Abstract: A method and apparatus are provided for coining solder balls on an organic electrical circuit package. Generally, this method includes placing a slug on one or more of the solder balls; and applying sufficient pressure for a sufficient period of time on the slug to flatten the surface of the solder balls so as to form planar solder coins. The apparatus includes a press; a ram attached to the press; a platform for receiving the package and a slug placed upon the solder balls.

Abstract: A power operated chair having a base frame assembly, a chair assembly mounted on the base frame assembly, and an internal combustion engine mounted on the base frame assembly. A fuel tank is mounted on the back of the chair assembly. One or two rear drive wheels are rotatably mounted on a transversely extending rear axle that is supported from the base frame assembly. If one wheel is utilized it would be centrally positioned along the length of the rear axle and if two drive wheels are used they would be centrally placed along the length of the rear axle and close enough to each other so that a differential gear assembly would not be necessary between them. A pair of laterally spaced steerable front wheels are mounted to the forward end of the base frame assembly and a pair of laterally spaced rear wheels that are non-steerable are mounted to the rearward end of the base frame assembly. There is also a drive system connecting the internal combustion engine to the rear drive wheel.

Abstract: A C-shaped or ring-shaped collar member having a groove along the inner periphery of one end in combination with an adjustable pin insert for engaging the end of a torsion spring threaded on a cone. Apertures are provided in the collar for accepting a winding bar to rotate the collar.