Patents by Inventor Thomas G. Bensing

Thomas G. Bensing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High temperature ceramic die package and DUT board socket
    Patent number: 7598760
    Abstract: A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one “well” location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: October 6, 2009
    Assignee: Qualitau, Inc.
    Inventors: Thomas G. Bensing, Adalberto M. Ramirez, Jens Ullmann, Jacob Herschmann, Robert J. Sylvia, Maurice C. Evans