Patents by Inventor Thomas David Kudrle

Thomas David Kudrle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatically actuated micro-electro-mechanical devices and method of manufacture
    Patent number: 6912078
    Abstract: One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: June 28, 2005
    Assignee: Corning Incorporated
    Inventors: Thomas David Kudrle, Carlos Horacio Mastrangelo, Marc Waelti, ChuanChe Wang, Gordon M. Shedd, Gregory A. Kirkos, Mirela Gabriela Bancu, James Ching-Ming Hsiao
  • Electrostatically actuated micro-electro-mechanical devices and method of manufacture
    Publication number: 20020146200
    Abstract: One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices.
    Type: Application
    Filed: March 15, 2002
    Publication date: October 10, 2002
    Inventors: Thomas David Kudrle, Carlos Horacio Mastrangelo, Marc Waelti, ChuanChe Wang, Gordon M. Shedd, Gregory A. Kirkos, Mirela Gabriela Bancu, James Ching-Ming Hsiao