Patents by Inventor Thomas E. Stecher

Thomas E. Stecher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for LED panel lamp systems
    Patent number: 7635203
    Abstract: A lighting apparatus (10) comprises a light engine (12) producing ultra violet radiation. An enclosure (14) surrounds a radiation generating area of the light engine (12) to encompass the radiation. At least one wall (28) of the enclosure (14) is substantially reflective of the ultraviolet radiation. The enclosure (14) includes a replaceable top portion (30) which includes a phosphor portion (32). The phosphor portion (32) is spaced from the radiation generating area of the light engine (12) by a height of the enclosure (14).
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: December 22, 2009
    Assignee: Lumination LLC
    Inventors: Stanton E. Weaver, Jr., Thomas E. Stecher, Anant A. Setlur, Alok M. Srivastava, Holly A. Comanzo, Charles A. Becker, Thomas F. Soules, Chen-Lun Hsing Chen, Rebecca A. Bompiedi
  • Method for planarizing bumped die
    Patent number: 6869832
    Abstract: According to one embodiment of the invention, a method for planarizing bumped die includes providing a die having a plurality of stud bumps, encapsulating the stud bumps with an epoxy-based material, and disposing a release layer outwardly from the epoxy-based material. A surface of the release layer that engages the epoxy-based material is substantially planar. The method further includes curing the epoxy-based material and removing the release layer after the curing step, thereby creating a substantially planar surface of the epoxy-based material.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: March 22, 2005
    Assignee: Lockheed Martin Corporation
    Inventor: Thomas E. Stecher
  • Method for planarizing bumped die
    Publication number: 20040157359
    Abstract: According to one embodiment of the invention, a method for planarizing bumped die includes providing a die having a plurality of stud bumps, encapsulating the stud bumps with an epoxy-based material, and disposing a release layer outwardly from the epoxy-based material. A surface of the release layer that engages the epoxy-based material is substantially planar. The method further includes curing the epoxy-based material and removing the release layer after the curing step, thereby creating a substantially planar surface of the epoxy-based material.
    Type: Application
    Filed: February 7, 2003
    Publication date: August 12, 2004
    Applicant: Lockheed Martin Corporation
    Inventor: Thomas E. Stecher