Abstract: A system for communicating with a projectile in flight toward an intended target includes a barrel-launched projectile and a remote receiver. The barrel-launched projectile includes an ordnance portion, an active communications apparatus and an onboard speed control. The active communications apparatus includes an onboard receiver, an electromagnetic wave reception device, and an active transmitter. The electromagnetic wave reception device includes at least one from the group consisting of an antenna and a photo receptor and is configured to receive an electromagnetic signal. The electromagnetic wave reception device is connected to provide a signal derived from the electromagnetic signal to the onboard receiver to deploy the onboard speed control. The active transmitter is connected and configured for transmitting a signal to the remote receiver during flight and before activation of the speed control.

Abstract: A system for communicating with a projectile in flight toward an intended target includes a barrel-launched projectile and a remote receiver. The barrel-launched projectile includes an ordnance portion, an active communications apparatus and an onboard speed control. The active communications apparatus includes an onboard receiver, an electromagnetic wave reception device, and an active transmitter. The electromagnetic wave reception device includes at least one from the group consisting of an antenna and a photo receptor and is configured to receive an electromagnetic signal. The electromagnetic wave reception device is connected to provide a signal derived from the electromagnetic signal to the onboard receiver to deploy the onboard speed control. The active transmitter is connected and configured for transmitting a signal to the remote receiver during flight and before activation of the speed control.

Abstract: A system for communicating with a projectile in flight toward an intended target includes a barrel-launched projectile and a remote receiver. The barrel-launched projectile includes an ordnance portion, an active communications apparatus and an onboard speed control. The active communications apparatus includes an onboard receiver, an electromagnetic wave reception device, and an active transmitter. The electromagnetic wave reception device includes at least one from the group consisting of an antenna and a photo receptor and is configured to receive an electromagnetic signal. The electromagnetic wave reception device is connected to provide a signal derived from the electromagnetic signal to the onboard receiver to deploy the onboard speed control. The active transmitter is connected and configured for transmitting a signal to the remote receiver during flight and before activation of the speed control.

Abstract: A system for communicating with a projectile in flight toward an intended target includes a barrel-launched projectile and a remote receiver. The barrel-launched projectile includes an ordnance portion, an active communications apparatus and an onboard speed control. The active communications apparatus includes an onboard receiver, an electromagnetic wave reception device, and an active transmitter. The electromagnetic wave reception device includes at least one from the group consisting of an antenna and a photo receptor and is configured to receive an electromagnetic signal. The electromagnetic wave reception device is connected to provide a signal derived from the electromagnetic signal to the onboard receiver to deploy the onboard speed control. The active transmitter is connected and configured for transmitting a signal to the remote receiver during flight and before activation of the speed control.

Abstract: A system for communicating with a projectile in flight toward an intended target includes a barrel-launched projectile and a remote receiver. The barrel-launched projectile includes an ordnance portion, an active communications apparatus and an onboard speed control. The active communications apparatus includes an onboard receiver, an electromagnetic wave reception device, and an active transmitter. The electromagnetic wave reception device includes at least one from the group consisting of an antenna and a photo receptor and is configured to receive an electromagnetic signal. The electromagnetic wave reception device is connected to provide a signal derived from the electromagnetic signal to the onboard receiver to deploy the onboard speed control. The active transmitter is connected and configured for transmitting a signal to the remote receiver during flight and before activation of the speed control.

Abstract: A projectile includes an ordnance portion configured to impact a target and a communication apparatus positioned rearward of the ordnance portion. The projectile is configured to rotate about and travel along a longitudinal axis after launch.

Abstract: A flare includes an air-tight rupturable capsule and an energy releasing material, contained within the air-tight rupturable capsule, such that the energy-releasing material releases energy in response to exposure to at least one component of air.

Abstract: A method of adjusting the relative thickness of an electrode assembly (10) in a plasma processing system (6) capable of supporting a plasma (20, 120) in a reactor chamber (16). The electrode assembly is arranged in the reactor chamber and includes at least one electrode having a lower surface that may have defined by at least one sacrificial protective plate (100). The electrode has a nonuniform thickness resulting from a plasma processing operation performed in the reactor chamber. The method includes a step of forming a plasma (120) designed to selectively etch the at least one electrode at the lower surface, followed by a step of etching the electrode with the aid of the plasma to reduce the nonuniformity in thickness (T(X,Z)) of the at least one electrode. The thickness of the electrode may be measured in situ using an acoustic transducer (210) during the processing of workpieces as well as during the restorative plasma etching of the electrode.

