Patents by Inventor Thomas F. Marinis
Thomas F. Marinis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8978474Abstract: A micro-electro-mechanical systems (MEMS) inertial measurement system facilitates accurate location and/or attitude measurements via passive thermal management of MEMS inertial sensors. Accuracy of the system is also improved by subjecting the inertial sensors to programmed single-axis gimbal motion, and by performing coarse and fine adjustments to the attitude estimates obtained by the system based on the programmed motion and on the passive thermal management of the sensors.Type: GrantFiled: July 29, 2011Date of Patent: March 17, 2015Assignees: The Charles Stark Draper Laboratory, Inc., Massachusetts Institute of TechnologyInventors: Matthew S. Bottkol, Richard D. Elliott, Michael Y. Feng, Thomas F. Marinis, Michael F. Mcmanus, Shan Mohiuddin, Peter G. Sherman, John E. Pritchett, Jeffery W. Warren, Charles H. Lange
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Patent number: 8484823Abstract: In various embodiments, a crystal is inserted within a flexible membrane through an opening formed by manipulation of the membrane.Type: GrantFiled: August 25, 2010Date of Patent: July 16, 2013Assignee: The Charles Stark Draper Laboratory, Inc.Inventors: Caroline K. Bjune, Thomas F. Marinis
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Publication number: 20130025369Abstract: A micro-electro-mechanical systems (MEMS) inertial measurement system facilitates accurate location and/or attitude measurements via passive thermal management of MEMS inertial sensors. Accuracy of the system is also improved by subjecting the inertial sensors to programmed single-axis gimbal motion, and by performing coarse and fine adjustments to the attitude estimates obtained by the system based on the programmed motion and on the passive thermal management of the sensors.Type: ApplicationFiled: July 29, 2011Publication date: January 31, 2013Inventors: Matthew S. Bottkol, Richard D. Elliott, Michael Y. Feng, Thomas F. Marinis, Michael F. McManus, Shan Mohiuddin, Peter G. Sherman, John E. Pritchett, Jeffery W. Warren, Charles H. Lange
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Patent number: 7981698Abstract: Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously.Type: GrantFiled: March 9, 2007Date of Patent: July 19, 2011Assignee: The Charles Stark Draper Laboratory, Inc.Inventors: Dariusz R. Pryputniewicz, Thomas F. Marinis, Gary B. Tepolt
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Publication number: 20110097623Abstract: The present invention generally relates to batteries or other electrochemical devices. In some embodiments, the present invention relates to small-scale batteries or microbatteries. For example, in one aspect of the invention, a battery may have a volume of no more than about 5 mm3, while having an energy density of at least about 400 Wh/l. Other aspect of the invention is directed to techniques of packaging such batteries.Type: ApplicationFiled: February 12, 2009Publication date: April 28, 2011Applicant: Massachusetts Institute of TechnologyInventors: Thomas F. Marinis, JR., Caroline K. Bjune, Robert A. Larsen, Yet-Ming Chiang, Wei Lai, Can K. Erdonmez
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Publication number: 20110047776Abstract: In various embodiments, a crystal is inserted within a flexible membrane through an opening formed by manipulation of the membrane.Type: ApplicationFiled: August 25, 2010Publication date: March 3, 2011Applicant: The Charles Stark Draper Laboratory, Inc.Inventors: Caroline K. Bjune, Thomas F. Marinis
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Patent number: 7851970Abstract: A crystal oscillator is mounted in a flexible harness rather than at discrete points. The crystal oscillator and associated control circuitry may be formed on a common substrate, decreasing component size and minimizing temperature fluctuations by shortening the thermal path between the crystal and the control circuitry.Type: GrantFiled: December 22, 2006Date of Patent: December 14, 2010Assignee: The Charles Stark Draper Laboratory, Inc.Inventors: Thomas F. Marinis, Caroline A. Kondoleon, Dariusz R. Pryputniewicz
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Patent number: 7679171Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.Type: GrantFiled: June 21, 2005Date of Patent: March 16, 2010Assignee: The Charles Stark Draper Laboratories, Inc.Inventors: Richard S. Anderson, David S. Hanson, Frederick J. Kasparian, Thomas F. Marinis, Joseph W. Soucy
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Publication number: 20080217773Abstract: Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously.Type: ApplicationFiled: March 9, 2007Publication date: September 11, 2008Applicant: Charles Stark Draper Laboratory, Inc.Inventors: Dariusz R. Pryputniewicz, Thomas F. Marinis, Gary B. Tepolt
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Publication number: 20080150397Abstract: A crystal oscillator is mounted in a flexible harness rather than at discrete points. The crystal oscillator and associated control circuitry may be formed on a common substrate, decreasing component size and minimizing temperature fluctuations by shortening the thermal path between the crystal and the control circuitry.Type: ApplicationFiled: December 22, 2006Publication date: June 26, 2008Applicant: Charles Stark Draper Laboratory, Inc.Inventors: Thomas F. Marinis, Caroline A. Kondoleon, Dariusz R. Pryputniewicz
