Abstract: A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs.

Abstract: A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs.

Abstract: In a flat flex cable, signal lines are surrounded by logic ground planes above and below which are viaed together left and right. The ground planes coupled with the flex cable dielectric determine characteristic the impedance and attenuation of the cable and provide differential signal EMI shielding. All signal layers and logic ground planes are enclosed within the two outermost shield layers which are viaed together left and right and around the connectors to enclose both signal layers and logic ground planes to provide common mode EMI shielding.

Abstract: A flex cable pad on pad terminal structure is shown having raised connector pads formed using a rigid stiffener with raised features or bumps formed integral with the stiffener; aligned with the connector pad surfaces; and laminated to the flex cable surface opposite the surface presenting the exposed connector pad surfaces, to create raised contact pads that are not subject to relaxation over time when subjected to high contact normal forces. The use of a metal stiffener which has been coined to produce the raised features aligned with the contact pad locations and lamination using a film or layer of thermocuring adhesive affords an economical process and assembly technique that also effects hot deformation of the flex cable at the contact pad locations.

Abstract: A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.

Abstract: A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.