Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

Abstract: A protection circuit for protecting a switch from a fault includes a first sensing circuit and a second sensing circuit. The first sensing circuit senses a low-side load current through a switch that includes a first terminal, a second terminal and a control terminal. The first terminal is connected to a low-side of the load and the second terminal is connected to ground. The switch provides a conductive path between the first and second terminals responsive to a control signal provided on the control terminal. The first sensing circuit acts to reduce a magnitude of the control signal to limit the low-side load current, carried by the switch, when the low-side load current exceeds a first predetermined value. The second sensing circuit senses a voltage at the low-side of the load and interrupts the low-side load current, when the voltage at the low-side of the load exceeds a second predetermined value.