Patents by Inventor Thomas E. Gartner, III

Thomas E. Gartner, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHEMICAL MECHANICAL POLISHING PROCESS AND SLURRY CONTAINING SILICON NANOPARTICLES
    Publication number: 20140199842
    Abstract: In one aspect, a substrate chemical mechanical polishing (CMP) method for substrates is disclosed. The CMP method includes providing a substrate having a surface of silicon and copper such as through silicon via regions containing copper, and polishing the surface with a slurry containing very small silicon nanoparticles (e.g., having an average diameter less than 8 nanometers). CMP systems and slurries for CMP are provided, as are numerous other aspects.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 17, 2014
    Inventors: Vishwas V. Hardikar, Zhihong Wang, David Maxwell Gage, Thomas E. Gartner, III