Abstract: An arrangement to reduce refreezing of meltable snow includes a wiper arm configured to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The arrangement also includes a sensor coupled to the wiper arm that is configured to gather and transmit a parameter on the vehicle and environment. The arrangement also includes a processor that is configured to receiving the parameter, determining refreezability of the meltable snow based on the parameter, and defining an action to be performed by the wiper arm.

Abstract: A method to reduce refreezing of meltable snow includes configuring a wiper arm to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The method also includes configuring a sensor coupled to the wiper arm to gather and transmit a parameter on the vehicle and environment. The method also includes configuring a processor to receive the parameter, determine refreezability of the meltable snow based on the parameter, and define an action to be performed by the wiper arm.

Abstract: A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one through via. Using the probing device comprises inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; and responsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.

Abstract: An arrangement to reduce refreezing of meltable snow includes a wiper arm configured to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The arrangement also includes a sensor coupled to the wiper arm that is configured to gather and transmit a parameter on the vehicle and environment. The arrangement also includes a processor that is configured to receiving the parameter, determining refreezability of the meltable snow based on the parameter, and defining an action to be performed by the wiper arm.

Abstract: An arrangement to reduce refreezing of meltable snow includes a wiper arm configured to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The arrangement also includes a sensor coupled to the wiper arm that is configured to gather and transmit a parameter on the vehicle and environment. The arrangement also includes a processor that is configured to receiving the parameter, determining refreezability of the meltable snow based on the parameter, and defining an action to be performed by the wiper arm.

Abstract: A removable, permanent or reconfigurable debug probing device for use in debug probing of a printed circuit assembly, the printed circuit assembly having at least one through via, the debug probing device comprising at least one leader thread configured to be threaded through the at least one through via. Using the probing device comprises inserting a selected one of the at least one leader threads through a selected one of the at least one through via to thereby probe a surface of the printed circuit assembly; and responsive to detecting a defect in the selected through via, using a flexible circuit connected to the selected leader thread to repair the detected defect.

Abstract: A rework device in form of a flexible circuit is provided in order to repair a printed circuit assembly. The printed circuit assembly includes one or more through vias and interconnections. The flexible circuit includes a lead in portion and a tail portion. The flexible circuit also includes a first distended head portion proximal to the lead in portion and a second distended head portion proximal to the tail portion. Further, the second distended head portion is connected to the first distended head portion through a coverlay portion. The flexible circuit provided is adapted to be threaded through a through via to repair the printed circuit assembly.

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract: A method to reduce refreezing of meltable snow includes configuring a wiper arm to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The method also includes configuring a sensor coupled to the wiper arm to gather and transmit a parameter on the vehicle and environment. The method also includes configuring a processor to receive the parameter, determine refreezability of the meltable snow based on the parameter, and define an action to be performed by the wiper arm.

Abstract: An arrangement to reduce refreezing of meltable snow includes a wiper arm configured to wipe the meltable snow from an ambient-facing surface of a window positioned on a vehicle. The arrangement also includes a sensor coupled to the wiper arm that is configured to gather and transmit a parameter on the vehicle and environment. The arrangement also includes a processor that is configured to receiving the parameter, determining refreezability of the meltable snow based on the parameter, and defining an action to be performed by the wiper arm.

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract: A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract: A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.

Abstract: A flex cable is slit between conductor traces to provide conformable strips, at least one of which can be flipped to expose one of the conductor traces to the other side of the cable. This increases the design flexibility of the flex cable because the conductor traces can be exposed on both sides of the cable without laser ablation or etch operations to remove the substrate. Also, because the flex cable is slit along its length, it is more able to conform to different connector locations, thereby obviating the need for designing a different flex cable to accommodate changes in mating hardware.

Abstract: Attachment of electronics to optical devices is made by supporting the optical devices on a heat spreader card and the electronics on a separate circuit card. Each card has at least a first major surface, with an optical transducing subassembly mounted perpendicularly from the major surface of the heat spreader card. Electronics, except for transducing elements, are placed on the circuit card. The only direct attachment between the circuit card and the heat spreader card is one or more flexible cables attached to the respective major surfaces. This arrangement mechanically isolates the circuit card from the heat spreader card. The flexible cables include electrical conductors held positionally in a polyimide matrix, which provides for thermal isolation of the heat spreader card and the circuit card.

Abstract: An alignment apparatus and method that provides a pick and placement tool that picks matrix leaded modules from trays, places the modules into a self-aligning nest, picks the modules from the nest and places them on a printed circuit board. The specific location and orientation of the nest with respect to a printed circuit board is known by the pick and placement tool. Once the nest has aligned the module, the tool picks the module from the nest and places it in the appropriate location on the printed circuit board. The nest has sloped sides that angle toward that bottom and are slippery. These sides funnel the module toward the bottom of the nest and correct gross misalignment. At the bottom inside of the nest are locating features into which the leads of the module fit. Between the locating features are slip surfaces so that the module leads slide into the locating features, correcting fine misalignment.