    Publication date: February 3, 2011
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: BRYCE VANARSDALEN, Thomas D. Boyer
  • Publication number: 20040170819
    Abstract: Injection molding encapsulation processes for packaging an object or objects in microcellular foamed material, comprising the steps of providing a mold having a mold cavity, positioning at least one object in the mold cavity, providing a packaging material, introducing a fluid into the packaging material under conditions sufficient to produce a supercritical fluid-packaging material solution, introducing the solution into the mold cavity, and converting the solution into a microcellular foamed material. Such processes are advantageously employed in encapsulation of electronic or electrical components. Packaged objects produced therefrom may be completely or partially encapsulated.
    Type: Application
    Filed: March 8, 2004
    Publication date: September 2, 2004
    Inventor: Thomas D. Boyer
  • Publication number: 20030077346
    Abstract: An injection molding system is provided. The system includes a source of polymeric material, and an extruder including a screw rotatable within a barrel to convey polymeric material from the source in a downstream direction towards an outlet of the extruder. The system further includes an injection mold defining a cavity connectable to the outlet of the extruder, and an article positioned in the cavity. The article is to be molded along with the polymeric material in the injection mold.
    Type: Application
    Filed: May 21, 2002
    Publication date: April 24, 2003
    Inventors: Thomas D. Boyer, Levi A. Kishbaugh, Roland Y. Kim
  • Publication number: 20020009584
    Abstract: Injection molding encapsulation processes for packaging an object or objects in microcellular foamed material, comprising the steps of providing a mold having a mold cavity, positioning at least one object in the mold cavity, providing a packaging material, introducing a fluid into the packaging material under conditions sufficient to produce a supercritical fluid-packaging material solution, introducing the solution into the mold cavity, and converting the solution into a microcellular foamed material. Such processes are advantageously employed in encapsulation of electronic or electrical components. Packaged objects produced therefrom may be completely or partially encapsulated.
    Type: Application
    Filed: June 13, 2001
    Publication date: January 24, 2002
    Inventor: Thomas D. Boyer