Abstract: An Exhaust Gas Analyzer (EGA) subsystem for monitoring exhaust gasses, for controlling and rapidly adjusting the processing conditions within a processing chamber in a thermal processing unit used for heating-treating wafers before and/or during Post Application Bake (PAB) procedures. The EGA subsystem can be used to control and/or optimize the heat-treating of coated wafers at different bake plate temperatures, and the EGA subsystem can provide a high wafer throughput.

Abstract: An Exhaust Gas Analyzer (EGA) subsystem for monitoring exhaust gasses, for controlling and rapidly adjusting the processing conditions within a processing chamber in a thermal processing unit used for heating-treating wafers before and/or during Post Application Bake (PAB) procedures. The EGA subsystem can be used to control and/or optimize the heat-treating of coated wafers at different bake plate temperatures, and the EGA subsystem can provide a high wafer throughput.

Abstract: The invention can provide a method of processing a wafer using Site-Dependent (S-D) processing sequences that can include S-D creation procedures, S-D evaluation procedures, and S-D transfer sequences. The S-D creation procedures can be performed using S-D processing elements, the S-D evaluation procedures can be performed using S-D evaluation elements, and S-D transfer sequences can be performed using site-dependent transfer subsystems. Site-dependent data can be stored in site-dependent libraries and/or databases.

Abstract: A method and system for positioning a wafer on a bake plate in a processing module that includes lowering a bake plate cover assembly over the wafer during a baking process, raising the bake plate cover assembly after the baking process, removing the wafer, determining whether the bake plate cover assembly requires cleaning, then either processing another wafer if the cover assembly does not need cleaning or establishing a cleaning process for the bake plate cover assembly if the cover does need cleaning. Automated sensing of the state of the cover assembly may be employed, and cleaning process may be automatically performed in response to the cleaning need determination.

Abstract: The present invention includes a method of verifying a Site-Dependent (S-D) wafer that includes receiving a first set of S-D wafers by one or more S-D processing elements in one or more processing subsystems, creating a first set of unverified S-D wafers by performing a first S-D creation procedure, establishing S-D wafer state data for each unverified S-D wafer, establishing a first set of evaluation wafers comprising a first number of the unverified S-D wafers, establishing first operational states for a plurality of S-D evaluation elements, determining a first number of available evaluation elements, establishing a first S-D transfer sequence, transferring the first set of S-D evaluation wafers to the first number of available evaluation elements in one or more evaluation subsystems and applying a first corrective action when the number of S-D evaluation wafers is greater than the first number of available evaluation elements.

Abstract: An edge bead removal device for a spin coater apparatus and methods of edge bead removal that overcome the deficiencies of conventional edge bead removal techniques. The edge bead removal device includes a coater cup and a head situated within the coater cup proximate to a peripheral edge of a substrate. The head is movable in a radial direction relative to an azimuthal axis of a rotatable substrate support inside the coater cup. The position of the head relative to a rim of the peripheral edge is mapped using an optical sensor. When the substrate support rotates the substrate and the head is used to dispense edge bead removal chemical, the radial position of the head is adjusted, as guided by the map, relative to the azimuthal axis to maintain a constant gap between the head and the substrate's peripheral rim.

Abstract: The invention can provide a method of processing a wafer using Site-Dependent (S-D) processing sequences that can include S-D creation procedures, S-D evaluation procedures, and S-D transfer sequences. The S-D creation procedures can be performed using S-D processing elements, the S-D evaluation procedures can be performed using S-D evaluation elements, and S-D transfer sequences can be performed using site-dependent transfer subsystems. Site-dependent data can be stored in site-dependent libraries and/or databases.

Abstract: A heat treatment apparatus and method for curing a layer of a processable material on a substrate. The apparatus includes a residual gas analyzer that communicates with a process space in which the layer is heated to cure the processable material. A controller, which is electrically connected to the residual gas analyzer, is operable to adjust a bake time for the layer in relation to a concentration of a gas species evolved from the processable material.

Abstract: A method and system for positioning a wafer on a bake plate in a processing module that includes lowering a bake plate cover assembly over the wafer during a baking process, raising the bake plate cover assembly after the baking process, removing the wafer, determining whether the bake plate cover assembly requires cleaning, then either processing another wafer if the cover assembly does not need cleaning or establishing a cleaning process for the bake plate cover assembly if the cover does need cleaning. Automated sensing of the state of the cover assembly may be employed, and cleaning process may be automatically performed in response to the cleaning need determination.

Abstract: An edge bead removal device for a spin coater apparatus and methods of edge bead removal that overcome the deficiencies of conventional edge bead removal techniques. The edge bead removal device includes a coater cup and a head situated within the coater cup proximate to a peripheral edge of a substrate. The head is movable in a radial direction relative to an azimuthal axis of a rotatable substrate support inside the coater cup. The position of the head relative to a rim of the peripheral edge is mapped using an optical sensor. When the substrate support rotates the substrate and the head is used to dispense edge bead removal chemical, the radial position of the head is adjusted, as guided by the map, relative to the azimuthal axis to maintain a constant gap between the head and the substrate's peripheral rim.