Patents by Inventor Thomas E. Stewart
Thomas E. Stewart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7696018Abstract: Phase change devices, and particularly multi-terminal phase change devices, include first and second active terminals bridged together by a phase-change material whose conductivity can be modified in accordance with a control signal applied to a control electrode. This structure allows an application in which an electrical connection can be created between the two active terminals, with the control of the connection being effected using a separate terminal or terminals. Accordingly, the resistance of the heater element can be increased independently from the resistance of the path between the two active terminals. This allows the use of smaller heater elements thus requiring less current to create the same amount of Joule heating per unit area. The resistance of the heating element does not impact the total resistance of the phase change device.Type: GrantFiled: May 7, 2008Date of Patent: April 13, 2010Assignee: Agate Logic, Inc.Inventors: Antonietta Oliva, Louis Charles Kordus, II, Narbeh Derharcobian, Vei-Han Chan, Thomas E. Stewart, Jr.
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Publication number: 20090320267Abstract: An expansion card carrier is disclosed, the expansion card carrier including a top portion for covering an expansion card, at least one side portion for supporting the top portion, and at least one pair of card guides for allowing an expansion card to slide along into the expansion card carrier. A method for assembling an expansion card carrier is also disclosed, the method including casting a panel including a top portion for covering an expansion card and at least one side portion for supporting the top portion, forming at least one side portion by deforming the panel, and attaching at least one pair of card guides inside the expansion card carrier for allowing an expansion card to slide along into the expansion card carrier.Type: ApplicationFiled: September 10, 2009Publication date: December 31, 2009Applicant: SUN MICROSYSTEMS, INC.Inventors: Thomas E. Stewart, Mark H. Chen, Alan L. Winick, Michael S. White
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Patent number: 7626826Abstract: An expansion card carrier is disclosed, the expansion card carrier including a top portion for covering an expansion card, at least one side portion for supporting the top portion, and at least one pair of card guides for allowing an expansion card to slide along into the expansion card carrier. A method for assembling an expansion card carrier is also disclosed, the method including casting a panel including a top portion for covering an expansion card and at least one side portion for supporting the top portion, forming at least one side portion by deforming the panel, and attaching at least one pair of card guides inside the expansion card carrier for allowing an expansion card to slide along into the expansion card carrier.Type: GrantFiled: January 31, 2007Date of Patent: December 1, 2009Assignee: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Mark H. Chen, Alan L. Winick, Michael S. White
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Patent number: 7573708Abstract: An apparatus for cooling a computer system includes a fan for flowing an air to a first assembly and a second assembly, a first filter for filtering an air to a first assembly, and a second filter for filtering an air to a second assembly. The first filter is disposed at a side of the first assembly and the second filter is disposed on an opening of a wall which separates the first assembly and the second assembly.Type: GrantFiled: June 28, 2007Date of Patent: August 11, 2009Assignee: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Timothy W. Olesiewicz
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Publication number: 20090134910Abstract: Reconfigurable electronic structures and circuits using programmable, non-volatile memory elements. The programmable, non-volatile memory elements may perform the functions of storage and/or a switch to produce components such as crossbars, multiplexers, look-up tables (LUTs) and other logic circuits used in programmable logic structures (e.g., (FPGAs)). The programmable, non-volatile memory elements comprise one or more structures based on Phase Change Memory, Programmable Metallization, Carbon Nano-Electromechanical (CNT-NEM), or Metal Nano-Electromechanical device technologies.Type: ApplicationFiled: January 7, 2009Publication date: May 28, 2009Inventors: Colin Neal Murphy, Narbeh Derhacobian, Louis Charles Kordus, II, Antonietta Oliva, Vei-Han Chan, Thomas E. Stewart, JR.
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Patent number: 7494849Abstract: Phase change devices, and particularly multi-terminal phase change devices, include first and second active terminals bridged together by a phase-change material whose conductivity can be modified in accordance with a control signal applied to a control electrode. This structure allows an application in which an electrical connection can be created between the two active terminals, with the control of the connection being effected using a separate terminal or terminals. Accordingly, the resistance of the heater element can be increased independently from the resistance of the path between the two active terminals. This allows the use of smaller heater elements thus requiring less current to create the same amount of Joule heating per unit area. The resistance of the heating element does not impact the total resistance of the phase change device.Type: GrantFiled: November 3, 2005Date of Patent: February 24, 2009Assignee: Cswitch Inc.Inventors: Antonietta Oliva, Louis Charles Kordus, II, Narbeh Derharcobian, Vei-Han Chan, Thomas E. Stewart, Jr.
