Patents by Inventor Thomas Fay-Oy Lim

Thomas Fay-Oy Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080105374
    Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.
    Type: Application
    Filed: January 18, 2006
    Publication date: May 8, 2008
    Applicant: HENKEL CORPORATION
    Inventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Matthias E. Liistro, Douglas N. Horner
  • Patent number: 7294665
    Abstract: Moisture curable compositions that include alkoxysilyl capped polymer compounds and alkylsilyl capped plasticizers adhesively cure to polyolefin substrates, including polyethylene and polyolefin substrates. The compositions are curable at room temperature or at temperatures greater than room temperature. The compositions further include an adhesion promoter, a filler or a moisture curing catalyst.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: November 13, 2007
    Assignee: Henkel Corporation
    Inventor: Thomas Fay-Oy Lim
  • Patent number: 7009022
    Abstract: Flexible, moisture curing ABA triblock copolymers are prepared from poly(alkylene oxide) diols as the B segment and polyester diols as the A block. This backbone is end-capped with siloxy end groups to obtain RTV moisture curing triblocks having high strength and flexibility.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: March 7, 2006
    Assignee: Henkel Corporation
    Inventors: Debora E. Duch, Steven T. Nakos, Thomas Fay-Oy Lim
  • Patent number: 6627672
    Abstract: This invention relates to a dual curing silicone composition with an enhanced depth of cure. This composition incorporates an acylphosphine oxide or diacylphosphine oxide, the compatibility of which with the silicone is promoted through the use of a polar carrier. The composition may also include a second photoinitiator that is different than the acylphosphine oxide.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: September 30, 2003
    Assignee: Henkel Loctite Corporation
    Inventors: Chiu-Sing Lin, Thomas Fay-Oy Lim, Richard Oliver Angus, Jr.