Abstract: A nozzle 20 has a fluid flow passage 26 which defines a fluid flow path from an inlet 5 end of said passage towards an outlet end of said passage. A restrictor 29a is movable under the control of an actuation system 27 relative to the passage to vary the minimum cross-sectional area of the fluid flow path through the passage. The restrictor 29 is moved to project into the passage to provide a restricted opening in the passage or removed from the passage to allow an unrestricted flow through the 10 passage. The nozzle 20 is particularly suitable for use in a beverage preparation machine to generate microfoam in a beverage. When the restrictor 29 is retracted from the passage 29, the passage and the restrictor can be cleaned by flushing the nozzle. The restrictor 29 may be a pin-like member aligned with the passage and moveable parallel to the axis of the passage.

Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.

Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.