Abstract: At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.

Abstract: At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.

Abstract: At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.

Abstract: An improved DMS filter with electrode structures between a first port and a second port is provided. Wiring junctions are realized in multilayer crossing with dielectric material in between. There are insulating patches (L2) between crossing conductor layers (L1,L3). Signal wirings may be realized with multiple conductor layers (L1, L3) to reduce wiring resistance and the upper conductor layer (L3) of the signal wiring may partly overlap the insulating patches (L2). The insulating patches (L2) may extend over the acoustic path to achieve temperature compensation.

Abstract: At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.

Abstract: An improved DMS filter with electrode structures between a first port and a second port is provided. Wiring junctions are realized in multilayer crossing with dielectric material in between. There are insulating patches (L2) between crossing conductor layers (L1,L3). Signal wirings may be realized with multiple conductor layers (L1, L3) to reduce wiring resistance and the upper conductor layer (L3) of the signal wiring may partly overlap the insulating patches (L2). The insulating patches (L2) may extend over the acoustic path to achieve temperature compensation.

Abstract: A filter arrangement with a large bandwidth is specified, wherein a first and a second filter are connected in parallel between a first and a second node. Both filters are configured as DMS filters and both comprise two DMS tracks each, connected in series. The two filters have different center frequencies and create a common passband together.

Abstract: A SAW filter arrangement (FA) with a large bandwidth is specified, wherein a first filter (F1) and a second filter (F2) are connected in parallel between a first node (K1) and a second node (K2). The first filter (F1) and the second filter (F2) are both SAW filter configurations that are configured as DMS filters and both comprise two DMS tracks each, connected in series (S11, S12; S21, S22). The two filters (F1, F2) have different center frequencies and create a common passband together. The filter arrangement may comprise a serial resonator (RS) and shunting coils (L1, L2).