Patents by Inventor Thomas D. Radcliff
Thomas D. Radcliff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10386100Abstract: In one aspect, a heat exchanger layer for an adsorption bed heat exchanger assembly is provided. The heat exchanger layer includes at least one fluid tube configured to supply a heat transfer fluid, a sorbent containment structure having a plurality of compartments, and a sorbent disposed within the plurality of compartments.Type: GrantFiled: September 11, 2015Date of Patent: August 20, 2019Assignee: CARRIER CORPORATIONInventors: Frederick J. Cogswell, Parmesh Verma, Catherine Thibaud, Bart A. Van Hassel, Thomas D. Radcliff, Subramanyaravi Annapragada, Abdelrahman ElSherbini
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Publication number: 20190242625Abstract: A heat transfer system cycles between a first mode where a heat transfer fluid is directed to a first electrocaloric module and from the first electrocaloric module to a heat exchanger to a second electrocaloric module while one of the first and second electrocaloric modules is energized, and a second mode where the heat transfer fluid is directed to the second electrocaloric module and from the second electrocaloric module to the heat exchanger to the first electrocaloric module, while the other of the first and second electrocaloric modules is energized. The modes are repeatedly cycled in alternating order directing the heat transfer fluid to cause a temperature gradient in each of the first and second electrocaloric modules, and heat is rejected to the fluid from the heat exchanger or is absorbed by the heat exchanger from the fluid.Type: ApplicationFiled: April 19, 2019Publication date: August 8, 2019Inventors: Subramanyaravi Annapragada, Andrzej Ernest Kuczek, Thomas D. Radcliff, Charles E. Lents, Joseph V. Mantese, Scott Alan Eastman, Parmesh Verma, Wei Xie
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Patent number: 10352592Abstract: A vapor compression system (200; 300; 400) has: a compressor (22); a first heat exchanger (30); a second heat exchanger (64); an ejector (38); separator (48); and an expansion device (70). A plurality of conduits are positioned to define a first flowpath sequentially through: the compressor; the first heat exchanger; the ejector from a motive flow inlet through (40) an outlet (44); and the separator, and then branching into: a first branch returning to the compressor; and a second branch passing through the expansion device and second heat exchanger to a secondary flow inlet (42). The plurality of conduits are positioned to define a bypass flowpath (202; 302; 402) bypassing the motive flow inlet and rejoining the first flowpath at essentially separator pressure but away from the separator.Type: GrantFiled: May 26, 2016Date of Patent: July 16, 2019Assignee: Carrier CorporationInventors: Alexander Lifson, Zuojun Shi, Hans-Joachim Huff, Parmesh Verma, Thomas D. Radcliff, Frederick J. Cogswell, Jinliang Wang, Hongsheng Liu
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Patent number: 10267542Abstract: A heat pump system includes a refrigerant circuit, at least one variable speed compressor operating with a maximum pressure ratio of at least 5.0 and a variable speed range of at least three times (3×), a heat absorption heat exchanger, a heat rejection heat exchanger, an ejector disposed on the refrigerant circuit upstream of the compressor to extend a pressure ratio range and a volumetric flow range of the compressor in the cold climates, a separator disposed downstream of the ejector and upstream of the heat absorption heat exchanger, and at least one variable speed fan configured to move air through the heat rejection heat exchanger to provide a predefined an air discharge temperature greater than 90° F. A two-phase refrigerant is provided to an inlet of the heat absorption heat exchanger with a quality of less than or equal to 0.05.Type: GrantFiled: March 31, 2016Date of Patent: April 23, 2019Assignee: CARRIER CORPORATIONInventors: Ahmad M. Mahmoud, Parmesh Verma, Thomas D. Radcliff, Richard G. Lord, Jeffrey J. Nieter
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Patent number: 10267544Abstract: A heat transfer system cycles between a first mode where a heat transfer fluid is directed to a first electrocaloric module and from the first electrocaloric module to a heat exchanger to a second electrocaloric module while one of the first and second electrocaloric modules is energized, and a second mode where the heat transfer fluid is directed to the second electrocaloric module and from the second electrocaloric module to the heat exchanger to the first electrocaloric module, while the other of the first and second electrocaloric modules is energized. The modes are repeatedly cycled in alternating order directing the heat transfer fluid to cause a temperature gradient in each of the first and second electrocaloric modules, and heat is rejected to the fluid from the heat exchanger or is absorbed by the heat exchanger from the fluid.Type: GrantFiled: June 8, 2017Date of Patent: April 23, 2019Assignee: CARRIER CORPORATIONInventors: Subramanyaravi Annapragada, Andrzej Ernest Kuczek, Thomas D. Radcliff, Charles E. Lents, Joseph V. Mantese, Scott Alan Eastman, Parmesh Verma, Wei Xie
