Abstract: An optical sub-assembly includes a circuit and one or more electronic components electrically connected to the circuit. One of the electronic components is an optoelectronic device capable of transmitting or receiving light signals. Mounted to a surface of the optoelectronic device is an optical conduit. A first end of the optical conduit mounts to the optoelectronic device and a second end optionally cooperates with an optical component, such as a lens. The optical conduit channels light signals propagating toward or away from the optoelectronic device, while the optical component focuses or collimates such light signals. Securing the optical conduit relative to the optoelectronic device is a protective material such as a resin, epoxy, or other suitable material.

Abstract: Embodiments of the present invention disclose a transceiver module having a flexible circuit contained within a housing. The flexible circuit has various electronic components and either a photodiode or a laser transmitter disposed on and electrically connected to it. In alternate exemplary embodiments, both a photodiode and a laser are disposed on and connected to the flexible circuit. In addition, there can be electrical contacts disposed on and electrically connected to the flexible circuit. These electrical contacts can take the form of pads that are a standard form factor pluggable configuration, such as the Multisource Agreement Standard Form Factor Pluggable (MSA SFP) standard.

Abstract: An optoelectronics packaging assembly is provided having a ceramic base on which is connected an optoelectronics device. The optoelectronic device is maintained in an enclosure formed by a housing, the base and/or other structures. The packaging assembly includes means for placing the base and the optoelectronics device in electrical communication with an external component, for example, a printed circuit board. The means include solder balls, J-shaped leads, bent leads, and electrical pads.