Abstract: A laminated busbar for interconnecting electrical storage devices, comprising an insulating layer and at least one conductive band arranged on the insulating layer, the at least one conductive band comprising a succession of repeating conductor patterns, each conductor pattern defining a cluster having a first terminal and a second terminal for connection to an energy storage device. The laminated busbar also comprises a first terminator coupled to the first terminal and a second terminator coupled to the second terminal, the first and second terminators configured to connect to terminals of the energy storage device.

Abstract: In a module from an electrical battery, a laminated busbar interconnects prismatic electrical cells that are configured to be arranged in cell groups of the same number of cells. The busbar comprises: a first electrically conductive layer, with at least one electrically conducting element, each configured to connect electric poles of two adjacent cell groups, a first electrically insulating layer, laminated on the first conductive layer, a first electrical connector, configured to be connected to a first cell group, a second electrically conductive layer laminated onto the first insulating layer and comprising a second electrical connector to be connected to a last cell group, and a third electrical connector located closer to the first electrical connector than to the second electrical connector. The first insulating layer comprises a cut-out window, configured to allow electrical connection of the second electrical connector with the last cell group.

Abstract: In a module from an electrical battery, a laminated busbar interconnects prismatic electrical cells that are configured to be arranged in cell groups of the same number of cells. The busbar comprises: a first electrically conductive layer, with at least one electrically conducting element, each configured to connect electric poles of two adjacent cell groups, a first electrically insulating layer, laminated on the first conductive layer, a first electrical connector, configured to be connected to a first cell group, a second electrically conductive layer laminated onto the first insulating layer and comprising a second electrical connector to be connected to a last cell group, and a third electrical connector located closer to the first electrical connector than to the second electrical connector. The first insulating layer comprises a cut-out window, configured to allow electrical connection of the second electrical connector with the last cell group.

Abstract: A laminated busbar for interconnecting electrical storage devices, comprising an insulating layer and at least one conductive band arranged on the insulating layer, the at least one conductive band comprising a succession of repeating conductor patterns, each conductor pattern defining a cluster having a first terminal and a second terminal for connection to an energy storage device. The laminated busbar also comprises a first terminator coupled to the first terminal and a second terminator coupled to the second terminal, the first and second terminators configured to connect to terminals of the energy storage device.

Abstract: The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsulated in a polyorganosiloxane resin (3), which is the result of hardening a composition comprising at least: one portion (A) comprising at least one polyorganosiloxane (A1) which contains at least two —CH?CH2 reactive groups per molecule; one portion (B) comprising a polyorganosiloxane (B1) which comprises at least two Si—H groups per molecule; and at least one hydrosilation catalyst (C1), the components (A1) and (B1) being in quantities such that the molar ratio of Si—H/—CH?CH2 in the composition is no lower than 0.4.

Abstract: The invention relates to an electronic component (1) comprising at least one semiconductor chip (4) and at least one substrate (6), the semiconductor chip (4) being encapsultated in a polyorganosiloxine resin (3), which is the result of hardening a composition comprising at least: one portion (A) comprising at least one polyorganosiloxane (A1) which contains at least two —CH?CH2 reactive groups per molecule; one portion (B) comprising polyorganosiloxane (B1) which comprises at least two Si—H groups per molecule; and at least one hydrosylation catalyst (C1), the component (A1) and (B1) being in quantities such that the molar ratio of Si—H/—CH?CH2 in the composition is no lower than 0.4.