Abstract: Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.

Abstract: Pad conditioners and methods of conditioning pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided.

Abstract: Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.

Abstract: Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads are substantially porous and substantially hard for improved polishing and planarization properties. Pads according to some embodiments of the present invention have beneficial properties like those of standard technology porous pads and beneficial properties like those of standard technology hard pads.

Abstract: Disclosed is a method of manufacturing polymer materials having properties that are determined by selected process conditions. The properties can be modified for a variety of applications. Exemplary applications are pads for chemical mechanical planarization of substrates and pads for polishing substrates. One embodiment of the method includes the steps of providing a polymer sheet having a substrate contacting area, heating the area a sufficient amount, and applying a sufficient amount of mechanical pressure to the area during at least a portion of the heating step to achieve the desired properties for the material.