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Publication number: 20080148850Abstract: A three axes MEM accelerometer system includes three MEM accelerometer sensors and a MEM sensor board including a MEM sensor control circuit for the accelerometer sensors. The accelerometer sensors are mounted mutually orthogonally. At least two coplanar mounting members have a first surface coplanar with a connection pad on the surface of the sensor board. A second surface is inclined to the surface of the board for mounting a MEM accelerometer sensor. An electrical conductor array interconnects the MEM accelerometer sensor with the connection pad on the board.Type: ApplicationFiled: June 28, 2007Publication date: June 26, 2008Inventors: David S. Hanson, Richard S. Anderson, Thomas F. Marinis, Joseph W. Soucy
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Patent number: 7253079Abstract: A coplanar mounting member for a MEM sensor includes a first surface coplanar with a connection pad on the surface of a MEM sensor board containing the MEM sensor control circuit; a second surface inclined to the surface of the board for mounting a MEM sensor and an electrical conductor array for interconnecting the MEM sensor with the connection pad on the board.Type: GrantFiled: May 9, 2002Date of Patent: August 7, 2007Assignee: The Charles Stark Draper Laboratory, Inc.Inventors: David S. Hanson, Richard S. Anderson, Thomas F. Marinis, Joseph W. Soucy
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Patent number: 6937479Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.Type: GrantFiled: May 9, 2002Date of Patent: August 30, 2005Assignee: The Charles Stark Draper Laboratory, Inc.Inventors: Richard S. Anderson, David S. Hanson, Frederick J. Kasparian, Thomas F. Marinis, Joseph W. Soucy
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Patent number: 6891239Abstract: An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.Type: GrantFiled: February 26, 2003Date of Patent: May 10, 2005Assignee: The Charles Stark Draper Laboratory, Inc.Inventors: Richard S. Anderson, James H. Connelly, David S. Hanson, Joseph W. Soucy, Thomas F. Marinis
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Patent number: 6770503Abstract: A micromechanical sensor is fabricated on a semiconductor wafer, and a control circuit is fabricated on another semiconductor wafer. A cavity is etched on the back side of the control circuit wafer, the cavity being formed such that the sensor on the other wafer fits within the cavity when the wafers are brought together in an adjoining relationship. Through-holes are etched through the back side of the control circuit wafer to allow access to electrical contact points, and a patterned layer of metal is deposited to form electrical interconnections between the electrical contact points and termination points on the back side of the wafer via the through-holes. The termination points are arranged such that electrical contacts of the sensor contact the termination points when the wafers are placed in the adjoining relationship. The wafers are then cleaned and bonded together in the adjoining relationship.Type: GrantFiled: October 21, 1999Date of Patent: August 3, 2004Assignee: The Charles Stark Draper Laboratory, Inc.Inventors: Thomas F. Marinis, Jerome B. Sohn, Richard P. Tumminelli
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Publication number: 20040007750Abstract: An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.Type: ApplicationFiled: February 26, 2003Publication date: January 15, 2004Inventors: Richard S. Anderson, James H. Connelly, David S. Hanson, Joseph W. Soucy, Thomas F. Marinis
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Publication number: 20030209789Abstract: A coplanar mounting member for a MEM sensor includes a first surface coplanar with a connection pad on the surface of a MEM sensor board containing the MEM sensor control circuit; a second surface inclined to the surface of the board for mounting a MEM sensor and an electrical conductor array for interconnecting the MEM sensor with the connection pad on the board.Type: ApplicationFiled: May 9, 2002Publication date: November 13, 2003Inventors: David S. Hanson, Richard S. Anderson, Thomas F. Marinis, Joseph W. Soucy
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Publication number: 20030038415Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.Type: ApplicationFiled: May 9, 2002Publication date: February 27, 2003Inventors: Richard S. Anderson, David S. Hanson, Frederick J. Kasparian, Thomas F. Marinis, Joseph W. Soucy
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Publication number: 20020115263Abstract: A method of processing a substrate includes depositing a glass bonding layer on a first surface of one of either a substrate or a handle wafer, positioning the handle wafer in contact with the substrate via the bonding layer, and heating the substrate, bonding layer, and handle wafer at a temperature below about 425° C. to bond the handle wafer to the substrate. The bonding layer adjoining the substrate and handle wafer is formed of a non-silicate glass that is substantially unsusceptible to outgassing in ultrahigh vacuum environments and is impervious to substantial chemical and structural degradation during thermal processing at temperatures at least up to about 500° C.Type: ApplicationFiled: October 24, 2001Publication date: August 22, 2002Inventors: Thomas Michael Worth, William L. Robbins, Thomas F. Marinis, Mark J. Mescher
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Patent number: 6318621Abstract: A chip carrier and lid are sealed by mounting the chip carrier in an inverted position and mounting a lid having a sealing preform in an inverted position beneath and facing the chip carrier. The chip carrier and lid are then heated to melt the sealing preform and the chip carrier and lid are moved together to join them at the sealing preform.Type: GrantFiled: May 31, 2001Date of Patent: November 20, 2001Assignee: The Charles Stark Draper Laboratory, Inc.Inventors: Thomas F. Marinis, Cathy McEleney, Gregory M. Romano