Patents by Inventor Thomas Engling

Thomas Engling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor component having a stack of semiconductor chips and method for producing the same
    Patent number: 8354299
    Abstract: A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.
    Type: Grant
    Filed: February 9, 2005
    Date of Patent: January 15, 2013
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Thomas Engling, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME
    Publication number: 20100207277
    Abstract: A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.
    Type: Application
    Filed: February 9, 2005
    Publication date: August 19, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Bauer, Thomas Engling, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • Microelectromechanical component and method for the production thereof
    Patent number: 7462919
    Abstract: A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.
    Type: Grant
    Filed: May 24, 2004
    Date of Patent: December 9, 2008
    Assignee: Infineon Technologies AG
    Inventors: Thomas Engling, Martin Petz
  • Semiconductor component and sensor component for data transmission devices
    Patent number: 7230309
    Abstract: The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.
    Type: Grant
    Filed: October 4, 2004
    Date of Patent: June 12, 2007
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Thomas Engling, Alfred Haimerl, Joachim Mahler, Wolfgang Schober
  • Microelectromechanical component and method for the production thereof
    Publication number: 20070090473
    Abstract: A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.
    Type: Application
    Filed: May 24, 2004
    Publication date: April 26, 2007
    Inventors: Thomas Engling, Martin Petz
  • Semiconductor component and sensor component for data transmission devices
    Publication number: 20050104149
    Abstract: The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.
    Type: Application
    Filed: October 4, 2004
    Publication date: May 19, 2005
    Inventors: Michael Bauer, Thomas Engling, Alfred Haimerl, Joachim Mahler, Wolfgang Schober