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Patent number: 7474530Abstract: An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.Type: GrantFiled: January 10, 2007Date of Patent: January 6, 2009Assignee: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Daniel Hruska
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Publication number: 20090002938Abstract: An apparatus for cooling a computer system includes a fan for flowing an air to a first assembly and a second assembly, a first filter for filtering an air to a first assembly, and a second filter for filtering an air to a second assembly. The first filter is disposed at a side of the first assembly and the second filter is disposed on an opening of a wall which separates the first assembly and the second assembly.Type: ApplicationFiled: June 28, 2007Publication date: January 1, 2009Applicant: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Timothy W. Olesiewicz
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Publication number: 20080206922Abstract: Phase change devices, and particularly multi-terminal phase change devices, include first and second active terminals bridged together by a phase-change material whose conductivity can be modified in accordance with a control signal applied to a control electrode. This structure allows an application in which an electrical connection can be created between the two active terminals, with the control of the connection being effected using a separate terminal or terminals. Accordingly, the resistance of the heater element can be increased independently from the resistance of the path between the two active terminals. This allows the use of smaller heater elements thus requiring less current to create the same amount of Joule heating per unit area. The resistance of the heating element does not impact the total resistance of the phase change device.Type: ApplicationFiled: May 7, 2008Publication date: August 28, 2008Inventors: Antonietta Oliva, Louis Charles Kordus, Narbeh Derhacobian, Vei-Han Chan, Thomas E. Stewart
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Publication number: 20080180897Abstract: An expansion card carrier is disclosed, the expansion card carrier including a top portion for covering an expansion card, at least one side portion for supporting the top portion, and at least one pair of card guides for allowing an expansion card to slide along into the expansion card carrier. A method for assembling an expansion card carrier is also disclosed, the method including casting a panel including a top portion for covering an expansion card and at least one side portion for supporting the top portion, forming at least one side portion by deforming the panel, and attaching at least one pair of card guides inside the expansion card carrier for allowing an expansion card to slide along into the expansion card carrier.Type: ApplicationFiled: January 31, 2007Publication date: July 31, 2008Applicant: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Mark H. Chen, Alan L. Winick, Michael S. White
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Publication number: 20080165501Abstract: An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.Type: ApplicationFiled: January 10, 2007Publication date: July 10, 2008Applicant: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Daniel Hruska
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Patent number: 7256992Abstract: A computer system may include one or more modules coupled to a backplane in a housing. A module support structure may allow cooling air to flow upwardly across the modules. In one embodiment, a power section of the module may be located downstream of a data section of the module. In another embodiment, offset brackets may hold a circuit board of a module at an offset relative to a pair of guides in a module support structure. In another embodiment, a heat sink may be coupled between heat producing components on a pair of adjacent modules. In another embodiment, a converter apparatus may support a plurality of modules in a different number of slots in a system. In another embodiment, a heat sink on a module may include a pair of heat pipes arranged such that the heat pipes diverge from one another toward the condenser ends of the heat pipes.Type: GrantFiled: August 31, 2004Date of Patent: August 14, 2007Assignee: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Timothy W. Olesiewicz
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Patent number: 7228242Abstract: A method and system of adaptive power control based on pre package characterization of integrated circuits. Characteristics of a specific integrated circuit are used to adaptively control power of the integrated circuit.Type: GrantFiled: December 31, 2002Date of Patent: June 5, 2007Assignee: Transmeta CorporationInventors: Andrew Read, Malcolm Wing, Louis C. Kordus, Thomas E. Stewart
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Patent number: 7187552Abstract: A circuit board assembly may include a heat sink that couples with a surface a circuit module installed on the circuit board. The heat sink may automatically couple to the surface of the circuit module when the circuit module is installed on the circuit board. The heat sink may include a thermal interface element that contacts the surface of the circuit module. A biasing element may be coupled between the body and the base to urge a body of the heat sink into contact with the circuit module when the circuit module is installed on the circuit board. In some embodiments, a heat sink may automatically couple with the circuit module when a locking member for the circuit module is actuated to a closed position. In some embodiments, a heat sink may automatically couple with a circuit module when an ejector for the circuit module is actuated. In some embodiments, a heat sink may include an ejector and a locking member for a circuit module.Type: GrantFiled: March 4, 2005Date of Patent: March 6, 2007Assignee: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Timothy W. Olesiewicz
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Patent number: 7115817Abstract: An electrical assembly comprising a circuit board an electrical device, and a heat dissipation device. The electrical device is capable of emitting thermal energy and electromagnetic interference (EMI). The electrical device is secured to the circuit board. The heat dissipation device is secured to the circuit board and is in thermal communication with the electrical device. The heat dissipation device also includes a continuous EMI fence and a plurality of fins disposed in a matrix orientation. The fins are spaced from one another to allow for efficient heat dissipation and have a substantially square cross-sectional shape.Type: GrantFiled: September 18, 2002Date of Patent: October 3, 2006Assignee: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Steven J. Furuta
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Patent number: 6921247Abstract: A fan tray assembly for an electronics enclosure includes two opposing, spaced apart shells made of a sheet material. The opposing shells are attached to each other by attachment features formed in the sheet material of each shell. Advantageously, the attachment features reduce or eliminate the need for separate fasteners, spring steels, or adhesives to attach the shells. Each shell has openings and grills. Each shell also has retention features formed in the sheet material around a periphery of their respective grills. A ventilation fan unit (e.g., two fans) is retained between the two shells by the retention features. An electrical connector is connected to the ventilation fan and retained by at least one of the shells. The shells may also include features for retaining the electrical connector without using fasteners or adhesives. Such features may allow the connector to float in a plane perpendicular to its principal axis of alignment.Type: GrantFiled: April 14, 2003Date of Patent: July 26, 2005Assignee: Sun Microsystems, Inc.Inventors: Thomas E. Stewart, Robert J. Lajara
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Patent number: D590066Type: GrantFiled: July 11, 2008Date of Patent: April 7, 2009Assignee: Sportsheets International, Inc.Inventor: Thomas E. Stewart
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Patent number: D596307Type: GrantFiled: July 11, 2008Date of Patent: July 14, 2009Assignee: Sportsheets International, Inc.Inventor: Thomas E. Stewart
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Patent number: D599486Type: GrantFiled: July 11, 2008Date of Patent: September 1, 2009Assignee: Sportsheets International, Inc.Inventor: Thomas E. Stewart
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Patent number: D604425Type: GrantFiled: July 11, 2008Date of Patent: November 17, 2009Assignee: Sportsheets International, Inc.Inventor: Thomas E. Stewart