Abstract: A method for forming a heat spreading apparatus for semiconductor devices is disclosed. The method includes extruding a frame material to form multiple individual cells including fillable openings within the frame material; filling a first group of the individual cells with one or more high thermal conductivity materials; filling at least a second group of the individual cells with one or more materials of lower thermal conductivity than in the first group of the individual cells; and implementing a reflowing process following filling the multiple individual cells so as to infiltrate the materials within the individual cells, wherein defined walls of the frame material remain following the reflowing.

Abstract: A three-dimensional architecture chip includes a base chip including a unit integrated thereon and configured to perform electrical signal operations. An active layer is separately fabricated from the base layer. The active layer includes a component to service the unit of the base chip. The active layer is bonded to the base chip such that the component is aligned in vertical proximity of the unit. An electrical connection connects the unit to the component through vertical layers of at least one of the base chip and the active layer.

Abstract: A heat spreading apparatus for use in cooling of semiconductor devices includes a frame having a plurality of individual cells formed therein, each of the cells configured for filling with a material of selected thermal conductivity therein. The selected thermal conductivity of material within a given one of the cells corresponds to a thermal profile of the semiconductor device to be cooled.

Abstract: A heat spreading apparatus for use in cooling of semiconductor devices includes a frame having a plurality of individual cells formed therein, each of the cells configured for filling with a material of selected thermal conductivity therein. The selected thermal conductivity of material within a given one of the cells corresponds to a thermal profile of the semiconductor device to be cooled.

Abstract: A pneumatic radial tire has at least one carcass reinforcing ply and a pair of opposing bead portions. Each bead portion has a bead core and a bead apex, while the carcass reinforcing ply has a main portion and two turnups, with one turnup extending from each end of the main portion and having a terminal end. In each bead portion, there is a minimum distance DMIN between the carcass main portion and the carcass turnup, as measured perpendicular to the tire equatorial plane EP. The distance DMIN is not less than 50% of the maximum bead core width WB as measured perpendicular to the equatorial plane EP. In each bead portion, radially outward of the minimum distance DMIN, a radially outermost portion of the carcass turnup extends at an angle so the radially outermost portion of the carcass turnup is divergent from the carcass main portion.

Abstract: The present invention provides multiple test structures for performing reliability and qualification tests on MEMS switch devices. A Test structure for contact and gap characteristic measurements is employed having a serpentine layout simulates rows of upper and lower actuation electrodes. A cascaded switch chain test is used to monitor process defects with large sample sizes. A ring oscillator is used to measure switch speed and switch lifetime. A resistor ladder test structure is configured having each resistor in series with a switch to be tested, and having each switch-resistor pair electrically connected in parallel. Serial/parallel test structures are proposed with MEMS switches working in tandem with switches of established technology. A shift register is used to monitor the open and close state of the MEMS switches. Pull-in voltage, drop-out voltage, activation leakage current, and switch lifetime measurements are performed using the shift register.

Abstract: A system for identifying an original copying source of audiovisual content includes a recording device configured for receiving input data thereto, means for embedding the user specific information within the input data, the user specific information indicative of the identity of said recording device, and a data storage device within the recording device. The data storage device is configured to store the input data containing the user specific information embedded therein.

Abstract: A heat spreading apparatus for use in cooling of semiconductor devices includes a frame having a plurality of individual cells formed therein, each of the cells configured for filling with a material of selected thermal conductivity therein. The selected thermal conductivity of material within a given one of the cells corresponds to a thermal profile of the semiconductor device to be cooled.

Abstract: Performing electronic voting by utilizing the ATM network and ATM machines; issuing voter cards to voters; modifying existing ATM software to recognize the voter card; maintaining a voter registration database; and making the voter registration database available to the ATM network. In use, the voter is matched to the database, and to voting options, and is restricted options specified by the database. A voting record, such as record, photo and verification, is stored in the database. A paper receipt is issued to the voter for verification.

Abstract: The invention provides micro-electromechanical switch (MEM) based designs for reducing the power consumption of logic blocks (e.g., latches) by isolating the logic blocks when they are non-operational. A power reduction circuit in accordance with the present invention comprises a logic block and at least one micro-electromechanical (MEM) switch for selectively disabling the logic block. MEM switches are provided for selectively: disconnecting the logic block from power; disconnecting the logic block from ground; providing a bypass line around the logic block; disconnecting an output of the logic block; and/or disconnecting an input of the logic block.

Abstract: Micro-electromechanical switches (MEMS) are configured to form a data storage latch to reduce power consumption, to reduce the space used in an integrated circuit, and to improve performance of the integrated circuit. MEMS are implemented at the wiring layer connected to an integrated circuit and coupled to form a storage latch.

Abstract: A Dual Channel Mode for selecting specific waveform sets or characters in the applied data eliminates round trip delay errors in automatic test equipment. Drive waveforms and data are directed by a compiler to a first channel, while receive waveforms and data are directed to a second channel, eliminating false readings induced by the round-trip delays. The drive and compare waveforms are separated onto the first and second channels of electronics.

Abstract: Disclose is a method that forms non-functional test structures in kerf regions outside functional wiring modules of the ceramic greensheets and across edges of the functional wiring modules, and an associated structure. In order to check or test the spacing and size of wires in functional wiring modules, the invention only needs to examine the non-functional test structures as exposed by cutting the multi-module greensheet along the laminate trim line or by dicing of the greensheet into individual modules. The non-functional wires have the same design spacing, size, and angles as wires in the functional wiring modules. Therefore, the non-functional test structures comprise representative wires of wires in the functional wiring modules.