Patents by Inventor Thomas E. Brake

Thomas E. Brake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and systems for use in grind shape control adaptation
    Patent number: 9457446
    Abstract: A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: October 4, 2016
    Assignee: Strasbaugh
    Inventors: Thomas E. Brake, William J. Kalenian, David L. Grant
  • Systems and methods of processing substrates
    Patent number: 9393669
    Abstract: Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: July 19, 2016
    Assignee: Strasbaugh
    Inventors: William J. Kalenian, Thomas A. Walsh, Michael R. Vogtmann, Benjamin C. Smedley, Larry A. Spiegel, Thomas E. Brake
  • METHODS AND SYSTEMS FOR USE IN GRIND SHAPE CONTROL ADAPTATION
    Publication number: 20140134923
    Abstract: A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.
    Type: Application
    Filed: September 30, 2013
    Publication date: May 15, 2014
    Applicant: Strasbaugh
    Inventors: Thomas E. Brake, William J. Kalenian, David L. Grant