Abstract: A method for probing a semiconductor wafer utilizes an array probe assembly (60) which includes a production package substrate (64). Substrate (64) is used to transform a configuration of conductive pads (74) on a probe card (62) into a configuration which matches that of conductive bumps (54) on a semiconductor die (52). Array probe assembly (60) may also include an array probe head (68) having probe wires (84) for coupling conductive pads (80) on substrate (64) with conductive bumps (54) on die (52). After probing the die, the die are assembled into a final packaged semiconductor device (110) which includes a substrate (90) which is nearly identical to the substrate used in the array probe assembly. Use of a production package substrate in the array probe assembly reduces the cost of the array probe assembly, and results in more accurate testing since the substrate in the array probe assembly will emulate the performance of the die in the final packaged device.

Abstract: A light collimizing device (10) having a light input unit (11), a first light reflection unit (12), a window unit (13) and a second light reflection unit (14). The light input unit (11) allows light rays (18 and 19) to enter therethrough. Some of the light rays (18) are reflected off of the second light reflection unit (b 14), and some of the light rays (19) are reflected off of the window unit (13). All of the reflected rays (18 and 19) are then reflected off of the first light reflection unit (12) to yield a plurality of collimized light rays (17).