Abstract: A method and apparatus for injection molding several different parts in a reconfigurable mold is disclosed. The mold machine (10) includes a first mold body (14) attached to a machine frame (12) and second and third mold bodies (16, 18) that are movable with respect to the first mold body (14). A mold frame controller (100) is interconnected to and controls three linear actuators (56, 66, 88) that are arranged to move the three mold bodies into different configurations. Each mold body has mold cavities (24, 44, 46, 80) that can be aligned with mold cavities in the other mold bodies to form different combinations for forming a variety of different parts.

Abstract: Salt compositions and baths thereof useful in, and methods for, immersion plating of tin and tin-lead alloys which give greatly increased deposition rates and thicker coatings of better quality accomplished by incorporating into immersion plating tin bath compositions soluble plumbous salts in the amount of from 0.5 grams per liter calculated on the basis of elemental lead to the maximum amount soluble in the bath and a sulphur-containing complexing agent for the tin and lead such as thiourea or a thiourea-type derivative. Preferably the salt elements are stannous chloride, lead chloride, sodium hypophosphite (as a solubility enhancer) and with hydrochloric acid used as a agent for adjusting the pH in the resulting bath from 0.5 to 1.0.

Abstract: Palladium is electrodeposited from an aqueous bath comprising Pd (NH.sub.3).sub.2 (NO.sub.2).sub.2 and tetrapotassium pyrophosphate at a pH of 8.5-11. Such a composition permits higher efficiencies to be obtained.

Abstract: Disclosed are methods and electrolytes for the electrodeposition of a gold alloy containing 0.05 to 0.4 per cent by weight of cobalt. The electrolytes comprise aqueous acidic solutions containing nitrilotriacetic acid.

Abstract: A method for electroplating tin-lead compositions, a bath for electroplating of tin-lead alloys and stable, solid salt compositions for make up of a bath for plating the tin-lead alloys, said bath contains, besides the two metals, thiourea, potassium, hypophosphite and hydrochloric acid with the pH of the bath being from 0.5 to 1.5.

Abstract: A method and electrolyte for electrodepositing a corrosion -- resistant, soft and ductile tin -- nickel alloy. A typical electrolyte is an aqueous solution of tin salts, nickel salts, thiourea, sodium hypophosphite, hydrochloric acid, and ammonium chloride and has a pH of 0.7 to 1.5.

Abstract: A process, an electrolyte for electrodepositing tin-lead alloys from an aqueous bath, and a salt composition as a solid material adapted for mixing with aqueous solution to effect plating of tin-lead alloys from an electrolyzed bath solution; the bath used is an aqueous solution comprising tin metal salt, such as in the form of stannous pyrophosphate, potassium pyrophosphate, sodium potassium tartrate, and lead as lead pyrophosphate, lead chloride, lead tartrate, or lead acetate; the pH of the bath is from 8.0-9.0 and up to 10.0 and the operating temperature is from 75 to 150.degree.F, the bath is operated with agitation and the anodes are preferably solid tin-lead anodes.