Abstract: A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.

Abstract: A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.

Abstract: A process for preparing a toner donor roll having an integral electrode pattern involving: (a) providing a cylindrically shaped insulating member; (b) coating the insulating member with a photo or thermally sensitive composition comprised of a polymeric material and a conductive metal nucleating agent; (c) patterning the composition, resulting in a first composition portion corresponding to the electrode pattern and a second composition portion; and (d) depositing conductive metal on the first composition portion, resulting in the electrode pattern which is capable of being electrically biased to detach toner particles from the donor roll. In an alternative embodiment, there is provided an insulating member comprised of an insulating polymeric material and a conductive metal nucleating agent.

Abstract: A method of cleaning a substrate, in particular, the front face of a thermal ink jet printing device, to improve subsequent thin film deposition in a single chamber plasma processing system containing fluorine-containing deposits, involves treating the substrate with a hydrogen plasma. A front face coating for a thermal ink jet device may be formed by a method involving (1) treating a substrate of the thermal ink jet device with a hydrogen plasma; (2) optionally coating the cleaned substrate with an amorphous carbon layer; and (3) coating the substrate or amorphous carbon layer with a fluoropolymer layer.

Abstract: A porous silicon Light Emitting Diodes (LEDs) device and method for fabricating LEDs with supporting circuits on a silicon chip or wafer for a Full Width Array in which a switch diode structure is used to form the porous silicon LED element and later drives the LED after the LED is fabricated. The LED is formed by defining an area in the switch diode for placing an LED element. Epi silicon is deposited in the defined area; and the epi silicon is electrochemical etched to produce porous silicon. This procedure creates column-like Si structures of nanometer dimension which can efficiently emit visible to infrared light at room temperature. Next, the porous silicon LED chip can be cut and butted without excessive damage. In this way, the chips bearing both LEDs and drive circuitry are made of silicon and can be cut and accurately butted by known techniques to form a low cost, high resolution Full Width LED array.

Abstract: A porous silicon Light Emitting Diodes (LEDs) device and method for fabricating LEDs with supporting circuits on a silicon chip or wafer for a Full Width Array in which a switch diode structure is used to form the porous silicon LED element and later drives the LED after the LED is fabricated. The LED is formed by defining an area in the switch diode for placing an LED element. Epi silicon is deposited in the defined area; and the epi silicon is electrochemical etched to produce porous silicon. This procedure creates column-like Si structures of nanometer dimension which can efficiently emit visible to infrared light at room temperature. Next, the porous silicon LED chip can be cut and butted without excessive damage. In this way, the chips bearing both LEDs and drive circuitry are made of silicon and can be cut and accurately butted by known techniques to form a low cost, high resolution Full Width LED array.

Abstract: A method of forming at least one electrically conductive path in a thermoplastic substrate having a melting point below 325.degree. C.

Abstract: An electronic component for making electrical contact with another component comprising a nonmetallic pultruded composite member having a plurality of small generally circular cross section conductive fibers in a polymer matrix said plurality of fibers being oriented in said matrix in a direction substantially parallel to the axial direction of said member and being continuous from one end of said member to the other to provide a plurality of electrical point contacts at each end of said member at least one end of said member having a fibrillated brush-like structure of said plurality of fibers providing a densely distributed filament contact wherein the terminating ends of the fibers in the brush-like structure defines an electrically contacting surface. In a preferred embodiment the brush-like member is a laser fibrillated structure.

Abstract: An electroconductive contact is formed of a pultruded member that has a hollow construction. The pultruded member includes a plurality of continuous electroconductive strands embedded in a resin material. At least one end of the pultruded member has laser fibrillated strands that are intended to contact a photoreceptive belt. An alignment structure can be integrally formed during the pultrusion process on a surface of the pultruded member. The alignment structure aligns the pultruded member relative to a contact. The electroconductive contact may also provide electrical connection between a photoreceptive belt and a ground terminal.

Abstract: A method of making a connector by applying a focused beam from a laser to a polymer matrix containing plurality of conductive fibers in parallel. The laser is applied at one end of the matrix to volatilize the matrix so as to expose the plurality of conductive fibers to provide a laser fibrillated brush-like structure to define an electrically contacting surface.

Abstract: Static eliminator device includes a nonmetallic pultruded composite member having a plurality of conductive carbon fibers provided within a polymer matrix of thermosetting resin, wherein the plurality of carbon fibers are oriented within the polymer matrix in a longitudinal direction of the pultruded composite member and extend continuously therethrough. The pultruded composite member has at least one laser fibrillated end including a brush-like structure of densely distributed filament contacts formed from an exposed length of the carbon fibers for contact with the surface. The brush-like structure has either a straight edge configuration or a shaped configuration. The static eliminator device may include a base member for holding the pultruded composite member, wherein the base member electrically communicates with the plurality of conductive fibers to permit the electrical charge to pass therefrom.

Abstract: An electronic component for making electrical contact with another component comprising a nonmetallic pultruded composite member having a plurality of small generally circular cross section conductive fibers in a polymer matrix the plurality of fibers being oriented in the matrix in a direction substantially parallel to the axial direction of the member and being continuous from one end of the member to the other to provide a plurality of electrical point contacts at each end of the member at least one end of the member having a fibrillated brush-like structure of said plurality of fibers providing a densely distributed filament contact wherein the terminating ends of the fibers in the brush-like structure defines an electrically contacting surface. In a preferred embodiment the brush-like member is a laser fibrillated structure.

Abstract: A high voltage connector is formed of a composite pultruded member that has an inner core including a plurality of high resistance electroconductive strands carried in a resin binder. The inner core is surrounded by an outer nonconductive shell, and extends from a laser cut end of the outer shell to a contact face. During formation of the contact using laser techniques, portions of the outer shell are removed to expose the inner core, the resin binder of the inner core may be removed, and the strands of the inner core may be fibrillated and patterned as desired. In one embodiment, the resistance of the strands of the inner core of the high voltage connector provide a load resistor for a circuit to which the connector may be connected.

Abstract: A method of forming at least one electrically conductive path in a plastic substrate comprising providing a thermoplastic substrate having a melting point below 325.degree. C.

Abstract: A three dimensional electrical component having a first side and a second side formed from an electrically insulating polymer matrix capable of heat conversion to an electrically conducting polymer matrix has at least one passageway from the first side to the second side having a tapered wall slope configuration from the first side to the second side with constantly changing cross section of the passageway from the first side through the passageway to the second side, an electrically conducting path between the first side and the second side formed by the in situ heat conversion of the walls of the passageway in the electrically insulating polymer matrix. In a preferred embodiment the electrically conducting path is formed by directing a laser beam to the walls of the passageway to heat the insulating polymer matrix to a temperature sufficient to convert it to an electrically conducting polymer matrix.

Abstract: A technique for generating high resolution resistor or conductor patterns on uneven surfaces by focusing a CO.sub.2 laser beam to locally render insoluable suitable thick film resistor or conductor material that has been uniformly coated onto a substrate and oven-dried to remove organic coating solvents. Patterns are generated by scanning the laser beam across the coated substrate, and the coating is hardened and adheres to the substrate where it has been exposed by the laser beam.