Abstract: A structural frame - window pane assembly includes a single-piece frame member shaped and dimensioned to receive and enclose the periphery of the window pane, and a window pane retained within the frame by a pair of spaced inwardly projecting resiliently deformable flanges formed integrally on the inner periphery of the frame member to receive and sealingly engage the edges of the pane. An elongate slot is provided in the frame through which the pane is inserted.

Abstract: In the step of plastic encapsulation of a semiconductive device, the inner ends of a group of leads comprising part of a lead frame, the semiconductive chip and the connections between the chip and the inner ends of the leads, are put into a cavity of a mold and fluid encapsulating material is forced into the cavity to surround the elements that are in the cavity with encapsulating material. A lead frame, which may be supplied in strip form, is provided, a part of which is so formed as to act as a gate for the admission of fluid encapsulating material into the mold cavity.

Abstract: In the step of plastic encapsulation of a semiconductive device, the inner ends of a group of leads comprising part of a lead frame, the semiconductive chip and the connections between the chip and the inner ends of the leads, are put into a cavity of a mold and fluid encapsulating material is forced into the cavity to surround the elements that are in the cavity with encapsulating material. A lead frame, which may be supplied in strip form, is provided, a part of which is so formed as to act as a gate for the admission of fluid encapsulating material into the mold cavity.