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Publication number: 20190039017Abstract: A moisture removal system for removing moisture from a gas is disclosed including a water absorption vessel with a microemulsion. The system also includes a gas-liquid phase separator in fluid communication with a water absorption vessel gas outlet, a gas outlet for conditioned air in fluid communication with a conditioned space, and a liquid outlet. An optional heat exchanger heats used microemulsion from the water absorption for water desorption in a water desorption vessel. An optional microemulsion regenerator provides thermal regeneration of microemulsion from the water desorption vessel for returning regenerated microemulsion to the water absorption vessel.Type: ApplicationFiled: January 25, 2017Publication date: February 7, 2019Inventors: Randolph Carlton McGee, Parmesh Verma, Thomas D. Radcliff, Zissis A. Dardas
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Publication number: 20190033901Abstract: An energy usage sub-metering system of a building management system may include a focal plane array and a computer-based processor coupled to the focal plane array. The focal plane array includes a plurality of radiant energy sensors configured to monitor a predefined space and measure energy radiating from a plurality of objects in the predefined space. The computer-based processor is configured to profile temperatures of the plurality of objects throughout the predefined space in concert with executing heat dissipation algorithms to provide an estimate of energy load.Type: ApplicationFiled: February 6, 2017Publication date: January 31, 2019Inventors: Joseph V. Mantese, Thomas D. Radcliff, Charles E. Lents
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Patent number: 10174975Abstract: A heat transfer system includes a first two-phase heat transfer fluid vapor/compression circulation loop including a compressor, a heat exchanger condenser, an expansion device, and a heat absorption side of a heat exchanger evaporator/condenser. A first conduit in a closed fluid circulation loop circulates a first heat transfer fluid therethrough. A second two-phase heat transfer fluid circulation loop transfers heat to the first heat transfer fluid circulation loop through the heat exchanger evaporator/condenser, including a heat rejection side of the heat exchanger evaporator/condenser, a liquid pump, a liquid refrigerant reservoir located upstream of the liquid pump and downstream of the heat exchanger evaporator/condenser, and a heat exchanger evaporator. A second conduit in a closed fluid circulation loop circulates a second heat transfer fluid therethrough having an ASHRAE Class A toxicity and a Class 1 or 2L flammability rating.Type: GrantFiled: August 14, 2014Date of Patent: January 8, 2019Assignee: CARRIER CORPORATIONInventors: Yinshan Feng, Jinliang Wang, Futao Zhao, Thomas D. Radcliff, Parmesh Verma
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Publication number: 20190003749Abstract: A heating, ventilation, air conditioning and refrigeration (HVAC/R) system includes a sorption circuit including a heat absorption heat exchanger in fluid communication with a primary fluid flow source such that a primary fluid flow from is directed therethrough. The heat absorption heat exchanger is configured to exchange thermal energy between the primary fluid flow and a secondary fluid flow. A sorption heat exchanger includes a sorbent material to adsorb or absorb the primary fluid flow, generating thermal energy. The sorption heat exchanger is configured to transfer the generated thermal energy to a tertiary fluid flow. A heat exchange circuit is in fluid communication with the sorption circuit and includes a control valves connected to both the secondary fluid flow and the tertiary fluid flow configured to selectably direct the secondary fluid flow and/or the tertiary fluid flow to a conditioning heat exchanger or an ambient heat exchanger.Type: ApplicationFiled: October 18, 2016Publication date: January 3, 2019Inventors: Bart Antonie van Hassel, Abdelrahman Elsherbini, Thomas D. Radcliff, Parmesh Verma
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Publication number: 20190003746Abstract: A method of making an electrocaloric element includes dissolving or dispersing an electrocaloric polymer in an organic solvent having a boiling point of less than 100° C. at 1 atmosphere to form a liquid composition comprising the electrocaloric polymer. A film of the liquid composition is cast on a substrate, and the organic solvent is evaporated to form a film of the electrocaloric polymer. The film is removed from the substrate and disposed between electrical conductors to form an electrocaloric element.Type: ApplicationFiled: December 21, 2015Publication date: January 3, 2019Inventors: Wei Xie, Subramanyaravi Annapragada, Joseph V. Mantese, Parmesh Verma, Thomas D. Radcliff
