Patents by Inventor Thomas E. Boydston

Thomas E. Boydston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect schemes, and materials and methods for producing the same
    Patent number: 8586871
    Abstract: An interconnect scheme includes a conductive ink forming a plurality of conductive regions, and a dielectric ink occupying spaces between the conductive regions. The conductive ink and the dielectric ink have substantially identical optical, acoustic, and x-ray absorption properties, thereby making the interconnect scheme tamper-resistant and/or difficult to identify and reverse-engineer using conventional detection methods.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: November 19, 2013
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Jonathan J. Bernstein, Brian R. Smith, Thomas E. Boydston
  • Interconnect Schemes, and Materials and Methods for Producing the Same
    Publication number: 20130021758
    Abstract: An interconnect scheme includes a conductive ink forming a plurality of conductive regions, and a dielectric ink occupying spaces between the conductive regions. The conductive ink and the dielectric ink have substantially identical optical, acoustic, and x-ray absorption properties, thereby making the interconnect scheme tamper-resistant and/or difficult to identify and reverse-engineer using conventional detection methods.
    Type: Application
    Filed: July 19, 2011
    Publication date: January 24, 2013
    Inventors: Jonathan J. Bernstein, Brian R. Smith, Thomas E. Boydston