Patents by Inventor Thomas Dueber

Thomas Dueber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070244267
    Abstract: Compositions comprising: an epoxy containing cyclic olefin resin with a water absorption of 2% or less; one or more phenolic resins with water absorption of less than 2% or less; an epoxy catalyst; optionally one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a cure temperature of 190° C. or less.
    Type: Application
    Filed: April 10, 2006
    Publication date: October 18, 2007
    Inventors: Thomas Dueber, John Summers, William Borland, Olga Renovales, Diptarka Majumdar, Daniel Amey
  • Publication number: 20070236859
    Abstract: An organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist printed wiring board chemicals and pass 1000 hours of accelerated life testing conducted under high humidity, elevated temperature and applied DC bias.
    Type: Application
    Filed: April 10, 2006
    Publication date: October 11, 2007
    Inventors: William Borland, Thomas Dueber, John Summers, Olga Renovales, Diptarka Majumdar
  • Publication number: 20070083017
    Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.
    Type: Application
    Filed: October 12, 2005
    Publication date: April 12, 2007
    Inventors: Thomas Dueber, John Summers, Brian Auman, Munirpallam Subramanian, Nyrissa Rogado
  • Publication number: 20070083016
    Abstract: A photosensitive resin composition comprising a pre-imidized aromatic polyimide, which when coated on a silicon wafer, has a light transmittance at a wavelength of 365 nm of at least 1% and imparts low residual stress after cure. The composition can be patterned through I-line exposure followed by development with organic or alkaline solutions, and can be cured at relatively mild temperature to yield low-stress polyimide patterns. Electronic components having the polyimide patterns have high reliability.
    Type: Application
    Filed: May 1, 2006
    Publication date: April 12, 2007
    Inventors: Thomas Dueber, John Summers
  • Publication number: 20060210819
    Abstract: The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250° C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/° C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material.
    Type: Application
    Filed: March 15, 2005
    Publication date: September 21, 2006
    Inventor: Thomas Dueber
  • Publication number: 20060110679
    Abstract: The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.
    Type: Application
    Filed: November 10, 2005
    Publication date: May 25, 2006
    Inventors: Thomas Dueber, Michael West, Kuppsuamy Kanakarajan, Brian Auman
  • Publication number: 20060110678
    Abstract: The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.
    Type: Application
    Filed: November 23, 2004
    Publication date: May 25, 2006
    Inventors: Thomas Dueber, Michael West, Kuppsuamy Kanakarajan, Brian Auman
  • Publication number: 20050154105
    Abstract: A composition comprising: a polymer with a glass transition temperature greater than 250° C. and a water absorption of 2% or less; one or more metals or metal compounds; and an organic solvent. The polymer can optionally include sites that can crosslink with one or more crosslinking agents. The compositions can be used to produce electronic components such as resistors, discrete or planar capacitors, conductive adhesives and electrical and thermal conductors. The invention is also directed to a composition comprising a polymer with a glass transition temperature greater than 250° C. and a water absorption of 2% or less, and an organic solvent. These compositions can also be used in a number of electronic applications such as an encapsulant and as an integrated circuit packaging material.
    Type: Application
    Filed: January 9, 2004
    Publication date: July 14, 2005
    Inventors: John Summers, Thomas Dueber, Cheng-Chung Chen, Xin Fang, John Felten
  • Publication number: 20050154181
    Abstract: Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250° C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.
    Type: Application
    Filed: February 19, 2004
    Publication date: July 14, 2005
    Inventors: Thomas Dueber, John Summers, Xin Fang
  • Publication number: 20050143534
    Abstract: The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150° C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50° C. and 250° C.) that differ by more than 10, 15, 20 25, or 30 ppm/° C.
    Type: Application
    Filed: July 16, 2004
    Publication date: June 30, 2005
    Inventors: Thomas Dueber, Michael West, Brian Auman, Robert Kasowski
  • Publication number: 20050079442
    Abstract: A flexible, aqueous processible, photoimagable coverlay compositions, having advantageous adhesion and release properties and resistance to (unwanted) haloing. The coverlay compositions of the present invention comprise an acrylic, low Tg, graft copolymer binder component, having an alkali resistant backbone-segment and a pendant arm segment comprising hydrophilic moieties. Optionally, the coverlay further comprises a thiophene-type adhesion promoter to further improve adhesion properties.
    Type: Application
    Filed: October 5, 2004
    Publication date: April 14, 2005
    Inventors: Thomas Dueber, Michael Fryd, Mookkan Periyasamy, Frank Schadt, Micahel West