Abstract: Systems of and methods for capturing a plurality of one-dimensional images representative of substantially all of the surface of a substrate within a single revolution of a rotating platen holding a polishing pad in operative contact with the surface of the substrate during chemical-mechanical planarization. A two-dimensional image comprising frame data, which may comprise a spectral image, is derived from the plurality of one-dimensional images. The frame data provides information useful for subsequent chemical-mechanical processing of the substrate.

Abstract: A method and apparatus to generate an endpoint signal to control the polishing of thin films on a semiconductor wafer surface includes a through-bore in a polish pad assembly, a light source, a fiber optic cable, a light sensor, and a computer. The light source provides light within a predetermined bandwidth, the fiber optic cable propagates the light through the through-bore opening to illuminate the surface as the pad assembly orbits, and the light sensor receives reflected light from the surface through the fiber optic cable and generates reflected spectral data. The computer receives the reflected spectral data and calculates an endpoint signal by comparing the reflected spectral data with previously collected spectral reference data, calculating a trigger time based on the comparison, and predicting the endpoint time utilizing the trigger time.

Abstract: A method of adjusting the relative thickness of an electrode assembly (10) in a plasma processing system (6) capable of supporting a plasma (20, 120) in a reactor chamber (16). The electrode assembly is arranged in the reactor chamber and includes at least one electrode having a lower surface that may have defined by at least one sacrificial protective plate (100). The electrode has a nonuniform thickness resulting from a plasma processing operation performed in the reactor chamber. The method includes a step of forming a plasma (120) designed to selectively etch the at least one electrode at the lower surface, followed by a step of etching the electrode with the aid of the plasma to reduce the nonuniformity in thickness (T(X,Z)) of the at least one electrode. The thickness of the electrode may be measured in situ using an acoustic transducer (210) during the processing of workpieces as well as during the restorative plasma etching of the electrode.

Abstract: A method and apparatus for determining the endpoint of a planarization process during chemical mechanical planarization (CMP) and more specifically for determining endpoint of a planarization process for a thin metal film deposited on a wafer's surface and/or a method of altering the plating and deplating of the thin metal film during the planarization process. The apparatus includes one or more probes embedded in a working surface. The probes are in electrical communication with the thin film on the wafer's surface as it is planarized against the working surface. The probes measure the thickness of the thin metal film and/or induce a current in the thin metal film to adjust the plating and deplating that occurs during the planarization process.

Abstract: A method and apparatus for optical multi-angle in situ CMP endpoint detection include a sensor block having light emitting channels, light receiving channels and an opening where the light emitting channels terminate and the light receiving channels originate and means for determining endpoint based on the amount of reflected light that is received from the light receiving channels. At least a portion of the sensor block is embedded in a polishing pad backer such that the light emitting channels can emit light through a polishing pad window to the surface of a wafer and the light receiving channels can receive light reflected from the wafer surface through the polishing pad window. Connectors may be used to connect a light source to the light emitting channels and a light detector to the light receiving channels.

Abstract: A method and apparatus to generate an endpoint signal to control the polishing of thin films on a semiconductor wafer surface includes a through-bore in a polish pad assembly, a light source, a fiber optic cable, a light sensor, and a computer. The light source provides light within a predetermined bandwidth, the fiber optic cable propagates the light through the through-bore opening to illuminate the surface as the pad assembly orbits, and the light sensor receives reflected light from the surface through the fiber optic cable and generates reflected spectral data. The computer receives the reflected spectral data and calculates an endpoint signal by comparing the reflected spectral data with previously collected spectral reference data, calculating a trigger time based on the comparison, and predicting the endpoint time utilizing the trigger time.

Abstract: A tapped Bragg grating is used to demodulate optical signals reflected by ber optic Bragg gratings in a sensor in which the line spacings in the fiber optic Bragg gratings vary in response to a mechanical stress. A light detector, or light detector array is used to detect variation in the angular pattern of the light scattered by the tapped Bragg grating. Arrangements of mirrors, or alternatively arrangements of lenses, are used to concentrate the scattered light toward the light detectors and to enhance the angular changes in the scattered light.

Abstract: In accordance with the present invention a method for forming an insulating layer over a substrate surface comprises providing first and second raised portions extending from the substrate surface, the first and second portions extending distances X.sub.1 and X.sub.2 respectively, and X.sub.2 being greater than X.sub.1. An insulating layer of thickness T.sub.3 is deposited over the surface so as to conform to the topography of the substrate surface and raised portions and a flowable layer is then deposited over the insulating layer. The flowable layer is next flowed so as to yield a substantially planar surface and then thinned until that portion of the insulating layer that overlies the second portion is exposed. The flowable layer and the exposed surface of the insulating layer are then simultaneously thinned so as to remove a greater thickness of flowable layer than insulating layer. The thinning is stopped when that portion of the insulating layer that overlies the first portion is exposed.