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Publication number: 20190003748Abstract: A heat transfer system is disclosed that includes a plurality of electrocaloric elements (12) including an electrocaloric film (14), a first electrode (16) on a first side of the electrocaloric film, and a second electrode (18) on a second side of the electrocaloric film. A fluid flow path (20) is disposed along the plurality of electrocaloric elements, formed by corrugated fluid flow guide elements (19).Type: ApplicationFiled: December 21, 2015Publication date: January 3, 2019Inventors: Mikhail B. Gorbounov, Parmesh Verma, Subramanyaravi Annapragada, Andrzej E. Kuczek, Matthew E. Lynch, Andrew Smeltz, Neal R. Herring, Ulf J. Jonsson, Thomas D. Radcliff
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Publication number: 20180375008Abstract: A method of making an electrocaloric element includes forming conductive layers on opposing surfaces of a film comprising an electrocaloric material to form an electrocaloric element, wherein the forming of the conductive layers includes one or more of: vapor deposition of the conductive layers under reduced pressure for a duration of time, wherein the duration of time under reduced pressure is less than 240 minutes; vapor deposition of the conductive layers under reduced pressure for a duration of time, wherein the duration of time of exposure to conductive material deposition is less than 240 minutes; vapor deposition of the conductive layers under reduced pressure, wherein the reduced pressure is 10 torr to 500 torr; or maintaining the film at a temperature of less than or equal to 200° C. during forming of the conductive layers.Type: ApplicationFiled: December 21, 2015Publication date: December 27, 2018Inventors: Wei Xie, Subramanyaravi Annapragada, Joseph V. Mantese, Parmesh Verma, Thomas D. Radcliff, William A. Rioux
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Publication number: 20180306486Abstract: An air-temperature conditioning system includes a frost resistant heat exchanger that has an exterior heat transfer surface covered by a hydrophobic coating. An anti-frost device of the air-temperature conditioning system is constructed and arranged to mitigate frost accumulation on the heat exchanger by leveraging characteristics of the hydrophobic coating.Type: ApplicationFiled: October 18, 2016Publication date: October 25, 2018Inventors: Abbas A. Alahyari, Jack Leon Esformes, Thomas D. Radcliff, Sonia Tulyani, Abdelrahman Elsherbini
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Patent number: 10107527Abstract: Embodiments are directed to a heat pump element comprising: a thin-film polymer or ceramic material within a range of 0.1 microns-100 microns thickness, and electrodes coupled to both sides of the thin-film material to form an electroded active thin-film material, wherein the thin-film material is separated by, and in intimate contact with, a heat transfer fluid in channels within a range of 10 microns-10 millimeters thickness, in which the fluid is capable of being translated back and forth through the element by an imposed pressure field.Type: GrantFiled: April 9, 2014Date of Patent: October 23, 2018Assignee: CARRIER CORPORATIONInventors: Thomas D. Radcliff, Joseph V. Mantese, Slade R. Culp, Subramanyaravi Annapragada
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Publication number: 20180187929Abstract: A vapor compression system (200; 400; 600; 700; 800; 900; 1000) comprises a plurality of valves (260, 262, 264; 260) controllable to define a first mode flowpath and a second mode flowpath. The first mode flowpath is sequentially through: a compressor (22); a first heat exchanger (30); a first nozzle (228; 624); and a separator (48), and then branching into: a first branch returning to the compressor; and a second branch passing through an expansion device (70) and a second heat exchanger (64) to the rejoin the flowpath between the first heat exchanger and the separator. The second mode flowpath is sequentially through: the compressor; the second heat exchanger; a second nozzle (248; 625); and the separator, and then branching into: a first branch returning to the compressor; and a second branch passing through the expansion device and first heat exchanger to the rejoin the flowpath between the first heat exchanger and the separator.Type: ApplicationFiled: June 16, 2016Publication date: July 5, 2018Applicant: Carrier CorporationInventors: Hongsheng Liu, Parmesh Verma, Thomas D. Radcliff
