Abstract: A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.

Abstract: A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.

Abstract: The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.