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Publication number: 20180156544Abstract: A heat exchanger is provided including a plurality of parallel stacked plates defining at least one flow passage there between. A manifold having a generally hollow interior is arranged adjacent the plurality of parallel plates. An opening is disposed between adjacent stacked plates. The opening is configured to fluidly couple the hollow interior of the manifold and the at least one flow passage. A distributor assembly including an insert is disposed at least partially within the hollow interior of the manifold. The insert includes a plurality of circumferentially spaced axial flow channels and a plurality of radial connecting channels arranged in fluid communication with the axial flow channels. The radial flow channels are fluidly coupled to the at least one flow passage via the opening.Type: ApplicationFiled: June 28, 2016Publication date: June 7, 2018Inventors: Abbas A. Alahyari, Richard Rusich, Thomas D. Radcliff
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Publication number: 20180156499Abstract: A vapor compression system (200; 300; 400) comprising: a compressor (22); a first heat exchanger (30); a second heat exchanger (64); an ejector (38); separator (48); and an expansion device (70). A plurality of conduits are positioned to define a first flowpath sequentially through: the compressor; the first heat exchanger; the ejector from a motive flow inlet through (40) an outlet (44); and the separator, and then branching into: a first branch returning to the compressor; and a second branch passing through the expansion device and second heat exchanger to a secondary flow inlet (42). The plurality of conduits are positioned to define a bypass flowpath (202; 302; 402) bypassing the motive flow inlet and rejoining the first flowpath at essentially separator pressure but away from the separator.Type: ApplicationFiled: May 26, 2016Publication date: June 7, 2018Applicant: Carrier CorporationInventors: Alexander Lifson, Zuojun Shi, Hans-Joachim Huff, Parmesh Verma, Thomas D. Radcliff, Frederick J. Cogswell, Jinliang Wang, Hongsheng Liu
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Patent number: 9989283Abstract: A heat exchanger includes a distribution manifold, a plurality of longitudinally spaced tubes having inlet ends opening into the manifold, and a longitudinally extending distributor body disposed within the manifold. The distributor body has a first surface juxtaposed in spaced relationship with the inlet ends of the plurality of tubes and a second surface interfacing with the manifold inner wall. A plurality of discrete flow passages extend from an inlet end of the distributor body and open through the first surface of the distributor body. The plurality of discrete flow passages includes a plurality of longitudinally extending flow passages formed by channels or grooves extending along the interface of the second surface of the distributor body with the inner wall of the distributor manifold.Type: GrantFiled: June 5, 2014Date of Patent: June 5, 2018Assignee: CARRIER CORPORATIONInventors: Abbas A. Alahyari, Thomas D. Radcliff, Richard Rusich
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Patent number: 9982920Abstract: A method of operating a heat transfer system includes starting operation of a first heat transfer fluid vapor/compression circulation loop including a fluid pumping mechanism, a heat exchanger for rejecting thermal energy from a first heat transfer fluid, and a heat absorption side of an internal heat exchanger. A first conduit in a closed fluid circulation loop circulates the first heat transfer fluid therethrough. Operation of a second two-phase heat transfer fluid circulation loop is started after starting operation of the first heat transfer fluid circulation loop. The second heat transfer fluid circulation loop transfers heat to the first heat transfer fluid circulation loop through the internal heat exchanger and includes a heat rejection side of the internal heat exchanger, a liquid pump, and a heat exchanger evaporator. A second conduit in a closed fluid circulation loop circulates a second heat transfer fluid therethrough.Type: GrantFiled: August 14, 2014Date of Patent: May 29, 2018Assignee: CARRIER CORPORATIONInventors: Yinshan Feng, Jinliang Wang, Futao Zhao, Parmesh Verma, Thomas D. Radcliff
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Patent number: 9857101Abstract: A system (170) has a compressor (22). A heat rejection heat exchanger (30) is coupled to the compressor to receive refrigerant compressed by the compressor. A non-controlled ejector (38) has a primary inlet coupled to the heat rejection exchanger to receive refrigerant, a secondary inlet, and an outlet. The system includes means (172, e.g., a nozzle) for causing a supercritical-to-subcritical transition upstream of the ejector.Type: GrantFiled: July 20, 2011Date of Patent: January 2, 2018Assignee: Carrier CorporationInventors: Thomas D. Radcliff, Parmesh Verma, Jinliang Wang, Frederick J. Cogswell